• EN 61192-2 : 2003

    Current The latest, up-to-date edition.

    WORKMANSHIP REQUIREMENTS FOR SOLDERED ELECTRONIC ASSEMBLIES - PART 2: SURFACE-MOUNT ASSEMBLIES

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    Published date:  11-04-2003

    Publisher:  European Committee for Standards - Electrical

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    Table of Contents - (Show below) - (Hide below)

    FOREWORD
    INTRODUCTION
    1 Scope
    2 Normative references
    3 Terms and definitions
    4 General requirements
       4.1 Classification
       4.2 Conflict
       4.3 Interpretation of requirements
       4.4 Antistatic precautions
    5 Component preparation processes
    6 Solder paste deposition process qualification
       6.1 Solder paste characteristics
       6.2 Assessment of the process
       6.3 Solder paste deposition - Screen and stencil printing
            methods - Process control limits
    7 Non-conductive adhesive deposition process
       7.1 Pot life
       7.2 Inter-stage storage and handling
       7.3 Adhesive tackiness
       7.4 Assessment of the adhesive attachment process
       7.5 Adhesive deposition - Syringe dispensing method - Small
            components - Process control limits
    8 Temporary masking processes
    9 Component placement processes
       9.1 Assessment of the process
       9.2 Discrete components with gull-wing leads
       9.3 IC components with flat-ribbon, L- or gull-wing leads on
            two sides
       9.4 IC components with flat-ribbon, L- or gull-wing leads on
            four sides, for example, quad flat packs
       9.5 Components with round or flattened (coined) leads
       9.6 IC component packages with J-leads on two and four sides,
            for example, SOJ, PLCC
       9.7 Leadless rectangular components with metallized
            terminations
       9.8 Components with cylindrical endcap terminations
       9.9 Bottom-only terminations on leadless components
       9.10 Leadless chip carriers with castellated terminations
       9.11 Components with butt leads
       9.12 Components with inward L-shaped ribbon leads
       9.13 Flat-lug leads on power dissipating components
    10 Post-placement rework
       10.1 Rework of components placed on solder paste
       10.2 Rework of components placed on non-conductive adhesive
    11 Adhesive curing
    12 Soldering processes
    13 Cleaning processes
    14 Hand placement and hand soldering, including hand
       rework/repair
    15 Electrical test
    Annex A (normative)
       A.1 Introduction
       A.2 Example solder fillets and alignment: flat-ribbon, L- and
            gull-wing leads
       A.3 Example solder fillets and alignment: round or flattened
            (coined) leads
       A.4 Example solder fillets and alignment: J-leads
       A.5 Example solder fillets and alignment: rectangular or
            square end leadless components
       A.6 Example solder fillets and alignment: cylindrical end cap
            terminations, for example, MELFs
       A.7 Example solder fillets and alignment: bottom-only
            terminations on leadless components
       A.8 Example solder fillets and alignment: leadless chip
            carriers with castellated terminations
       A.9 Example solder fillets and alignment: butt joints
       A.10 Example solder fillets and alignment: inward L-shaped
            flat ribbon leads
       A.11 Example solder fillets and alignment: flat-lug leads on
            power dissipating components
    Figures

    Abstract - (Show below) - (Hide below)

    Specifies requirements for workmanship in soldered surface-mounted electronic assemblies and multichip modules on organic substrates, on printed boards, and on similar laminates attached to the surface(s) of inorganic substances.

    General Product Information - (Show below) - (Hide below)

    Committee SR 91
    Development Note To be used in conjunction with EN 61192-1, EN 61192-3 & EN 61192-4 (07/2003)
    Document Type Standard
    Publisher European Committee for Standards - Electrical
    Status Current

    Standards Referenced By This Book - (Show below) - (Hide below)

