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EN 60749-26:2014
Superseded
A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.
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Semiconductor devices - Mechanical and climatic test methods - Part 26: Electrostatic discharge (ESD) sensitivity testing - Human body model (HBM)
01-03-2018
23-05-2014
FOREWORD
1 Scope
2 Normative references
3 Terms and definitions
4 Apparatus and required equipment
5 Stress test equipment qualification
and routine verification
6 Classification procedure
7 Failure criteria
8 Component classification
Annex A (informative) - HBM test method flow chart
Annex B (informative) - HBM test equipment parasitic
properties
Annex C (informative) - Example of testing a product
using Table 2, Table 3, or Table 2 with a
two-pin HBM tester
Annex D (informative) - Examples of coupled
non-supply pin pairs
Annex ZA (normative) - Normative references to international
publications with their corresponding European
publications
IEC 60749-26:2013 establishes the procedure for testing, evaluating, and classifying components and microcircuits according to their susceptibility (sensitivity) to damage or degradation by exposure to a defined human body model (HBM) electrostatic discharge (ESD). The purpose (objective) of this standard is to establish a test method that will replicate HBM failures and provide reliable, repeatable HBM ESD test results from tester to tester, regardless of component type. Repeatable data will allow accurate classifications and comparisons of HBM ESD sensitivity levels. ESD testing of semiconductor devices is selected from this test method, the machine model (MM) test method (see IEC 60749-27) or other ESD test methods in the IEC 60749 series. The HBM and MM test methods produce similar but not identical results; unless otherwise specified, this test method is the one selected. This edition includes the following significant technical changes with respect to the previous edition: a) descriptions of oscilloscope and current transducers have been refined and updated; b) the HBM circuit schematic and description have been improved; c) the description of stress test equipment qualification and verification has been completely re-written; d) qualification and verification of test fixture boards has been revised; e) a new section on the determination of ringing in the current waveform has been added; f) some alternate pin combinations have been included; g) allowance for non-supply pins to stress to a limited number of supply pin groups (associated non-supply pins) and allowance for non-supply to non-supply (i.e., I/O to I/O) stress to be limited to a finite number of 2 pin pairs (coupled non-supply pin pairs); h) explicit allowance for HBM stress using 2 pin HBM testers for die only shorted supply groups.
DevelopmentNote |
Redesignated as EN IEC 60749-26. (03/2018)
|
DocumentType |
Standard
|
PublisherName |
European Committee for Standards - Electrical
|
Status |
Superseded
|
SupersededBy |
Standards | Relationship |
NF EN 60749-26 : 2014 | Identical |
IEC 60749-26:2013 | Identical |
NBN EN 60749-26 : 2014 | Identical |
NEN EN IEC 60749-26 : 2014 | Identical |
I.S. EN 60749-26:2014 | Identical |
OVE/ONORM EN 60749-26 : 2014 | Identical |
PN EN 60749-26 : 2014 | Identical |
SN EN 60749-26:2014 | Identical |
DIN EN 60749-26 : 2014 | Identical |
VDE 0884-749-26 : 2014 | Identical |
BS EN 60749-26:2014 | Identical |
UNE-EN 60749-26:2014 | Identical |
CEI EN 60749-26 : 2016 | Identical |
PNE-FprEN 60749-26 | Identical |
BS EN 62149-9:2014 | Fibre optic active components and devices. Performance standards Seeded reflective semiconductor optical amplifier transceivers |
