EN 165000-1:1996
Withdrawn
A Withdrawn Standard is one, which is removed from sale, and its unique number can no longer be used. The Standard can be withdrawn and not replaced, or it can be withdrawn and replaced by a Standard with a different number.
Film and hybrid integrated circuits - Part 1: Generic specification - Capability approval procedure
01-03-1997
16-04-1996
1 GENERAL
1.1 Scope
1.2 Normative references
1.3 Units, symbols and terminology
1.4 Standard and preferred values
1.5 Marking of circuit and package
2 QUALITY ASSESSMENT PROCEDURES
2.1 General
2.1.1 Eligibility for capability approval
2.1.2 Primary stage of manufacture
2.1.3 Subcontracting
2.1.4 Control of procurement sources and incoming material
2.1.5 Validity of release
2.1.6 Rework
2.2 Procedures for capability approval
2.2.1 Application for capability approval
2.2.2 Granting of capability approval
2.2.3 Description of capability
2.2.4 Capability qualifying component
2.2.5 Demonstration and verification of capability
2.2.6 Procedures to be followed in the event of CQC failure
2.2.7 Abstract of description of capability
2.3 Procedure following the granting of capability approval
2.3.1 Maintenance of capability approval
2.3.2 Modification likely to affect the validity of capability
approval
2.4 Release for delivery
2.4.1 General
2.4.2 Quality conformance inspection, reguirements
2.4.3 Detail specification
2.4.3(1) General
2.4.3(2) Customer detail specifications
2.4.3(3) Detail specification for standard catalogue items
to be included in the Qualified Products List (QPL)
3 TEST AND MEASUREMENT PROCEDURES
3.1 General
3.2 Standard condition for testing
3.3 Visual inspection and package dimensions
3.4 Electrical measurement procedures
3.5 Environmental test procedures
Figures
Defines quality assessment procedures and test methods for use in assessing film and hybrid integrated circuit for use in electronic equipment, under the capability approval procedure. Also applies to part completed devices supplied to customers for subsequent processing. (Should be read with EN 165000 pts 2, 3 and 4)
Committee |
CLC/SR 47A
|
DocumentType |
Standard
|
PublisherName |
European Committee for Standards - Electrical
|
Status |
Withdrawn
|
Supersedes |
Standards | Relationship |
DS EN 165000-1 : 1997 | Identical |
I.S. EN 165000-1:1998 | Identical |
NF EN 165000-1:1996 | Identical |
NEN EN 165000-1 : 1996 | Identical |
UNE-EN 165000-1:1996 | Identical |
DIN EN 165000-1:1996-11 | Identical |
SN EN 165000-1 : 1996 | Identical |
BS EN 165000-1:1996 | Identical |
NBN EN 165000-1 : 2008 | Identical |
PN EN 165000-1 : 2002 | Identical |
I.S. EN 165000-3:1998 | FILM AND HYBRID INTEGRATED CIRCUITS - PART 3: SELF-AUDIT CHECKLIST AND REPORT FOR FILM AND HYBRID INTEGRATED CIRCUIT MANUFACTURERS |
EN 165000-3:1996 | Film and hybrid integrated circuits - Part 3: Self-audit checklist and report for film and hybrid integrated circuit manufacturers |
CECC 00114-3 : 94 AMD 2 | CAPABILITY APPROVAL OF AN ELECTRONIC COMPONENT MANUFACTURING ACTIVITY |
HD 323.2.11 : 200S1 | BASIC ENVIRONMENTAL TESTING PROCEDURES - TESTS - TEST KA: SALT MIST |
HD 323.2.20 : 200S3 | BASIC ENVIRONMENTAL TESTING PROCEDURES - TESTS - TEST T - SOLDERING |
IEC 60068-1:2013 | Environmental testing - Part 1: General and guidance |
IEC 60068-2-27:2008 | Environmental testing - Part 2-27: Tests - Test Ea and guidance: Shock |
IEC 60134:1961 | Rating systems for electronic tubes and valves and analogous semiconductor devices |
IEC 60068-2-20:2008 | Environmental testing - Part 2-20: Tests - Test T: Test methods for solderability and resistance to soldering heat of devices with leads |
