IEC 60747-15:2010
Superseded
A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.
View Superseded by
Semiconductor devices - Discrete devices - Part 15: Isolated power semiconductor devices
Hardcopy , PDF , PDF 3 Users , PDF 5 Users , PDF 9 Users
22-10-2024
English, English - French
16-12-2010
Important note : Users cannot be edited or removed once added to your Multi user PDF.
IEC 60747-15:2010 gives the requirements for isolated power semiconductor devices excluding devices with incorporated control circuits. These requirements are additional to those given in other parts of IEC 60747 for the corresponding non-isolated power devices. The main changes with respect to previous edition are listed below.
a) Clause 3, 4 and 5 were re-edited and some of them were combined to other sub clauses.
b) Clause 6, 7 were re-edited as a part of "Measuring methods" with amendment of suitable addition and deletion.
c) Clause 8 was amended by suitable addition and deletion.
d) Annex C, D and Bibliography were deleted.
This publication is to be read in conjunction with IEC 60747-1:2006.
| Committee |
TC 47/SC 47E
|
| DevelopmentNote |
To be read in conjunction with IEC 60747-1. (12/2010) Stability Date: 2018. (09/2017)
|
| DocumentType |
Standard
|
| Pages |
54
|
| PublisherName |
International Electrotechnical Committee
|
| Status |
Superseded
|
| SupersededBy | |
| Supersedes |
| Standards | Relationship |
| NBN EN 60747-15 : 2012 | Identical |
| NEN EN IEC 60747-15 : 2012 | Identical |
| UNE-EN 60747-15:2012 | Identical |
| BS EN 60747-15:2012 | Identical |
| CEI EN 60747-15 : 2012 | Identical |
| EN 60747-15:2012 | Identical |
| DIN EN 60747-15:2012-08 | Identical |
| NF EN 60747-15 : 2013 | Identical |
| PNE-FprEN 60747-15 | Identical |
| BS EN 61215-1-2:2017 | Identical |
| BS EN 61287-1:2014 | Railway applications. Power converters installed on board rolling stock Characteristics and test methods |
| UNE-EN 61287-1:2015 | Railway applications - Power converters installed on board rolling stock - Part 1: Characteristics and test methods |
| 04/30114936 DC : DRAFT JUN 2004 | EN 50439 - RAILWAY APPLICATIONS - RELIABILITY TESTS FOR HIGH POWER SEMICONDUCTORS DEVICES - PART 1: STANDARD BASE-PLATE MODULES |
| I.S. EN 61287-1:2014 | RAILWAY APPLICATIONS - POWER CONVERTERS INSTALLED ON BOARD ROLLING STOCK - PART 1: CHARACTERISTICS AND TEST METHODS |
| IEC 61287-1:2014 | Railway applications - Power converters installed on board rolling stock - Part 1: Characteristics and test methods |
| EN 61287-1:2014/AC:2014 | RAILWAY APPLICATIONS - POWER CONVERTERS INSTALLED ON BOARD ROLLING STOCK - PART 1: CHARACTERISTICS AND TEST METHODS (IEC 61287-1:2014) |
| IEC 60112:2003+AMD1:2009 CSV | Method for the determination of the proof and the comparative tracking indices of solid insulating materials |
| IEC 60270:2000+AMD1:2015 CSV | High-voltage test techniques - Partial discharge measurements |
| IEC 60747-7:2010 | Semiconductor devices - Discrete devices - Part 7: Bipolar transistors |
| IEC 61287-1:2014 | Railway applications - Power converters installed on board rolling stock - Part 1: Characteristics and test methods |
| IEC 60749-21:2011 | Semiconductor devices - Mechanical and climatic test methods - Part 21: Solderability |
| IEC 60749-25:2003 | Semiconductor devices - Mechanical and climatic test methods - Part 25: Temperature cycling |
| IEC 60749-5:2017 | Semiconductor devices - Mechanical and climatic test methods - Part 5: Steady-state temperature humidity bias life test |
| IEC 60747-9:2007 | Semiconductor devices - Discrete devices - Part 9: Insulated-gate bipolar transistors (IGBTs) |
| IEC 60747-8:2010 | Semiconductor devices - Discrete devices - Part 8: Field-effect transistors |
| IEC 60749-15:2010 | Semiconductor devices - Mechanical and climatic test methods - Part 15: Resistance to soldering temperature for through-hole mounted devices |
| IEC 60747-1:2006+AMD1:2010 CSV | Semiconductor devices - Part 1: General |
| IEC 60749-34:2010 | Semiconductor devices - Mechanical and climatic test methods - Part 34: Power cycling |
| IEC 60749-6:2017 | Semiconductor devices - Mechanical and climatic test methods - Part 6: Storage at high temperature |
| IEC 60721-3-3:1994+AMD1:1995+AMD2:1996 CSV | Classification of environmental conditions - Part 3-3: Classification of groups of environmental parameters and their severities - Stationary use at weatherprotected locations |
| IEC 60749-10:2002 | Semiconductor devices - Mechanical and climatic test methods - Part 10: Mechanical shock |
| IEC 60747-6:2016 | Semiconductor devices - Part 6: Discrete devices - Thyristors |
| IEC 60664-1:2007 | Insulation coordination for equipment within low-voltage systems - Part 1: Principles, requirements and tests |
| IEC 60747-2:2016 | Semiconductor devices - Part 2: Discrete devices - Rectifier diodes |
| IEC 60749-12:2002 | Semiconductor devices - Mechanical and climatic test methods - Part 12: Vibration, variable frequency |
Access your standards online with a subscription
Features
-
Simple online access to standards, technical information and regulations.
-
Critical updates of standards and customisable alerts and notifications.
-
Multi-user online standards collection: secure, flexible and cost effective.