CEI EN 61760-1 : 2007
Current
The latest, up-to-date edition.
SURFACE MOUNTING TECHNOLOGY - PART 1: STANDARD METHOD FOR THE SPECIFICATION OF SURFACE MOUNTING COMPONENTS (SMDS)
Hardcopy , PDF
English - Italian
01-01-2007
Important note : Users cannot be edited or removed once added to your Multi user PDF.
INTRODUCTION
1 Scope and object
2 Normative references
3 Terms and definitions
4 Requirements for component design and component specifications
5 Specification of assembly process conditions
6 Typical process conditions
7 Requirements for components and component specifications
related to suitability with various mounting processes
Bibliography
Annex ZA (normative) - Normative references to international
publications with their corresponding European publications
Provides a reference set of process conditions and related test conditions to be used when compiling component specifications of electronic components that are intended for usage in surface mount technology.
| Committee |
CT 309
|
| DevelopmentNote |
Classificazione CEI 91-2 (08/2001)
|
| DocumentType |
Standard
|
| Pages |
64
|
| PublisherName |
Comitato Elettrotecnico Italiano
|
| Status |
Current
|
| Standards | Relationship |
| IEC 61760-1:2006 | Identical |
| EN 61760-1:2006 | Identical |
| EN 60286-5:2004/A1:2009 | PACKAGING OF COMPONENTS FOR AUTOMATIC HANDLING - PART 5: MATRIX TRAYS |
| EN 60286-6:2004 | Packaging of components for automatic handling - Part 6: Bulk case packaging for surface mounting components |
| IEC 60191-6:2009 | Mechanical standardization of semiconductor devices - Part 6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages |
| IEC 60068-2-58:2015+AMD1:2017 CSV | Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD) |
| EN 61340-5-1:2016/AC:2017-05 | ELECTROSTATICS - PART 5-1: PROTECTION OF ELECTRONIC DEVICES FROM ELECTROSTATIC PHENOMENA - GENERAL REQUIREMENTS (IEC 61340-5-1:2016/COR1:2017) |
| IEC 62090:2017 | Product package labels for electronic components using bar code and two-dimensional symbologies |
| IEC 61340-5-1:2016 | Electrostatics - Part 5-1: Protection of electronic devices from electrostatic phenomena - General requirements |
| CEI 40-10 : 2ED 1998 | IMBALLAGGIO DI COMPONENTI PER OPERAZIONI AUTOMATIZZATE - PARTE 3: IMBALLAGGIO DI COMPONENTI SENZA REOFORI SU NASTRI CONTINUI |
| IEC 60068-2-21:2006 | Environmental testing - Part 2-21: Tests - Test U: Robustness of terminations and integral mounting devices |
| IEC 60286-6:2004 | Packaging of components for automatic handling - Part 6: Bulk case packaging for surface mounting components |
| EN 62090:2017 | Product package labels for electronic components using bar code and two- dimensional symbologies |
| IEC 60286-5:2003+AMD1:2009 CSV | Packaging of components for automatic handling - Part 5: Matrixtrays |
| IEC 61760-2:2007 | Surface mounting technology - Part 2: Transportation and storage conditions of surface mounting devices (SMD) - Application guide |
| EN 60286-3:2013/AC:2013 | PACKAGING OF COMPONENTS FOR AUTOMATIC HANDLING - PART 3: PACKAGING OF SURFACE MOUNT COMPONENTS ON CONTINUOUS TAPES (IEC 60286-3:2013) |
| ISO 8601:2004 | Data elements and interchange formats Information interchange Representation of dates and times |
| IEC 60068-2-77:1999 | Environmental testing - Part 2-77: Tests - Test 77: Body strength and impact shock |
| EN 60068-2-21:2006 | Environmental testing - Part 2-21: Tests - Test U: Robustness of terminations and integral mounting devices |
| IEC 60194:2015 | Printed board design, manufacture and assembly - Terms and definitions |
| IEC 60062:2016 | Marking codes for resistors and capacitors |
| EN 60062:2016/AC:2016-12 | MARKING CODES FOR RESISTORS AND CAPACITORS (IEC 60062:2016/COR1:2016) |
| EN 60068-2-77:1999 | Environmental testing - Part 2-77: Tests - Test 77: Body strength and impact shock |
| EN 61760-2:2007 | Surface mounting technology - Part 2: Transportation and storage conditions of surface mounting devices (SMD) - Application guide |
| IEC 60286-3:2013 | Packaging of components for automatic handling - Part 3: Packaging of surface mount components on continuous tapes |
| EN 60286-4:2013 | Packaging of components for automatic handling - Part 4: Stick magazines for electronic components encapsulated in packages of different forms |
| EN 60191-6:2009 | Mechanical standardization of semiconductor devices - Part 6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages |
| IEC 60286-4:2013 | Packaging of components for automatic handling - Part 4: Stick magazines for electronic components encapsulated in packages of different forms |
| EN 60068-2-45:1992/A1:1993 | Environmental testing - Part 2: Tests - Test Xa and guidance: Immersion in cleaning solvents |
| EN 60194:2006 | Printed board design, manufacture and assembly - Terms and definitions |
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