BS EN 61190-1-1:2002
Current
The latest, up-to-date edition.
Attachment materials for electronic assembly Requirements for soldering fluxes for high-quality interconnections in electronics assembly
Hardcopy , PDF
English
16-08-2002
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1 Scope and object
2 Normative references
3 Terms and definitions
4 Requirements
4.1 Conflict
4.2 Flux classification and testing
5 Quality assurance provisions
5.1 Responsibility for inspection
5.2 Classification of inspections
5.3 Materials inspection
5.4 Quality inspection
5.5 Performance inspection
5.6 Quality conformance
5.7 Preparation of fluxes for testing
6 Preparation for delivery
6.1 Preservation-packing and packaging
7 Additional information
7.1 Flux activity
7.2 Flux and cleaning relationship
7.3 Ordering data
Annex A (normative)
Annex ZA (normative) Normative references to international
publications with their corresponding European
publications
Bibliography
Figures
Tables
Describes general requirements for the classifications and testing of soldering fluxes for high-quality interconnections in electronics assembly.
| Committee |
EPL/501
|
| DevelopmentNote |
Supersedes 98/231473 DC (09/2002)
|
| DocumentType |
Standard
|
| Pages |
26
|
| PublisherName |
British Standards Institution
|
| Status |
Current
|
| Supersedes |
Specifies general requirements for the classification and testing of soldering fluxes for high-quality interconnections in electronics assembly. This standard is a flux characterization, quality control, and procurement document for solder flux and flux containing material in electronics assembly technology.
| Standards | Relationship |
| NF EN 61190-1-1 : 2002 | Identical |
| DIN EN 61190-1-1:2003-01 | Identical |
| I.S. EN 61190-1-1:2002 | Identical |
| EN 61190-1-1:2002 | Identical |
| IEC 61190-1-1:2002 | Identical |
| IEC 61190-1-2:2014 | Attachment materials for electronic assembly - Part 1-2: Requirements for soldering pastes for high-quality interconnects in electronics assembly |
| ISO 9454-2:1998 | Soft soldering fluxes Classification and requirements Part 2: Performance requirements |
| EN ISO 9002:1994/AC:1997 | QUALITY SYSTEMS - SPECIFICATION FOR PRODUCTION AND INSTALLATION |
| ISO 9454-1:2016 | Soft soldering fluxes Classification and requirements Part 1: Classification, labelling and packaging |
| IEC 61189-6:2006 | Test methods for electrical materials, interconnection structures and assemblies - Part 6: Test methods for materials used in manufacturing electronic assemblies |
| ISO 9002:1994 | Quality systems — Model for quality assurance in production, installation and servicing |
| EN 61189-3:2008 | Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3: Test methods for interconnection structures (printed boards) |
| IEC 61189-5:2006 | Test methods for electrical materials, interconnection structures and assemblies - Part 5: Test methods for printed board assemblies |
| EN ISO 9455-16:2013 | Soft soldering fluxes - Test methods - Part 16: Flux efficacy test, wetting balance method (ISO 9455-16:2013) |
| IEC 61189-3:2007 | Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3: Test methods for interconnection structures (printed boards) |
| IEC 61191-1:2013 | Printed board assemblies - Part 1: Generic specification - Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies |
| ISO 9455-16:2013 | Soft soldering fluxes Test methods Part 16: Flux efficacy test, wetting balance method |
| IEC 60194:2015 | Printed board design, manufacture and assembly - Terms and definitions |
| ISO 9001:2015 | Quality management systems — Requirements |
| IEC 61191-2:2017 | Printed board assemblies - Part 2: Sectional specification - Requirements for surface mount soldered assemblies |
| ISO 9453:2014 | Soft solder alloys Chemical compositions and forms |
| IEC 61191-4:2017 | Printed board assemblies - Part 4: Sectional specification - Requirements for terminal soldered assemblies |
| ISO 9000:2015 | Quality management systems — Fundamentals and vocabulary |
| IEC 61189-2:2006 | Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2: Test methods for materials for interconnection structures |
| IEC 61190-1-3:2007+AMD1:2010 CSV | Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications |
| EN 61189-2:2006 | Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2: Test methods for materials for interconnection structures |
| IEC 61191-3:2017 | Printed board assemblies - Part 3: Sectional specification - Requirements for through-hole mount soldered assemblies |
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