NF EN 60749-30 : 2005 AMD 1 2011
Superseded
A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.
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SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 30: PRECONDITIONING OF NON-HERMETIC SURFACE MOUNT DEVICES PRIOR TO RELIABILITY TESTING
01-11-2021
12-01-2013
1 Scope
2 Normative references
3 General description
4 Test apparatus and materials
4.1 Moisture chamber
4.2 Solder equipment
4.3 Optical microscope
4.4 Electrical test equipment
4.5 Drying (bake) oven
4.6 Temperature cycle chamber (optional)
5 Procedure
5.1 General
5.2 Initial measurements
5.3 Temperature cycling (optional)
5.4 Drying (bake out)
5.5 Soak conditions for dry-packed SMDs
5.6 Method C for soak conditions for
non-dry-packed SMDs in accordance with
IEC 60749-20
5.7 Solder reflow
5.8 Flux application simulation (optional)
5.9 Final measurements
5.10 Applicable reliability tests
6 Summary
Annex ZA (normative) Normative references to international
publications with their corresponding
European publications
Defines a standard procedure for determining the preconditioning of non-hermetic surface mount devices (SMDs) prior to reliability testing.
| DevelopmentNote |
Indice de classement: C96-022-30 PR NF EN 60749-30 March 2004 (03/2004)
|
| DocumentType |
Standard
|
| PublisherName |
Association Francaise de Normalisation
|
| Status |
Superseded
|
| SupersededBy |
| Standards | Relationship |
| DIN EN 60749-30:2011-12 | Identical |
| IEC 60749-30:2005+AMD1:2011 CSV | Identical |
| NBN EN 60749-30 : 2006 AMD 1 2011 | Identical |
| I.S. EN 60749-30:2005 | Identical |
| UNE-EN 60749-30:2005 | Identical |
| BS EN 60749-30 : 2005 | Identical |
| EN 60749-30 : 2005 AMD 1 2011 | Identical |
| IEC 60749-20:2008 | Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat |
| NF EN 60749-11 : 2002 | SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 11: RAPID CHANGE OF TEMPERATURE - TWO-FLUID-BATH METHOD |
| IEC 60749-25:2003 | Semiconductor devices - Mechanical and climatic test methods - Part 25: Temperature cycling |
| NF EN 60749-5 : 2003 | SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 5: STEADY-STATE TEMPERATURE HUMIDITY BIAS LIFE TEST |
| IEC 60749-5:2017 | Semiconductor devices - Mechanical and climatic test methods - Part 5: Steady-state temperature humidity bias life test |
| IEC 60749-4:2017 | Semiconductor devices - Mechanical and climatic test methods - Part 4: Damp heat, steady state, highly accelerated stress test (HAST) |
| NF EN 60749-4 : 2002 | SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 4: DAMP HEAT, STEADY STATE, HIGHLY ACCELERATED STRESS TEST (HAST) |
| IEC 60749-11:2002 | Semiconductor devices - Mechanical and climatic test methods - Part 11: Rapid change of temperature - Two-fluid-bath method |
| IEC 60749-33:2004 | Semiconductor devices - Mechanical and climatic test methods - Part 33: Accelerated moisture resistance - Unbiased autoclave |
| IEC 60749-24:2004 | Semiconductor devices - Mechanical and climatic test methods - Part 24: Accelerated moisture resistance - Unbiased HAST |
| NF EN 60749-33 : 2005 | SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 33: ACCELERATED MOISTURE RESISTANCE - UNBIASED AUTOCLAVE |
| NF EN 60749-24 : 2005 | SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 24: ACCELERATED MOISTURE RESISTANCE - UNBIASED HAST |
| NF EN 60749-20 : 2010 | SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 20: RESISTANCE OF PLASTIC ENCAPSULATED SMDS TO THE COMBINED EFFECT OF MOISTURE AND SOLDERING HEAT |
| NF EN 60749-25 : 2003 | SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 25: TEMPERATURE CYCLING |
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