EN 60068-2-82:2007
Superseded
A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.
View Superseded by
Environmental testing - Part 2-82: Tests - Test XW1: Whisker test methods for electronic and electric components
11-07-2019
22-06-2007
1 Scope
2 Normative references
3 Terms and definitions
4 Test equipment
4.1 Desiccator
4.2 Humidity chamber
4.3 Thermal cycling chamber
4.4 Optical microscope
4.5 Scanning electron microscope microscopy
4.6 Fixing jig
5 Preparation for test
5.1 General
5.2 Selection of test methods
5.3 Storage conditions prior to testing
5.4 Handling of the specimen
5.5 Preconditioning by heat treatment
5.6 Specimen preparation by leads forming
6 Test condition
6.1 Ambient test
6.2 Damp heat test
6.3 Temperature cycling test
7 Test schedule
7.1 Procedure for test method selection
7.2 Initial measurement
7.3 Test
7.4 Recovery
7.5 Intermediate or final assessment
8 Information to be given in the relevant specification
9 Minimum requirements for a test report
Annex A (normative) Measurement of the whisker length
Annex B (informative) Examples of whiskers
Annex C (informative) Guidance on the sample lots and test
schedules
Annex D (informative) Guidance on acceptance criteria
Annex E (informative) Background on whisker growth
Annex F (informative) Background on ambient test
Annex G (informative) Background on damp heat test
Annex H (informative) Background on temperature cycling test
Annex ZA (normative) Normative references to international
publications with their corresponding
European publications
Bibliography
IEC 60068-2-82:2007 specifies whisker tests for electric or electronic components representing the finished stage, with tin or tin-alloy finish. However, the standard does not specify tests for whiskers that may grow as a result of external mechanical stress. This test method is employed by a relevant specification (international component or application specification) with transfer of the test severities to be applied and with defined acceptance criteria. Where tests described in this standard are considered for other components, e.g. mechanical parts as used in electrical or electronic equipment, it should be ensured that the material system and whisker growth mechanisms are comparable.
Committee |
CLC/SR 91
|
DocumentType |
Standard
|
PublisherName |
European Committee for Standards - Electrical
|
Status |
Superseded
|
SupersededBy |
Standards | Relationship |
OVE/ONORM EN 60068-2-82 : 2008 | Identical |
UNE-EN 60068-2-82:2007 | Identical |
DIN EN 60068-2-82:2007-12 | Identical |
CEI EN 60068-2-82 : 2008 | Identical |
IEC 60068-2-82:2007 | Identical |
PN EN 60068-2-82 : 2008 | Identical |
BS EN 60068-2-82:2007 | Identical |
I.S. EN 60068-2-82:2007 | Identical |
NF EN 60068-2-82 : 2013 | Identical |
NBN EN 60068-2-82 : 2007 | Identical |
NEN EN IEC 60068-2-82 : 2007 | Identical |
BS EN 62231-1:2016 | Identical |
BS EN 60384-1:2016 | Fixed capacitors for use in electronic equipment Generic specification |
BS EN 60115-1 : 2011 | FIXED RESISTORS FOR USE IN ELECTRONIC EQUIPMENT - PART 1: GENERIC SPECIFICATION |
EN 61760-3:2010 | Surface mounting technology - Part 3: Standard method for the specification of components for Through Hole Reflow (THR) soldering |
BS EN 61760-3:2010 | Surface mounting technology Standard method for the specification of components for through hole reflow (THR) soldering |
BS EN 60512-16-21:2012 | Connectors for electronic equipment. Tests and measurements Mechanical tests on contacts and terminations. Test 16u. Whisker test via the application of external mechanical stresses |
I.S. EN 60115-1:2011 | FIXED RESISTORS FOR USE IN ELECTRONIC EQUIPMENT - PART 1: GENERIC SPECIFICATION (IEC 60115-1:2008, MODIFIED) |
I.S. EN 61760-3:2010 | SURFACE MOUNTING TECHNOLOGY - PART 3: STANDARD METHOD FOR THE SPECIFICATION OF COMPONENTS FOR THROUGH HOLE REFLOW (THR) SOLDERING |
I.S. EN 60512-16-21:2012 | CONNECTORS FOR ELECTRONIC EQUIPMENT - TESTS AND MEASUREMENTS - PART 16-21: MECHANICAL TESTS ON CONTACTS AND TERMINATIONS - TEST 16U: WHISKER TEST VIA THE APPLICATION OF EXTERNAL MECHANICAL STRESSES (IEC 60512-16-21:2012 (EQV)) |
EN 60384-1:2016 | Fixed capacitors for use in electronic equipment - Part 1: Generic specification |
EN 60115-1:2011/A11:2015 | FIXED RESISTORS FOR USE IN ELECTRONIC EQUIPMENT - PART 1: GENERIC SPECIFICATION |
CEI EN 60512-16-21 : 2013 | CONNECTORS FOR ELECTRONIC EQUIPMENT - TESTS AND MEASUREMENTS - PART 16-21: MECHANICAL TESTS ON CONTACTS AND TERMINATIONS - TEST 16U: WHISKER TEST VIA THE APPLICATION OF EXTERNAL MECHANICAL STRESSES |
CEI EN 61760-3 : 2010 | SURFACE MOUNTING TECHNOLOGY - PART 3: STANDARD METHOD FOR THE SPECIFICATION OF COMPONENTS FOR THROUGH HOLE REFLOW (THR) SOLDERING |
EN 60512-16-21:2012 | CONNECTORS FOR ELECTRONIC EQUIPMENT - TESTS AND MEASUREMENTS - PART 16-21: MECHANICAL TESTS ON CONTACTS AND TERMINATIONS - TEST 16U: WHISKER TEST VIA THE APPLICATION OF EXTERNAL MECHANICAL STRESSES |
IEC 61193-2:2007 | Quality assessment systems - Part 2: Selection and use of sampling plans for inspection of electronic components and packages |
HD 323.2.20 : 200S3 | BASIC ENVIRONMENTAL TESTING PROCEDURES - TESTS - TEST T - SOLDERING |
IEC 60068-1:2013 | Environmental testing - Part 1: General and guidance |
IEC 60068-2-58:2015+AMD1:2017 CSV | Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD) |
IEC 60068-2-20:2008 | Environmental testing - Part 2-20: Tests - Test T: Test methods for solderability and resistance to soldering heat of devices with leads |
EN 60068-1:2014 | Environmental testing - Part 1: General and guidance |
IEC 61192-3:2002 | Workmanship requirements for soldered electronic assemblies - Part 3: Through-hole mount assemblies |
EN 61760-1:2006 | SURFACE MOUNTING TECHNOLOGY - PART 1: STANDARD METHOD FOR THE SPECIFICATION OF SURFACE MOUNTING COMPONENTS (SMDS) |
IEC 61760-1:2006 | Surface mounting technology - Part 1: Standard method for the specification of surface mounting components (SMDs) |
EN 61192-3:2003 | Workmanship requirements for soldered electronic assemblies - Part 3: Through-hole mount assemblies |
EN 60068-2-78:2013 | Environmental testing - Part 2-78: Tests - Test Cab: Damp heat, steady state |
IEC 60068-3-4:2001 | Environmental testing - Part 3-4: Supporting documentation and guidance - Damp heat tests |
IEC 60068-2-14:2009 | Environmental testing - Part 2-14: Tests - Test N: Change of temperature |
EN 60068-2-14:2009 | Environmental testing - Part 2-14: Tests - Test N: Change of temperature |
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