BS EN 62149-2:2014 | Fibre optic active components and devices. Performance standards 850 nm discrete vertical cavity surface emitting laser devices |
BS EN 62149-4:2010 | Fibre optic active components and devices. Performance standards 1300 nm fibre optic transceivers for Gigabit Ethernet application |
BS EN 60749-43:2017 | Semiconductor devices - Mechanical and climatic test methods Guidelines for IC reliability qualification plans |
BS EN 61340-5-3:2015 | Electrostatics Protection of electronic devices from electrostatic phenomena. Properties and requirements classification for packaging intended for electrostatic discharge sensitive devices |
S.R. CLC/TR 61340-5-2:2008 | ELECTROSTATICS - PART 5-2: PROTECTION OF ELECTRONIC DEVICES FROM ELECTROSTATIC PHENOMENA - USER GUIDE |
I.S. EN 60749-43:2017 | SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 43: GUIDELINES FOR IC RELIABILITY QUALIFICATION PLANS |
BS EN 60749-27 : 2006 | SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 27: ELECTROSTATIC DISCHARGE (ESD) SENSITIVITY TESTING - MACHINE MODEL (MM) |
UNE-EN 62005-9-1:2016 | Fibre optic interconnecting devices and passive components - Reliability - Part 9-1: Qualification of passive optical components |
EN 61340-5-1:2016/AC:2017-05 | ELECTROSTATICS - PART 5-1: PROTECTION OF ELECTRONIC DEVICES FROM ELECTROSTATIC PHENOMENA - GENERAL REQUIREMENTS (IEC 61340-5-1:2016/COR1:2017) |
EN 62149-8:2014 | Fibre optic active components and devices - Performance standards - Part 8: Seeded reflective semiconductor optical amplifier devices |
BS EN 62149-8:2014 | Fibre optic active components and devices. Performance standards Seeded reflective semiconductor optical amplifier devices |
BS EN 62005-9-1:2015 | Fibre optic interconnecting devices and passive components. Reliability Qualification of passive optical components |
CEI EN 62149-4 : 2011 | FIBRE OPTIC ACTIVE COMPONENTS AND DEVICES - PERFORMANCE STANDARDS - PART 4: 1300 NM FIBRE OPTIC TRANSCEIVERS FOR GIGABIT ETHERNET APPLICATION |
I.S. EN 62572-3:2016 | FIBRE OPTIC ACTIVE COMPONENTS AND DEVICES - RELIABILITY STANDARDS - PART 3: LASER MODULES USED FOR TELECOMMUNICATION |
I.S. EN 62005-9-1:2015 | FIBRE OPTIC INTERCONNECTING DEVICES AND PASSIVE COMPONENTS - RELIABILITY - PART 9-1: QUALIFICATION OF PASSIVE OPTICAL COMPONENTS |
EN 60749-43:2017 | Semiconductor devices - Mechanical and climatic test methods - Part 43: Guidelines for IC reliability qualification plans |
CEI EN 60679-1 : 2009 | PIEZOELECTRIC, DIELECTRIC AND ELECTROSTATIC OSCILLATORS OF ASSESSED QUALITY - PART 1: GENERIC SPECIFICATION |
EN 60749-28:2017 | Semiconductor devices - Mechanical and climatic test methods - Part 28: Electrostatic discharge (ESD) sensitivity testing - Charged device model (CDM) - device level |
CEI CLC/TR 61340-5-2 : 2010 | ELECTROSTATICS - PART 5-2: PROTECTION OF ELECTRONIC DEVICES FROM ELECTROSTATIC PHENOMENA - USER GUIDE |
I.S. EN 62149-3:2014 | FIBRE OPTIC ACTIVE COMPONENTS AND DEVICES - PERFORMANCE STANDARDS - PART 3: MODULATOR-INTEGRATED LASER DIODE TRANSMITTERS FOR 2,5-GBIT/S TO 40-GBIT/S FIBRE OPTIC TRANSMISSION SYSTEMS |
I.S. EN 60679-1:2017 | PIEZOELECTRIC, DIELECTRIC AND ELECTROSTATIC OSCILLATORS OF ASSESSED QUALITY - PART 1: GENERIC SPECIFICATION |
I.S. EN 62149-4:2010 | FIBRE OPTIC ACTIVE COMPONENTS AND DEVICES - PERFORMANCE STANDARDS - PART 4: 1300 NM FIBRE OPTIC TRANSCEIVERS FOR GIGABIT ETHERNET APPLICATION |
I.S. EN 60749-27:2006 | SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 27: ELECTROSTATIC DISCHARGE (ESD) SENSITIVITY TESTING - MACHINE MODEL (MM) (IEC 60749-27:2006 (EQV)) |
EN 62149-3:2014 | Fibre optic active components and devices - Performance standards - Part 3: Modulator-integrated laser diode transmitters for 2,5-Gbit/s to 40-Gbit/s fibre optic transmission systems |
