IEC 60539-1:2016
Superseded
A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.
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Directly heated negative temperature coefficient thermistors - Part 1: Generic specification
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15-12-2022
27-04-2016
IEC 60539-1:2016 is applicable to directly heated negative temperature coefficient thermistors, typically made from transition metal oxide materials with semiconducting properties. It establishes standard terms, inspection procedures and methods of test for use in sectional and detail specifications of electronic components for quality assessment or any other purpose. IEC 60539 is applicable to directly heated negative temperature coefficient thermistors, typically made from transition metal oxide materials with semiconducting properties. It establishes standard terms, inspection procedures and methods of test for use in sectional and detail specifications of electronic components for quality assessment or any other purpose. This third edition cancels and replaces the second edition published in 2008. This edition constitutes a technical revision. Tables, figures and references have been revised.
The contents of the corrigendum of September 2017 have been included in this copy.
Committee |
TC 40
|
DevelopmentNote |
Supersedes IEC 60539. (03/2002) Stability Date: 2022. (05/2016)
|
DocumentType |
Standard
|
Pages |
117
|
PublisherName |
International Electrotechnical Committee
|
Status |
Superseded
|
SupersededBy | |
Supersedes |
Standards | Relationship |
DS EN 60539-1 : 2016 COR 2017 | Identical |
NF EN 60539-1 : 2016 | Identical |
EN 60539-1:2016/AC:2017-09 | Identical |
NEN EN IEC 60539-1 : 2016 C1 2017 | Identical |
DIN EN 60539-1:2013-10 (Draft) | Identical |
SN EN 60539-1:2016 | Identical |
NBN EN 60539-1 : 2008 | Identical |
CEI EN 60539-1 : 2009 | Identical |
UNE-EN 60539-1:2016 | Identical |
UNE-EN 60539-1:2016/AC:2017-09 | Identical |
PN EN 60539-1 : 2016 AC 2017 | Identical |
SN EN 60539-1 : 2016 COR 2017 | Identical |
PNE-FprEN 60539-1 | Identical |
BS EN 60539-1:2016 | Identical |
17/30358131 DC : 0 | BS IEC 60122-4 ED.1.0 - QUARTZ CRYSTAL UNITS OF ASSESSED QUALITY - PART 4: CRYSTAL UNITS WITH THERMISTORS |
EN 60539-2:2004/A1:2010 | DIRECTLY HEATED NEGATIVE TEMPERATURE COEFFICIENT THERMISTORS - PART 2: SECTIONAL SPECIFICATION - SURFACE MOUNT NEGATIVE TEMPERATURE COEFFICIENT THERMISTORS |
BS EN 60539-2 : 2004 | DIRECTLY HEATED NEGATIVE TEMPERATURE COEFFICIENT THERMISTORS - PART 2: SECTIONAL SPECIFICATION - SURFACE MOUNT NEGATIVE TEMPERATURE COEFFICIENT THERMISTORS |
IEC PAS 60539-1-1:2008 | Directly heated negative temperature coefficient thermistors - Part 1-1: Blank detail specification - Sensing application - Assessment level EZ |
DD IEC/PAS 60539-1-1:2008 | Directly heated negative temperature coefficient thermistors Blank detail specification. Sensing application. Assessment level EZ |
NF EN 60539-2 : 2005 AMD 1 2011 | DIRECTLY HEATED NEGATIVE TEMPERATURE COEFFICIENT THERMISTORS - PART 2: SECTIONAL SPECIFICATION - SURFACE MOUNT NEGATIVE TEMPERATURE COEFFICIENT THERMISTORS |
IEC 60539-2:2003+AMD1:2010 CSV | Directly heated negative temperature coefficient thermistors - Part 2: Sectional specification - Surface mount negative temperature coefficient thermistors |
I.S. EN 60539-2:2004 | DIRECTLY HEATED NEGATIVE TEMPERATURE COEFFICIENT THERMISTORS - PART 2: SECTIONAL SPECIFICATION - SURFACE MOUNT NEGATIVE TEMPERATURE COEFFICIENT THERMISTORS |
IEC 61193-2:2007 | Quality assessment systems - Part 2: Selection and use of sampling plans for inspection of electronic components and packages |
IEC 60068-1:2013 | Environmental testing - Part 1: General and guidance |
IEC 60068-2-58:2015+AMD1:2017 CSV | Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD) |
IEC 60068-2-27:2008 | Environmental testing - Part 2-27: Tests - Test Ea and guidance: Shock |
IEC 60068-2-20:2008 | Environmental testing - Part 2-20: Tests - Test T: Test methods for solderability and resistance to soldering heat of devices with leads |
IEC 61249-2-7:2002 | Materials for printed boards and other interconnecting structures - Part 2-7: Reinforced base materials clad and unclad - Epoxide woven E-glass laminated sheet of defined flammability (vertical burning test), copper-clad |
IEC 60068-2-21:2006 | Environmental testing - Part 2-21: Tests - Test U: Robustness of terminations and integral mounting devices |
IEC 60068-2-11:1981 | Basic environmental testing procedures - Part 2-11: Tests - Test Ka: Salt mist |
IEC 60068-2-31:2008 | Environmental testing - Part 2-31: Tests - Test Ec: Rough handling shocks, primarily for equipment-type specimens |
IEC 60027-1:1992 | Letters symbols to be used in electrical technology - Part 1: General |
IEC 60068-2-38:2009 | Environmental testing - Part 2-38: Tests - Test Z/AD: Composite temperature/humidity cyclic test |
IEC 60410:1973 | Sampling plans and procedures for inspection by attributes |
IEC 60294:2012 | Measurement of the dimensions of a cylindrical component with axial terminations |
IEC 60068-2-54:2006 | Environmental testing - Part 2-54: Tests - Test Ta: Solderability testing of electronic components by the wetting balance method |
IEC 60068-2-17:1994 | Basic environmental testing procedures - Part 2-17: Tests - Test Q: Sealing |
IEC 60068-2-2:2007 | Environmental testing - Part 2-2: Tests - Test B: Dry heat |
IEC 60062:2016 | Marking codes for resistors and capacitors |
ISO 80000-1:2009 | Quantities and units — Part 1: General |
IEC 60717:2012 | Method for the determination of the space required by capacitors and resistors with unidirectional terminations |
IEC 60068-2-1:2007 | Environmental testing - Part 2-1: Tests - Test A: Cold |
IEC 60068-2-14:2009 | Environmental testing - Part 2-14: Tests - Test N: Change of temperature |
IEC 60068-2-52:2017 | Environmental testing - Part 2-52: Tests - Test Kb: Salt mist, cyclic (sodium chloride solution) |
IEC 60068-2-69:2017 | Environmental testing - Part 2-69: Tests - Test Te/Tc: Solderability testing of electronic components and printed boards by the wetting balance (force measurement) method |
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