SEMI E37 : 2013
Current
Current
The latest, up-to-date edition.
HIGH-SPEED SECS MESSAGE SERVICES (HSMS) GENERIC SERVICES
Published date
12-01-2013
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Specifies a means for independent manufacturers to produce implementations which can be connected and interoperate without requiring specific knowledge of one another.
| DevelopmentNote |
Not available for sale from ILI, customer to contact SEMI. (08/2005) Includes SEMI E37.1. (06/2008)
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| DocumentType |
Standard
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| PublisherName |
Semiconductor Equipment & Materials Institute
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| Status |
Current
|
| SEMI E30 : 2018 | SPECIFICATION FOR THE GENERIC MODEL FOR COMMUNICATIONS AND CONTROL OF MANUFACTURING EQUIPMENT (GEM) |
| SEMI E173 : 2015 | SPECIFICATION FOR XML SECS-2 MESSAGE NOTATION (SMN) |
| SEMI E38 : 1996 | CLUSTER TOOL MODULE COMMUNICATIONS (CTMC) |
| SEMI E169 : 2015 | GUIDE FOR EQUIPMENT INFORMATION SYSTEM SECURITY |
| SEMI E82 : 2006(R2018) | SPECIFICATION FOR INTERBAY/INTRABAY AMHS SEM (IBSEM) |
| SEMI E130.1 : 2004(R2010) | SPECIFICATION FOR PROBER SPECIFIC EQUIPMENT MODEL FOR 300 MM ENVIRONMENT (PSEM300) |
| SEMI E160 : 2011(R2017) | SPECIFICATION FOR COMMUNICATION OF DATA QUALITY |
| SEMI E104 : 2003 | SPECIFICATION FOR INTEGRATION AND GUIDELINE FOR CALIBRATION OF LOW-PRESSURE PARTICLE MONITOR |
| SEMI D27 : 2000 | GUIDE FOR FLAT PANEL DISPLAY EQUIPMENT COMMUNICATION INTERFACES |
| SEMI E123 : 2017 | SPECIFICATION FOR HANDLER EQUIPMENT SPECIFIC EQUIPMENT MODEL (HSEM) |
| SEMI E139.2 : 2008 | SECS-2 PROTOCOL FOR RECIPE AND PARAMETER MANAGEMENT (RAP) |
| SEMI PV2 : 2009E | GUIDE FOR PV EQUIPMENT COMMUNICATION INTERFACES (PVECI) |
| SEMI E5 : 2017 | SPECIFICATION FOR SEMI EQUIPMENT COMMUNICATIONS STANDARD 2 MESSAGE CONTENT (SECS-2) |
| SEMI E123.1 : 2003(R2009) | SPECIFICATION FOR SECS-2 PROTOCOL FOR HANDLER SPECIFIC EQUIPMENT MODEL (HSEM) |
| SEMI E88 : 2007(R2018) | SPECIFICATION FOR AMHS STORAGE SEM (STOCKER SEM) |
| SEMI M49 : 2016 | GUIDE FOR SPECIFYING GEOMETRY MEASUREMENT SYSTEMS FOR SILICON WAFERS FOR THE 130 NM TO 16 NM TECHNOLOGY GENERATIONS |
| SEMI HB4 : 2013 | SPECIFICATION OF COMMUNICATION INTERFACES FOR HIGH BRIGHTNESS LED MANUFACTURING EQUIPMENT (HB-LED ECI) |
| SEMI M52 : 2014 | GUIDE FOR SPECIFYING SCANNING SURFACE INSPECTION SYSTEMS FOR SILICON WAFERS FOR THE 130 NM TO 11 NM TECHNOLOGY GENERATIONS |
| SEMI E122 : 2017 | SPECIFICATION FOR TESTER EQUIPMENT SPECIFIC EQUIPMENT MODEL (TSEM) |
| SEMI E30.1 : 2017 | SPECIFICATION FOR INSPECTION AND REVIEW SPECIFIC EQUIPMENT MODEL (ISEM) |
| SEMI E153 : 2010(R2017) | SPECIFICATION FOR AMHS SEM (AMHS SEM) |
| SEMI E30.2 : 1998 | HANDLER EQUIPMENT SPECIFIC EQUIPMENT MODEL (HSEM) |
| SEMI E4 : 1999(R2007) | SEMI EQUIPMENT COMMUNICATIONS STANDARD 1 MESSAGE TRANSFER (SECS-1) |
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