EN 61193-1:2002

FOREWORD
INTRODUCTION
1 Scope
2 Normative references
3 Terms and definitions
4 Defect registration
  4.1 Accept criteria
  4.2 Counting of defects
  4.3 Post-soldering defect registration
      4.3.1 Defects found after testing
  4.4 Defect subdivision
      4.4.1 Defect sources
      4.4.2 Defect registration form
  4.5 Rework immediately prior to soldering
  4.6 Defect data categories
5 Processing the data
6 Analysis
Annex A (normative) Subprocesses
Annex B (informative) Examples of product defect qualification
Annex C (informative) Examples of calculations
Annex D (informative) Example of registration of defects and
                       processing of the data
Annex ZA (normative) Normative references to international
                       publications with their corresponding
                       European publications

Defines methods of registration and analysis of defects on soldered printed board assemblies. These methods are described to allow effective comparison of performance between products, processes and production locations, and can serve as a basis for general quality improvement.