CEI EN 60539-1 : 2009
Current
The latest, up-to-date edition.
DIRECTLY HEATED NEGATIVE TEMPERATURE COEFFICIENT THERMISTORS - PART 1: GENERIC SPECIFICATION
Hardcopy , PDF
English
01-01-2009
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FOREWORD
1 Scope
2 Normative references
3 Terms and definitions
4 General items
5 Test and measurement procedures
Annex A (normative) - Interpretation of sampling plans
and procedures as described in IEC 60410:1973
for use within quality assessment systems
Annex B (normative) - Rules for the preparation of detail
specifications for directly heated thermistors for
electronic equipment for use within quality
assessment systems
Annex C (informative) - Typical examples of mountings
for measurements of directly heated thermistors
Annex D (informative) - Reference to IEC 60539-1:2008
Annex Q (normative) - Quality assessment procedures
Bibliography
Annex ZA (normative) - Normative references to international
publications with their corresponding European
publications
Pertains to directly heated negative temperature coefficient thermistors, typically made from transition metal oxide materials with semiconducting properties.
| Committee |
CT 309
|
| DevelopmentNote |
Classificazione CEI 40-43 (02/2003) 2ED 2009 Edition is valid until 01-06-2019. (03/2017)
|
| DocumentType |
Standard
|
| Pages |
52
|
| PublisherName |
Comitato Elettrotecnico Italiano
|
| Status |
Current
|
| Standards | Relationship |
| IEC 60539-1:2016 | Identical |
| EN 60539-1:2016/AC:2017-09 | Identical |
| IEC 61193-2:2007 | Quality assessment systems - Part 2: Selection and use of sampling plans for inspection of electronic components and packages |
| EN 60294:2012 | Measurement of the dimensions of a cylindrical component with axial terminations |
| IEC 60068-1:2013 | Environmental testing - Part 1: General and guidance |
| IEC 60068-2-58:2015+AMD1:2017 CSV | Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD) |
| IEC 60068-2-27:2008 | Environmental testing - Part 2-27: Tests - Test Ea and guidance: Shock |
| IEC 60068-2-20:2008 | Environmental testing - Part 2-20: Tests - Test T: Test methods for solderability and resistance to soldering heat of devices with leads |
| EN 60068-2-20:2008 | Environmental testing - Part 2-20: Tests - Test T: Test methods for solderability and resistance to soldering heat of devices with leads |
| EN 60068-2-1:2007 | Environmental testing - Part 2-1: Tests - Test A: Cold |
| IEC 61249-2-7:2002 | Materials for printed boards and other interconnecting structures - Part 2-7: Reinforced base materials clad and unclad - Epoxide woven E-glass laminated sheet of defined flammability (vertical burning test), copper-clad |
| EN 60068-2-2:2007 | Environmental testing - Part 2-2: Tests - Test B: Dry heat |
| IEC 60068-2-21:2006 | Environmental testing - Part 2-21: Tests - Test U: Robustness of terminations and integral mounting devices |
| EN 60068-1:2014 | Environmental testing - Part 1: General and guidance |
| IEC 60068-2-11:1981 | Basic environmental testing procedures - Part 2-11: Tests - Test Ka: Salt mist |
| IEC 60068-2-31:2008 | Environmental testing - Part 2-31: Tests - Test Ec: Rough handling shocks, primarily for equipment-type specimens |
| EN 61249-2-7:2002/corrigendum:2005 | MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 2-7: REINFORCED BASE MATERIALS CLAD AND UNCLAD - EPOXIDE WOVEN E-GLASS LAMINATED SHEET OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST), COPPER-CLAD |
| EN 60717:2012 | Method for the determination of the space required by capacitors and resistors with unidirectional terminations |
| IEC 60068-2-38:2009 | Environmental testing - Part 2-38: Tests - Test Z/AD: Composite temperature/humidity cyclic test |
| EN 60068-2-27:2009 | Environmental testing - Part 2-27: Tests - Test Ea and guidance: Shock |
| IEC 60294:2012 | Measurement of the dimensions of a cylindrical component with axial terminations |
| IEC 60068-2-54:2006 | Environmental testing - Part 2-54: Tests - Test Ta: Solderability testing of electronic components by the wetting balance method |
| EN 60068-2-38:2009 | Environmental testing - Part 2-38: Tests - Test Z/AD: Composite temperature/humidity cyclic test |
| EN 60068-2-17:1994 | Environmental testing - Part 2: Tests - Test Q: Sealing |
| IEC 60068-2-17:1994 | Basic environmental testing procedures - Part 2-17: Tests - Test Q: Sealing |
| EN 61193-2 : 2007 | QUALITY ASSESSMENT SYSTEMS - PART 2: SELECTION AND USE OF SAMPLING PLANS FOR INSPECTION OF ELECTRONIC COMPONENTS AND PACKAGES |
| EN 60068-2-21:2006 | Environmental testing - Part 2-21: Tests - Test U: Robustness of terminations and integral mounting devices |
| IEC 60068-2-2:2007 | Environmental testing - Part 2-2: Tests - Test B: Dry heat |
| IEC 60062:2016 | Marking codes for resistors and capacitors |
| EN 60062:2016/AC:2016-12 | MARKING CODES FOR RESISTORS AND CAPACITORS (IEC 60062:2016/COR1:2016) |
| EN 60068-2-78:2013 | Environmental testing - Part 2-78: Tests - Test Cab: Damp heat, steady state |
| EN 60068-2-6:2008 | Environmental testing - Part 2-6: Tests - Test Fc: Vibration (sinusoidal) |
| IEC 60717:2012 | Method for the determination of the space required by capacitors and resistors with unidirectional terminations |
| EN 60068-2-11:1999 | Environmental testing - Part 2: Tests - Test Ka: Salt mist |
| EN 60068-2-54:2006 | Environmental testing - Part 2-54: Tests - Test Ta: Solderability testing of electronic components by the wetting balance method |
| IEC 60068-2-1:2007 | Environmental testing - Part 2-1: Tests - Test A: Cold |
| IEC 60068-2-14:2009 | Environmental testing - Part 2-14: Tests - Test N: Change of temperature |
| EN 60068-2-45:1992/A1:1993 | Environmental testing - Part 2: Tests - Test Xa and guidance: Immersion in cleaning solvents |
| EN 60068-2-14:2009 | Environmental testing - Part 2-14: Tests - Test N: Change of temperature |
| IEC 60068-2-52:2017 | Environmental testing - Part 2-52: Tests - Test Kb: Salt mist, cyclic (sodium chloride solution) |
| IEC 60068-2-69:2017 | Environmental testing - Part 2-69: Tests - Test Te/Tc: Solderability testing of electronic components and printed boards by the wetting balance (force measurement) method |
| EN 60068-2-31:2008 | ENVIRONMENTAL TESTING - PART 2-31: TESTS - TEST EC: ROUGH HANDLING SHOCKS, PRIMARILY FOR EQUIPMENT-TYPE SPECIMENS |
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