IEC 60249-3-3:1991
Withdrawn
Withdrawn
A Withdrawn Standard is one, which is removed from sale, and its unique number can no longer be used. The Standard can be withdrawn and not replaced, or it can be withdrawn and replaced by a Standard with a different number.
Base materials for printed circuits - Part 3: Special materials used in connection with printed circuits - Specification No. 3: Permanent polymer coating materials (solder resist) for use in the fabrication of printed boards
Available format(s)
Hardcopy , PDF , PDF 3 Users , PDF 5 Users , PDF 9 Users
Withdrawn date
31-12-2021
Language(s)
English - French
Published date
04-06-1991
Publisher
Important note : Users cannot be edited or removed once added to your Multi user PDF.
FOREWORD
Clause
1 Scope
2 Normative references
3 Terms and definitions
4 Solder resist material properties evaluation
5 Solder resist system evaluation
6 Dimensions, quantities and tolerances of the materials
as purchased
7 Packaging
8 Marking of containers
9 Storage properties
ANNEX A (normative) - Test methods
Annex B (informative) - Test methods summary
Gives the test methods, conditions, and requirements for solder resist material as manufactured and for a solder resist system which comprises the material, the application process, and a printed board.Solder resist for the uses considered in this specification may be of two types, as specified by the purchaser.Provides three classes of requirements to reflect progressive increases in sophistication, functional performance requirements and testing severity.
| DevelopmentNote |
Also numbered as BS 4584-103.3(1992) (08/2005)
|
| DocumentType |
Standard
|
| Pages |
37
|
| PublisherName |
International Electrotechnical Committee
|
| Status |
Withdrawn
|
| Standards | Relationship |
| DIN IEC 60249-3-3:1994-06 | Identical |
| I.S. EN 60249-2-1:1994 | BASE MATERIALS FOR PRINTED CIRCUITS - PART 2: SPECIFICATIONS SPECIFICATION NO. 1: PHENOLIC CELLULOSE PAPER COPPER-CLAD LAMINATED SHEET, HIGH ELECTRICAL QUALITY |
| I.S. EN 60249-2-2:1994 | BASE MATERIALS FOR PRINTED CIRCUITS - PART 2: SPECIFICATIONS - SPECIFICATION NO. 2: PHENOLIC CELLULOSE PAPER COPPER-CLAD LAMINATED SHEET, ECONOMIC QUALITY |
| I.S. EN 60249-2-14:1995 | BASE MATERIALS FOR PRINTED CIRCUITS - PART 2: SPECIFICATIONS - SPECIFICATION NO. 14: PHENOLIC CELLULOSE PAPER COPPER-CLAD LAMINATED SHEET OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST), ECONOMIC QUALITY |
| EN 60249-2-14 : 1994 AMD 5 2000 | BASE MATERIALS FOR PRINTED CIRCUITS - PART 2: SPECIFICATIONS - SPECIFICATION NO. 14: PHENOLIC CELLULOSE PAPER COPPER-CLAD LAMINATED SHEET OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST), ECONOMIC QUALITY |
| EN 62326-4-1:1997 | Printed boards - Part 4: Rigid multilayer printed boards with interlayer connections - Sectional specification - Section 1: Capability Detail Specification - Performance levels A, B and C |
| BS 4584-15:1978 | Metal-clad base materials for printed wiring boards Adhesive coated polymeric films: PETP-F-15 and PI-F-15 |
| I.S. EN 60249-2-15:1995 | BASE MATERIALS FOR PRINTED CIRCUITS - PART 2: SPECIFICATIONS - SPECIFICATION NO. 15: FLEXIBLE COPPER-CLAD POLYIMIDE FILM, OF DEFINED FLAMMABILITY |
