IPC 9501 : 0
Current
The latest, up-to-date edition.
PWB ASSEMBLY PROCESS SIMULATION FOR EVALUATION OF ELECTRONIC COMPONENTS (PRECONDITIONING IC COMPONENTS)
Hardcopy
English
01-07-1995
1.0 SCOPE
2.0 APPLICABLE DOCUMENTS
2.1 Institute for Interconnecting and Packaging
Electronic Circuits (IPC)
2.2 Joint Industry Standards
2.3 Electronic Industries Association
2.4 Military
3.0 TERMS AND DEFINITIONS
4.0 APPLICATIONS AND OBJECTIVES
5.0 APPARATUS
6.0 REQUIREMENTS
7.0 RECOMMENDATIONS
8.0 COMPONENT CLASSIFICATION
9.0 COMPONENT PROCESS PRECONDITIONING PROCEDURES
9.1 Moisture Preconditioning
9.2 Component Mounting
9.3 First Soldering Process Exposure
9.4 Aliphatic or Terpene Hydrocarbon Cleaning
9.5 Second Soldering Process Exposure
9.6 Water Soluble Flux Exposure
9.7 Third Soldering Process Exposure
9.8 Aqueous Detergent/DI Water Total Immersion Cleaning
10.1 Moisture Exposure
10.2 Component Mounting
10.3 Soldering Process Exposure
10.4 Chemical Exposure
10.5 Criteria
11.0 SOLDERING PROCESS COMPATIBILITY MATRIX
Specifies manufacturing process simulations for use with applicable component specifications to assure that electronic components can meet expected reliability requirements after exposure to assembly factory processes.
| DocumentType |
Standard
|
| Pages |
79
|
| PublisherName |
Institute of Printed Circuits
|
| Status |
Current
|
| IPC 9702 : 0 | MONOTONIC BEND CHARACTERIZATION OF BOARD-LEVEL INTERCONNECTS |
| EN 61189-5-1:2016 | Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-1: General test methods for materials and assemblies - Guidance for printed board assemblies |
| IPC 9500 : 2003 | ASSEMBLY PROCESS COMPONENT SIMULATIONS, GUIDELINES & CLASSIFICATIONS PACKAGE |
| IPC 9504 : 0 | ASSEMBLY PROCESS SIMULATION FOR EVALUATION OF NON-IC COMPONENTS (PRECONDITIONING NON-IC COMPONENTS) |
| IPC 9502 : 0 | PWB ASSEMBLY SOLDERING PROCESS GUIDELINE FOR ELECTRONIC COMPONENTS |
| IPC SM 786 : A1995 | PROCEDURES FOR CHARACTERIZING AND HANDLING OF MOISTURE/REFLOW SENSITIVE ICs |
| BS EN 61189-5-1:2016 | Test methods for electrical materials, printed boards and other interconnection structures and assemblies General test methods for materials and assemblies. Guidance for printed board assemblies |
| IPC 9702 CHINESE : - | MONOTONIC BEND CHARACTERIZATION OF BOARD-LEVEL INTERCONNECTS |
| IPC 9701 : A | PERFORMANCE TEST METHODS AND QUALIFICATION REQUIREMENTS FOR SURFACE MOUNT SOLDER ATTACHMENTS |
| IPC M 109 : LATEST | COMPONENTS HANDLING MANUAL |
| IEC 61189-5-1:2016 | Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-1: General test methods for materials and assemblies - Guidance for printed board assemblies |
| IPC 9701 CHINESE : A | PERFORMANCE TEST METHODS AND QUALIFICATION REQUIREMENTS FOR SURFACE MOUNT SOLDER ATTACHMENTS |
| IPC 9503 : 0 | MOISTURE SENSITIVITY CLASSIFICATION FOR NON-IC COMPONENTS |
| IPC J STD 001 : F | REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES |
| IPC M 109 : LATEST | COMPONENTS HANDLING MANUAL |
| IPC HDBK 001 : E | HANDBOOK AND GUIDE TO SUPPLEMENT J-STD-001 |
| IPC J STD 033C-1:2014 | HANDLING, PACKING, SHIPPING AND USE OF MOISTURE, REFLOW, AND PROCESS SENSITIVE DEVICES |
| IPC 9504 : 0 | ASSEMBLY PROCESS SIMULATION FOR EVALUATION OF NON-IC COMPONENTS (PRECONDITIONING NON-IC COMPONENTS) |
| IPC 9502 : 0 | PWB ASSEMBLY SOLDERING PROCESS GUIDELINE FOR ELECTRONIC COMPONENTS |
| IPC 9701 : A | PERFORMANCE TEST METHODS AND QUALIFICATION REQUIREMENTS FOR SURFACE MOUNT SOLDER ATTACHMENTS |
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