SEMI M45 : 2010(R2017)
Current
Current
The latest, up-to-date edition.
SPECIFICATION FOR 300 MM WAFER SHIPPING SYSTEM
Published date
12-01-2013
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Specifies materials relating to transport of 300 mm wafers using Shipping Boxes (FOSB) regulated by SEMI M31, and includes wafer shipping boxes, bags, labels, cushions, secondary containers, pallets, and shipping documentation.
| DevelopmentNote |
Not available for sale from ILI, customer to contact SEMI. (05/2001)
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| DocumentType |
Standard
|
| PublisherName |
Semiconductor Equipment & Materials Institute
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| Status |
Current
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| SEMI M8 : 2012 | SPECIFICATION FOR POLISHED MONOCRYSTALLINE SILICON TEST WAFERS |
| SEMI M38 : 2012(R2018) | SPECIFICATION FOR POLISHED RECLAIMED SILICON WAFERS |
| SEMI T3 : 2013 | SPECIFICATION FOR WAFER BOX LABELS |
| SEMI M24 : 2007 | SPECIFICATION FOR POLISHED MONOCRYSTALLINE SILICON PREMIUM WAFERS |
| SEMI 3D10 : 2014 | GUIDE TO DESCRIBING MATERIALS PROPERTIES FOR INTERMEDIATE WAFERS FOR USE IN A 300 MM 3DS-IC WAFER STACK |
| SEMI M1 : 2017 | SPECIFICATION FOR POLISHED SINGLE CRYSTAL SILICON WAFERS |
| SEMI 3D9 : 2014 | GUIDE FOR DESCRIBING MATERIALS PROPERTIES FOR A 300 MM 3DS-IC WAFER STACK |
| SEMI 3D16 : 2016 | SPECIFICATION FOR GLASS BASE MATERIAL FOR SEMICONDUCTOR PACKAGING |
| SEMI 3D8 : 2014 | GUIDE FOR DESCRIBING SILICON WAFERS FOR USE AS 300 MM CARRIER WAFERS IN A 3DS-IC TEMPORARY BOND-DEBOND (TBDB) PROCESS |
| SEMI M62 : 2017 | SPECIFICATIONS FOR SILICON EPITAXIAL WAFERS |
| SEMI M31 : 2008 | MECHANICAL SPECIFICATION FOR FRONT-OPENING SHIPPING BOX USED TO TRANSPORT AND SHIP 300 MM WAFERS |
| SEMI 3D2 : 2016 | SPECIFICATION FOR GLASS CARRIER WAFERS FOR 3DS-IC APPLICATIONS |
| SEMI M57 : 2016 | SPECIFICATION FOR SILICON ANNEALED WAFERS |
| SEMI M26 : 2004(R2010) | GUIDE FOR THE RE-USE OF 100, 125, 150, AND 200 MM WAFER SHIPPING BOXES USED TO TRANSPORT WAFERS |
| SEMI T3 : 2013 | SPECIFICATION FOR WAFER BOX LABELS |
| SEMI M31 : 2008 | MECHANICAL SPECIFICATION FOR FRONT-OPENING SHIPPING BOX USED TO TRANSPORT AND SHIP 300 MM WAFERS |
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