| I.S. EN 60249-2-11:1995 | BASE MATERIALS FOR PRINTED CIRCUITS - PART 2: SPECIFICATIONS - SPECIFICATION NO. 11: THIN EPOXIDE WOVEN GLASS FABRIC COPPER-CLAD LAMINATED SHEET, GENERAL PURPOSE GRADE, FOR USE IN THE FABRICATION OF MULTILAYER PRINTED BOARDS |
| BS EN 60249-2-18:1993 | Specifications Specification No. 18. Bismaleimide/triazine modified epoxide woven glass fabric copper-clad laminated sheet of defined flammability (vertical burning test) |
| BS EN 60249-2-17:1993 | Specifications Specification No. 17. Thin polyimide woven glass fabric copper-clad laminated sheet of defined flammability for use in the fabrication of multilayer printed boards |
| I.S. EN 60249-2-13:1995 | BASE MATERIALS FOR PRINTED CIRCUITS - PART 2: SPECIFICATIONS - SPECIFICATION NO. 13: FLEXIBLE COPPER-CLAD POLYIMIDE FILM, GENERAL PURPOSE GRADE |
| I.S. EN 60249-2-12:1994 | BASE MATERIALS FOR PRINTED CIRCUITS - PART 2: SPECIFICATIONS - SPECIFICATION NO. 12: THIN EPOXIDE WOVEN GLASS FABRIC COPPER-CLAD LAMINATED SHEET OF DEFINED FLAMMABILITY, FOR USE IN THE FABRICATION OF MULTILAYER PRINTED BOARDS |
| IEC 62326-4-1:1996 | Printed boards - Part 4: Rigid multilayer printed boards with interlayer connections - Sectional specification - Section 1: Capability detail specification - Performance levels A, B and C |
| BS EN 115:1995 | Safety rules for the construction and installation of escalators and passenger conveyors. |
| EN 60249-2-12 : 1994 AMD 4 2000 | BASE MATERIALS FOR PRINTED CIRCUITS - PART 2: SPECIFICATIONS - SPECIFICATION NO. 12: THIN EPOXIDE WOVEN GLASS FABRIC COPPER-CLAD LAMINATED SHEET OF DEFINED FLAMMABILITY, FOR USE IN THE FABRICATION OF MULTILAYER PRINTED BOARDS |
| EN 60249-2-11 : 1994 AMD 4 2000 | BASE MATERIALS FOR PRINTED CIRCUITS - PART 2: SPECIFICATIONS - SPECIFICATION NO. 11: THIN EPOXIDE WOVEN GLASS FABRIC COPPER-CLAD LAMINATED SHEET, GENERAL PURPOSE GRADE, FOR USE IN THE FABRICATION OF MULTILAYER PRINTED BOARDS |
| EN 60249-2-8 : 1994 COR 1994 | BASE MATERIALS FOR PRINTED CIRCUITS - PART 2: SPECIFICATIONS - SPECIFICATION NO. 8: FLEXIBLE COPPER-CLAD POLYESTER (PETP) FILM |
| EN 60249-2-10 : 1994 AMD 5 2000 | BASE MATERIALS FOR PRINTED CIRCUITS - PART 2: SPECIFICATIONS - SPECIFICATION NO. 10: EPOXIDE NON-WOVEN/WOVEN GLASS REINFORCED COPPER-CLAD LAMINATED SHEET OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST) |
| EN 60249-2-15 : 1994 AMD 1 1994 | BASE MATERIALS FOR PRINTED CIRCUITS - PART 2: SPECIFICATIONS - SPECIFICATION NO. 15: FLEXIBLE COPPER-CLAD POLYIMIDE FILM, OF DEFINED FLAMMABILITY |
| EN 60249-2-2 : 1994 AMD 5 2000 | BASE MATERIALS FOR PRINTED CIRCUITS - PART 2: SPECIFICATIONS - SPECIFICATION NO. 2: PHENOLIC CELLULOSE PAPER COPPER-CLAD LAMINATED SHEET, ECONOMIC QUALITY |
| EN 60249-2-9 : 1994 AMD 5 2000 | BASE MATERIALS FOR PRINTED CIRCUITS - PART 2: SPECIFICATIONS - SPECIFICATION NO. 9: EPOXIDE CELLULOSE PAPER CORE, EPOXIDE GLASS CLOTH SURFACES COPPER-CLAD LAMINATED SHEET OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST) |
| BS EN 62326-4-1:1997 | Printed boards. Rigid multilayer printed boards with interlayer connections. Sectional specification Capability detail specification. Performance levels, A, B and C |