    BS EN 61192-5 : 2007 WORKMANSHIP REQUIREMENTS FOR SOLDERED ELECTRONIC ASSEMBLIES - PART 5: REWORK, MODIFICATION AND REPAIR OF SOLDERED ELECTRONIC ASSEMBLIES
    BS EN 61192-3 : 2003 WORKMANSHIP REQUIREMENTS FOR SOLDERED ELECTRONIC ASSEMBLIES - PART 3: THROUGH-HOLE MOUNT ASSEMBLIES
    I.S. EN 61192-3:2003 WORKMANSHIP REQUIREMENTS FOR SOLDERED ELECTRONIC ASSEMBLIES - PART 3: THROUGH-HOLE MOUNT ASSEMBLIES
    I.S. EN 61192-5:2007 WORKMANSHIP REQUIREMENTS FOR SOLDERED ELECTRONIC ASSEMBLIES - PART 5: REWORK, MODIFICATION AND REPAIR OF SOLDERED ELECTRONIC ASSEMBLIES
    EN 61192-3 : 2003 WORKMANSHIP REQUIREMENTS FOR SOLDERED ELECTRONIC ASSEMBLIES - PART 3: THROUGH-HOLE MOUNT ASSEMBLIES
    EN 61192-5 : 2007 WORKMANSHIP REQUIREMENTS FOR SOLDERED ELECTRONIC ASSEMBLIES - PART 5: REWORK, MODIFICATION AND REPAIR OF SOLDERED ELECTRONIC ASSEMBLIES

    Standards Referencing This Book - (Show below) - (Hide below)

    IEC 61193-1:2001 QUALITY ASSESSMENT SYSTEMS - PART 1: REGISTRATION AND ANALYSIS OF DEFECTS ON PRINTED BOARD ASSEMBLIES
    EN 61192-4:2003 WORKMANSHIP REQUIREMENTS FOR SOLDERED ELECTRONIC ASSEMBLIES - PART 4: TERMINAL ASSEMBLIES
    EN 61193-1 : 2002 QUALITY ASSESSMENT SYSTEMS - PART 1: REGISTRATION AND ANALYSIS OF DEFECTS ON PRINTED BOARD ASSEMBLIES
    IEC 61192-4:2002 Workmanship requirements for soldered electronic assemblies - Part 4: Terminal assemblies
    EN ISO 9002:1994/AC:1997 QUALITY SYSTEMS - SPECIFICATION FOR PRODUCTION AND INSTALLATION
    EN 61191-2:2017 PRINTED BOARD ASSEMBLIES - PART 2: SECTIONAL SPECIFICATION - REQUIREMENTS FOR SURFACE MOUNT SOLDERED ASSEMBLIES (IEC 61191-2:2017)
    EN 61191-3:2017 PRINTED BOARD ASSEMBLIES - PART 3: SECTIONAL SPECIFICATION - REQUIREMENTS FOR THROUGH-HOLE MOUNT SOLDERED ASSEMBLIES (IEC 61191-3:2017)
    EN ISO 9001:2015 QUALITY MANAGEMENT SYSTEMS - REQUIREMENTS (ISO 9001:2015)
    IEC 61191-1:2013 Printed board assemblies - Part 1: Generic specification - Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies
    IEC 61192-1:2003 Workmanship requirements for soldered electronic assemblies - Part 1: General
    EN 61192-3 : 2003 WORKMANSHIP REQUIREMENTS FOR SOLDERED ELECTRONIC ASSEMBLIES - PART 3: THROUGH-HOLE MOUNT ASSEMBLIES
    IEC 60194:2015 Printed board design, manufacture and assembly - Terms and definitions
    ISO 9001:2015 Quality management systems - Requirements
    IEC 61191-2:2017 Printed board assemblies - Part 2: Sectional specification - Requirements for surface mount soldered assemblies
    IEC 61191-4:2017 Printed board assemblies - Part 4: Sectional specification - Requirements for terminal soldered assemblies
    EN 61191-1:2013 PRINTED BOARD ASSEMBLIES - PART 1: GENERIC SPECIFICATION - REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES USING SURFACE MOUNT AND RELATED ASSEMBLY TECHNOLOGIES (IEC 61191-1:2013)
    EN 61192-1 : 2003 WORKMANSHIP REQUIREMENTS FOR SOLDERED ELECTRONIC ASSEMBLIES - PART 1: GENERAL
    EN 61191-4:2017 PRINTED BOARD ASSEMBLIES - PART 4: SECTIONAL SPECIFICATION - REQUIREMENTS FOR TERMINAL SOLDERED ASSEMBLIES
    IEC 61191-3:2017 Printed board assemblies - Part 3: Sectional specification - Requirements for through-hole mount soldered assemblies
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