BS EN 140401-803 : 2007
Current
The latest, up-to-date edition.
DETAIL SPECIFICATION: FIXED LOW POWER FILM SMD RESISTORS - CYLINDRICAL - STABILITY CLASSES 0,05; 0,1; 0,25; 0,5; 1; 2
Hardcopy , PDF
English
01-01-2007
1 Characteristics and ratings
2 Quality assessment procedures
Annex A (normative) - Fixed sample size Qualification
Approval and Quality Conformance Inspection
test schedule for fixed low power surface
mount (SMD) resistors
Annex B (informative) - Letter symbols and abbreviations
Bibliography
Specifies various parameters of electronic components of assessed quality in accordance with: EN 60115-1:2001 + A1:2001, EN 140400:2003 and EN 140401:2002.
Committee |
EPL/40X
|
DevelopmentNote |
Supersedes 02/203116 DC. (08/2002) Supersedes 06/30155905 DC. (11/2007) Supersedes 10/30218864 DC. (12/2010) Supersedes 12/30270565 DC. (07/2013) 2007 Edition Re-Issued in July 2017 & incorporates AMD 3 2017. (07/2017)
|
DocumentType |
Standard
|
Pages |
40
|
PublisherName |
British Standards Institution
|
Status |
Current
|
Supersedes |
Standards | Relationship |
DIN EN 140401-803:2013-12 | Identical |
I.S. EN 140401-803:2007 | Identical |
NF EN 140401-803 : 2008 AMD 3 2017 | Identical |
NEN EN 140401-803 : 2007 AMD 3 2017 | Identical |
NBN EN 140401-803 : 2007 AMD 2 2013 | Identical |
EN 140401-803 : 2007 AMD 3 2017 | Identical |
IEC 61193-2:2007 | Quality assessment systems - Part 2: Selection and use of sampling plans for inspection of electronic components and packages |
EN 60286-6:2004 | Packaging of components for automatic handling - Part 6: Bulk case packaging for surface mounting components |
IEC 60068-2-58:2015+AMD1:2017 CSV | Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD) |
IEC 60068-2-20:2008 | Environmental testing - Part 2-20: Tests - Test T: Test methods for solderability and resistance to soldering heat of devices with leads |
EN 60068-2-20:2008 | Environmental testing - Part 2-20: Tests - Test T: Test methods for solderability and resistance to soldering heat of devices with leads |
CECC 240001 : 1996 | FIXED LOW POWER FILM RESISTORS (LEADED/UNLEADED) |
EN 60068-2-1:2007 | Environmental testing - Part 2-1: Tests - Test A: Cold |
IECQ 001002-3:2005 | IEC QUALITY ASSESSMENT SYSTEM FOR ELECTRONIC COMPONENTS (IECQ) - RULES OF PROCEDURE - PART 3: APPROVAL PROCEDURES |
EN 60068-2-2:2007 | Environmental testing - Part 2-2: Tests - Test B: Dry heat |
IEC 60068-2-21:2006 | Environmental testing - Part 2-21: Tests - Test U: Robustness of terminations and integral mounting devices |
IEC 60068-2-13:1983 | Basic environmental testing procedures - Part 2-13: Tests - Test M: Low air pressure |
EN 61760-1:2006 | SURFACE MOUNTING TECHNOLOGY - PART 1: STANDARD METHOD FOR THE SPECIFICATION OF SURFACE MOUNTING COMPONENTS (SMDS) |
IEC 60286-6:2004 | Packaging of components for automatic handling - Part 6: Bulk case packaging for surface mounting components |
IEC 61760-1:2006 | Surface mounting technology - Part 1: Standard method for the specification of surface mounting components (SMDs) |
EN 60027-1:2006/A2:2007 | LETTER SYMBOLS TO BE USED IN ELECTRICAL TECHNOLOGY - PART 1: GENERAL |
EN 140401:2009 | Blank Detail Specification: Fixed low power film surface mount (SMD) resistors |
IEC 60027-1:1992 | Letters symbols to be used in electrical technology - Part 1: General |
EN 140400:2003 | Sectional specification: Fixed low power surface mount (SMD) resistors |
IEC 60410:1973 | Sampling plans and procedures for inspection by attributes |
EN 60286-3:2013/AC:2013 | PACKAGING OF COMPONENTS FOR AUTOMATIC HANDLING - PART 3: PACKAGING OF SURFACE MOUNT COMPONENTS ON CONTINUOUS TAPES (IEC 60286-3:2013) |
EN 61193-2 : 2007 | QUALITY ASSESSMENT SYSTEMS - PART 2: SELECTION AND USE OF SAMPLING PLANS FOR INSPECTION OF ELECTRONIC COMPONENTS AND PACKAGES |
EN 60068-2-21:2006 | Environmental testing - Part 2-21: Tests - Test U: Robustness of terminations and integral mounting devices |
IEC 60068-2-2:2007 | Environmental testing - Part 2-2: Tests - Test B: Dry heat |
EN 60115-1:2011/A11:2015 | FIXED RESISTORS FOR USE IN ELECTRONIC EQUIPMENT - PART 1: GENERIC SPECIFICATION |
IEC TR 60440:1973 | Method of measurement of non-linearity in resistors |
EN 61340-3-1:2007 | Electrostatics - Part 3-1: Methods for simulation of electrostatic effects - Human body model (HBM) electrostatic discharge test waveforms |
IEC 60062:2016 | Marking codes for resistors and capacitors |
EN 60062:2016/AC:2016-12 | MARKING CODES FOR RESISTORS AND CAPACITORS (IEC 60062:2016/COR1:2016) |
IEC 61340-3-1:2006 | Electrostatics - Part 3-1: Methods for simulation of electrostatic effects - Human body model (HBM) electrostatic discharge test waveforms |
EN 60068-2-78:2013 | Environmental testing - Part 2-78: Tests - Test Cab: Damp heat, steady state |
EN 60068-2-13:1999 | Environmental testing - Part 2: Tests - Test M: Low air pressure |
EN 60068-2-6:2008 | Environmental testing - Part 2-6: Tests - Test Fc: Vibration (sinusoidal) |
IEC 60063:2015 | Preferred number series for resistors and capacitors |
IEC 60286-3:2013 | Packaging of components for automatic handling - Part 3: Packaging of surface mount components on continuous tapes |
IEC 60068-2-1:2007 | Environmental testing - Part 2-1: Tests - Test A: Cold |
EN 60068-2-30:2005 | Environmental testing - Part 2-30: Tests - Test Db: Damp heat, cyclic (12 h + 12 h cycle) |
EN 60695-11-5:2017 | Fire hazard testing - Part 11-5: Test flames - Needle-flame test method - Apparatus, confirmatory test arrangement and guidance |
IEC 60695-11-5:2016 | Fire hazard testing - Part 11-5: Test flames - Needle-flame test method - Apparatus, confirmatory test arrangement and guidance |
IEC 60068-2-14:2009 | Environmental testing - Part 2-14: Tests - Test N: Change of temperature |
EN 60068-2-45:1992/A1:1993 | Environmental testing - Part 2: Tests - Test Xa and guidance: Immersion in cleaning solvents |
EN 60068-2-14:2009 | Environmental testing - Part 2-14: Tests - Test N: Change of temperature |
IEC 60115-1:2008 | Fixed resistors for use in electronic equipment - Part 1: Generic specification |
IEC 60195:2016 | Method of measurement of current noise generated in fixed resistors |
IEC 60068-2-30:2005 | Environmental testing - Part 2-30: Tests - Test Db: Damp heat, cyclic (12 h + 12 h cycle) |
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