| NF EN 62326 4-1 : 1998 | PRINTED BOARDS - PART 4: RIGID MULTILAYER PRINTED BOARDS WITH INTERLAYER CONNECTIONS - SECTIONAL SPECIFICATION - SECTION 1: CAPABILITY DETAIL SPECIFICATION PERFORMANCE LEVELS A, B AND C |
| 05/30133451 DC : 0 | EN 115 - SAFETY RULES FOR THE CONSTRUCTION AND INSTALLATION OF ESCALATORS AND MOVING WALKS |
| I.S. EN 60249-2-10:1995 | BASE MATERIALS FOR PRINTED CIRCUITS - PART 2: SPECIFICATIONS - SPECIFICATION NO. 10: EPOXIDE NON-WOVEN/WOVEN GLASS REINFORCED COPPER-CLAD LAMINATED SHEET OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST) |
| I.S. EN 60249-2-9:1995 | BASE MATERIALS FOR PRINTED CIRCUITS - PART 2: SPECIFICATIONS - SPECIFICATION NO. 9: EPOXIDE CELLULOSE PAPER CORE, EPOXIDE GLASS CLOTH SURFACES COPPER-CLAD LAMINATED SHEET OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST) |
| BS EN 60249-2-16:1993 | Specifications Specification No. 16. Polyimide woven glass fabric copper-clad laminated sheet of defined flammability (vertical burning test) |
| I.S. EN 60249-2-8:1995 | BASE MATERIALS FOR PRINTED CIRCUITS - PART 2: SPECIFICATIONS - SPECIFICATION NO. 8: FLEXIBLE COPPER-CLAD POLYESTER (PETP) FILM |
| EN 60249-2-13 : 1994 AMD 1 1994 | BASE MATERIALS FOR PRINTED CIRCUITS - PART 2: SPECIFICATIONS - SPECIFICATION NO. 13: FLEXIBLE COPPER CLAD POLYIMIDE FILM, GENERAL PURPOSE GRADE |
| EN 60249-2-1 : 1994 AMD 4 2000 | BASE MATERIALS FOR PRINTED CIRCUITS - PART 2: SPECIFICATIONS - SPECIFICATION NO. 1: PHENOLIC CELLULOSE PAPER COPPER-CLAD LAMINATED SHEET - HIGH ELECTRICAL QUALITY |
| IEC 60112:2003+AMD1:2009 CSV | Method for the determination of the proof and the comparative tracking indices of solid insulating materials |
| IEC 60250:1969 | Recommended methods for the determination of the permittivity and dielectric dissipation factor of electrical insulating materials at power, audio and radio frequencies including metre wavelengths |
| IEC 60068-2-20:2008 | Environmental testing - Part 2-20: Tests - Test T: Test methods for solderability and resistance to soldering heat of devices with leads |
| IEC 60068-2-38:2009 | Environmental testing - Part 2-38: Tests - Test Z/AD: Composite temperature/humidity cyclic test |
| IEC 60249-2-5:1987 | Base materials for printed circuits. Part 2: Specifications. Specification No. 5: Epoxide woven glass fabric copper-clad laminated sheet of defined flammability (vertical burning test) |
| IEC 60068-2-3:1969 | Basic environmental testing procedures - Part 2-3: Tests - Test Ca: Damp heat, steady state |
| IEC 60068-2-2:2007 | Environmental testing - Part 2-2: Tests - Test B: Dry heat |
| IEC 60194:2015 | Printed board design, manufacture and assembly - Terms and definitions |
| IEC 60426:2007 | Electrical insulating materials - Determination of electrolytic corrosion caused by insulating materials - Test methods |
| IEC 60249-2-7:1987 | Base materials for printed circuits. Part 2: Specifications. Specification No. 7: Phenolic cellulose paper copper-clad laminated sheet of defined flammability (vertical burning test) |
| ISO 2409:2013 | Paints and varnishes Cross-cut test |
| IEC 60068-2-14:2009 | Environmental testing - Part 2-14: Tests - Test N: Change of temperature |
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