CLC/TR 61340-5-2:2008 | Electrostatics - Part 5-2: Protection of electronic devices from electrostatic phenomena - User guide |
BS EN 60749-28:2017 | Semiconductor devices. Mechanical and climatic test methods Electrostatic discharge (ESD) sensitivity testing. Charged device model (CDM). Device level |
BS EN 61340-3-1:2007 | Electrostatics Methods for simulation of electrostatic effects. Human body model (HBM) electrostatic discharge test waveforms |
BS EN 62572-3:2016 | Fibre optic active components and devices. Reliability standards Laser modules used for telecommunication |
BS EN 60679-1:2017 | Piezoelectric, dielectric and electrostatic oscillators of assessed quality Generic specification |
CEI EN 62005-9-1 : 2016 | FIBRE OPTIC INTERCONNECTING DEVICES AND PASSIVE COMPONENTS - RELIABILITY - PART 9-1: QUALIFICATION OF PASSIVE OPTICAL COMPONENTS |
PD CLC/TR 61340-5-2:2008 | Electrostatics Protection of electronic devices from electrostatic phenomena. User guide |
BS EN 62149-3:2014 | Fibre optic active components and devices. Performance standards Modulator-integrated laser diode transmitters for 2,5-Gbit/s to 40-Gbit/s fibre optic transmission systems |
BS EN 61340-5-1:2016 | Electrostatics Protection of electronic devices from electrostatic phenomena. General requirements |
CEI EN 60749-43 : 1ED 2018 | SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 43: GUIDELINES FOR IC RELIABILITY QUALIFICATION PLANS |
EN 60679-1:2017 | Piezoelectric, dielectric and electrostatic oscillators of assessed quality - Part 1: Generic specification |
I.S. EN 62149-2:2014 | FIBRE OPTIC ACTIVE COMPONENTS AND DEVICES - PERFORMANCE STANDARDS - PART 2: 850 NM DISCRETE VERTICAL CAVITY SURFACE EMITTING LASER DEVICES |
I.S. EN 62149-8:2014 | FIBRE OPTIC ACTIVE COMPONENTS AND DEVICES - PERFORMANCE STANDARDS - PART 8: SEEDED REFLECTIVE SEMICONDUCTOR OPTICAL AMPLIFIER DEVICES |
I.S. EN 62149-9:2014 | FIBRE OPTIC ACTIVE COMPONENTS AND DEVICES - PERFORMANCE STANDARDS - PART 9: SEEDED REFLECTIVE SEMICONDUCTOR OPTICAL AMPLIFIER TRANSCEIVERS |
EN 60749-27:2006/A1:2012 | SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 27: ELECTROSTATIC DISCHARGE (ESD) SENSITIVITY TESTING - MACHINE MODEL (MM) |
EN 61340-5-3:2015 | Electrostatics - Part 5-3: Protection of electronic devices from electrostatic phenomena - Properties and requirements classification for packaging intended for electrostatic discharge sensitive devices |
EN 62572-3:2016 | Fibre optic active components and devices - Reliability standards - Part 3: Laser modules used for telecommunication |
EN 62149-4:2010 | Fibre optic active components and devices - Performance standards - Part 4: 1 300 nm fibre optic transceivers for Gigabit Ethernet application |
EN 61340-3-1:2007 | Electrostatics - Part 3-1: Methods for simulation of electrostatic effects - Human body model (HBM) electrostatic discharge test waveforms |
EN 62149-2:2014 | Fibre optic active components and devices - Performance standards - Part 2: 850 nm discrete vertical cavity surface emitting laser devices |
EN 62005-9-1:2015 | Fibre optic interconnecting devices and passive components - Reliability - Part 9-1: Qualification of passive optical components |
EN 62149-9:2014 | Fibre optic active components and devices - Performance standards - Part 9: Seeded reflective semiconductor optical amplifier transceivers |
IEC 60749-27:2006+AMD1:2012 CSV | Semiconductor devices - Mechanical and climatic test methods - Part27: Electrostatic discharge (ESD) sensitivity testing - Machine model (MM) |
EN 60749-27:2006/A1:2012 | SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 27: ELECTROSTATIC DISCHARGE (ESD) SENSITIVITY TESTING - MACHINE MODEL (MM) |
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