EN 100012 : 1995 | HARMONIZED SYSTEM OF QUALITY ASSESSMENT FOR ELECTRONIC COMPONENTS: BASIC SPECIFICATION: X-RAY INSPECTION OF ELECTRONIC COMPONENTS |
EN 60068-2-1:2007 | Environmental testing - Part 2-1: Tests - Test A: Cold |
EN 60068-2-2:2007 | Environmental testing - Part 2-2: Tests - Test B: Dry heat |
IEC 60068-2-21:2006 | Environmental testing - Part 2-21: Tests - Test U: Robustness of terminations and integral mounting devices |
EN 60068-1:2014 | Environmental testing - Part 1: General and guidance |
HD 323.2.33 : 200S1 | BASIC ENVIRONMENTAL TESTING PROCEDURES - TESTS - GUIDANCE ON CHANGE OF TEMPERATURE TESTS |
IEC 60068-2-11:1981 | Basic environmental testing procedures - Part 2-11: Tests - Test Ka: Salt mist |
EN 60068-2-7:1993 | Environmental testing - Part 2: Tests - Test Ga: Acceleration, steady state |
CECC 00114 : 93 AMD 1 | QUALITY ASSESSMENT PROCEDURES - APPROVAL OF MANUFACTURERS AND OTHER ORGANIZATIONS |
HD 323.2.30 : 200S3 | BASIC ENVIRONMENTAL TESTING PROCEDURES - PART 2: TESTS - TEST DB AND GUIDANCE: DAMP HEAT, CYCLIC (12 + 12-HOUR CYCLE) |
EN 60068-2-27:2009 | Environmental testing - Part 2-27: Tests - Test Ea and guidance: Shock |
HD 323.2.3 : 200S2 | BASIC ENVIRONMENTAL TESTING PROCEDURES - TESTS - TEST CA - DAMP HEAT, STEADY STATE |
IEC 60068-2-47:2005 | Environmental testing - Part 2-47: Test - Mounting of specimens for vibration, impact and similar dynamic tests |
IEC 60068-2-3:1969 | Basic environmental testing procedures - Part 2-3: Tests - Test Ca: Damp heat, steady state |
EN 100114-1 : 1996 | RULE OF PROCEDURE - QUALITY ASSESSMENT PROCEDURES - PART 1: CECC REQUIREMENTS FOR THE APPROVAL OF AN ORGANIZATION |
EN 60068-2-17:1994 | Environmental testing - Part 2: Tests - Test Q: Sealing |
IEC 60068-2-17:1994 | Basic environmental testing procedures - Part 2-17: Tests - Test Q: Sealing |
IEC 60068-2-2:2007 | Environmental testing - Part 2-2: Tests - Test B: Dry heat |
IEC TR 60440:1973 | Method of measurement of non-linearity in resistors |
IEC 60747-1:2006+AMD1:2010 CSV | Semiconductor devices - Part 1: General |
CECC 00016 : 1990 | BASIC SPECIFICATION - BASIC REQUIREMENTS FOR THE USE OF STATISTICAL PROCESS CONTROL (SPC) IN THE CECC SYSTEM |
HD 323.2.44 : 200S1 | BASIC ENVIRONMENTAL TESTING PROCEDURES - TESTS - GUIDANCE ON TEST T : SOLDERING |
IEC 60749:1996+AMD1:2000+AMD2:2001 CSV | Semiconductor devices - Mechanical and climatic test methods |
EN 60068-2-6:2008 | Environmental testing - Part 2-6: Tests - Test Fc: Vibration (sinusoidal) |
IEC 60748-1:2002 | Semiconductor devices - Integrated circuits - Part 1: General |
CECC 00300 : 1996 | REGISTER OF CECC SPECIFICATIONS |
IEC 60068-2-1:2007 | Environmental testing - Part 2-1: Tests - Test A: Cold |
HD 323.2.21 : 200S3 | BASIC ENVIRONMENTAL TESTING PROCEDURES - TESTS - TEST U: ROBUSTNESS OF TERMINATIONS AND INTEGRAL MOUNTING DEVICES |
IEC 60068-2-44:1995 | Environmental testing - Part 2-44: Tests - Guidance on test T: Soldering |
IEC 60068-2-14:2009 | Environmental testing - Part 2-14: Tests - Test N: Change of temperature |
CECC 00007 : 1978 | BASIC SPECIFICATION: SAMPLING PLANS AND PROCEDURES FOR INSPECTION BY ATTRIBUTES |
EN 60068-2-45:1992/A1:1993 | Environmental testing - Part 2: Tests - Test Xa and guidance: Immersion in cleaning solvents |
CECC 00400 : 86 ERRATUM 92 | HANDBOOK FOR THE PRODUCTION OF CECC DOCUMENTS |
EN 60695-2-2:1994/A1:1995 | FIRE HAZARD TESTING - TEST METHODS - NEEDLE-FLAME TEST |
EN 60068-2-47:2005 | Environmental testing - Part 2-47: Tests - Mounting of specimens for vibration, impact and similar dynamic tests |
IEC 60068-2-30:2005 | Environmental testing - Part 2-30: Tests - Test Db: Damp heat, cyclic (12 h + 12 h cycle) |
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