• I.S. EN 61192-2:2003

    Withdrawn A Withdrawn Standard is one, which is removed from sale, and its unique number can no longer be used. The Standard can be withdrawn and not replaced, or it can be withdrawn and replaced by a Standard with a different number.

    WORKMANSHIP REQUIREMENTS FOR SOLDERED ELECTRONIC ASSEMBLIES - SURFACE-MOUNT ASSEMBLIES

    Available format(s):  Hardcopy, PDF

    Withdrawn date:  29-05-2019

    Language(s):  English

    Published date:  25-04-2003

    Publisher:  National Standards Authority of Ireland

    For Harmonized Standards, check the EU site to confirm that the Standard is cited in the Official Journal.
    Only cited Standards give presumption of conformance to New Approach Directives/Regulations.

    Dates of withdrawal of national standards are available from NSAI.

    Add To Cart

    Table of Contents - (Show below) - (Hide below)

    FOREWORD
    INTRODUCTION
    1 Scope
    2 Normative references
    3 Terms and definitions
    4 General requirements
       4.1 Classification
       4.2 Conflict
       4.3 Interpretation of requirements
       4.4 Antistatic precautions
    5 Component preparation processes
    6 Solder paste deposition process qualification
       6.1 Solder paste characteristics
       6.2 Assessment of the process
       6.3 Solder paste deposition - Screen and stencil printing
            methods - Process control limits
    7 Non-conductive adhesive deposition process
       7.1 Pot life
       7.2 Inter-stage storage and handling
       7.3 Adhesive tackiness
       7.4 Assessment of the adhesive attachment process
       7.5 Adhesive deposition - Syringe dispensing method - Small
            components - Process control limits
    8 Temporary masking processes
    9 Component placement processes
       9.1 Assessment of the process
       9.2 Discrete components with gull-wing leads
       9.3 IC components with flat-ribbon, L- or gull-wing leads on
            two sides
       9.4 IC components with flat-ribbon, L- or gull-wing leads on
            four sides, for example, quad flat packs
       9.5 Components with round or flattened (coined) leads
       9.6 IC component packages with J-leads on two and four sides,
            for example, SOJ, PLCC
       9.7 Leadless rectangular components with metallized
            terminations
       9.8 Components with cylindrical endcap terminations
       9.9 Bottom-only terminations on leadless components
       9.10 Leadless chip carriers with castellated terminations
       9.11 Components with butt leads
       9.12 Components with inward L-shaped ribbon leads
       9.13 Flat-lug leads on power dissipating components
    10 Post-placement rework
       10.1 Rework of components placed on solder paste
       10.2 Rework of components placed on non-conductive adhesive
    11 Adhesive curing
    12 Soldering processes
    13 Cleaning processes
    14 Hand placement and hand soldering, including hand
       rework/repair
    15 Electrical test
    Annex A (normative)
       A.1 Introduction
       A.2 Example solder fillets and alignment: flat-ribbon, L- and
            gull-wing leads
       A.3 Example solder fillets and alignment: round or flattened
            (coined) leads
       A.4 Example solder fillets and alignment: J-leads
       A.5 Example solder fillets and alignment: rectangular or
            square end leadless components
       A.6 Example solder fillets and alignment: cylindrical end cap
            terminations, for example, MELFs
       A.7 Example solder fillets and alignment: bottom-only
            terminations on leadless components
       A.8 Example solder fillets and alignment: leadless chip
            carriers with castellated terminations
       A.9 Example solder fillets and alignment: butt joints
       A.10 Example solder fillets and alignment: inward L-shaped
            flat ribbon leads
       A.11 Example solder fillets and alignment: flat-lug leads on
            power dissipating components
     Figures

    Abstract - (Show below) - (Hide below)

    Provides requirements for workmanship in soldered surface-mounted electronic assemblies and multichip modules on organic substrates, on printed boards, and on similar laminates attached to the surface(s) of inorganic substrates.

    General Product Information - (Show below) - (Hide below)

    Development Note For CENELEC adoptions of IEC publications, please check www.iec.ch to be sure that you have any corrigenda that may apply. (01/2017)
    Document Type Standard
    Publisher National Standards Authority of Ireland
    Status Withdrawn

    Standards Referencing This Book - (Show below) - (Hide below)

    IEC 61193-1:2001 QUALITY ASSESSMENT SYSTEMS - PART 1: REGISTRATION AND ANALYSIS OF DEFECTS ON PRINTED BOARD ASSEMBLIES
    EN 61192-4:2003 WORKMANSHIP REQUIREMENTS FOR SOLDERED ELECTRONIC ASSEMBLIES - PART 4: TERMINAL ASSEMBLIES
    EN 61193-1 : 2002 QUALITY ASSESSMENT SYSTEMS - PART 1: REGISTRATION AND ANALYSIS OF DEFECTS ON PRINTED BOARD ASSEMBLIES
    IEC 61192-4:2002 Workmanship requirements for soldered electronic assemblies - Part 4: Terminal assemblies
    EN ISO 9002:1994/AC:1997 QUALITY SYSTEMS - SPECIFICATION FOR PRODUCTION AND INSTALLATION
    EN 61191-2:2017 PRINTED BOARD ASSEMBLIES - PART 2: SECTIONAL SPECIFICATION - REQUIREMENTS FOR SURFACE MOUNT SOLDERED ASSEMBLIES (IEC 61191-2:2017)
    EN 61191-3:2017 PRINTED BOARD ASSEMBLIES - PART 3: SECTIONAL SPECIFICATION - REQUIREMENTS FOR THROUGH-HOLE MOUNT SOLDERED ASSEMBLIES (IEC 61191-3:2017)
    EN ISO 9001:2015 QUALITY MANAGEMENT SYSTEMS - REQUIREMENTS (ISO 9001:2015)
    IEC 61191-1:2013 Printed board assemblies - Part 1: Generic specification - Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies
    IEC 61192-1:2003 Workmanship requirements for soldered electronic assemblies - Part 1: General
    EN 61192-3 : 2003 WORKMANSHIP REQUIREMENTS FOR SOLDERED ELECTRONIC ASSEMBLIES - PART 3: THROUGH-HOLE MOUNT ASSEMBLIES
    IEC 60194:2015 Printed board design, manufacture and assembly - Terms and definitions
    ISO 9001:2015 Quality management systems - Requirements
    IEC 61191-2:2017 Printed board assemblies - Part 2: Sectional specification - Requirements for surface mount soldered assemblies
    IEC 61191-4:2017 Printed board assemblies - Part 4: Sectional specification - Requirements for terminal soldered assemblies
    EN 61191-1:2013 PRINTED BOARD ASSEMBLIES - PART 1: GENERIC SPECIFICATION - REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES USING SURFACE MOUNT AND RELATED ASSEMBLY TECHNOLOGIES (IEC 61191-1:2013)
    EN 61192-1 : 2003 WORKMANSHIP REQUIREMENTS FOR SOLDERED ELECTRONIC ASSEMBLIES - PART 1: GENERAL
    EN 61191-4:2017 PRINTED BOARD ASSEMBLIES - PART 4: SECTIONAL SPECIFICATION - REQUIREMENTS FOR TERMINAL SOLDERED ASSEMBLIES
    IEC 61191-3:2017 Printed board assemblies - Part 3: Sectional specification - Requirements for through-hole mount soldered assemblies
    • Access your standards online with a subscription

      Features

      • Simple online access to standards, technical information and regulations
      • Critical updates of standards and customisable alerts and notifications
      • Multi - user online standards collection: secure, flexibile and cost effective