IEC 60749-23:2004+AMD1:2011 CSV
Current
The latest, up-to-date edition.
Semiconductor devices - Mechanical and climatic test methods - Part 23: High temperature operating life
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English, English - French
30-03-2011
FOREWORD
1 Scope
2 Normative references
3 Terms and definitions
4 Test apparatus
5 Procedure
6 Cool-down
7 Measurements
8 Failure criteria
9 Summary
IEC 60749-23:2004+A1:2011 is used to determine the effects of bias conditions and temperature on solid state devices over time. It simulates the device operating condition in an accelerated way, and is primarily used for device qualification and reliability monitoring. A form of high temperature bias life using a short duration, popularly known as "burn-in", may be used to screen for infant mortality related failures. The detailed use and application of burn-in is outside the scope of this standard. This consolidated version consists of the first edition (2004) and its amendment 1 (2011). Therefore, no need to order amendment in addition to this publication.
Committee |
TC 47
|
DevelopmentNote |
Supersedes IEC PAS 62189. (08/2004) Stability Date: 2020. (09/2017)
|
DocumentType |
Standard
|
Pages |
22
|
PublisherName |
International Electrotechnical Committee
|
Status |
Current
|
Supersedes |
Standards | Relationship |
NF EN 60749-23 : 2004 AMD 1 2012 | Identical |
NEN EN IEC 60749-23 : 2004 AMD 1 2011 | Identical |
I.S. EN 60749-23:2004 | Identical |
PN EN 60749-23 : 2006 AMD 1 2011 | Identical |
UNE-EN 60749-23:2005 | Identical |
BS EN 60749-23 : 2004 | Identical |
EN 60749-23:2004/A1:2011 | Identical |
DIN EN 60749-23:2011-07 | Identical |
13/30264600 DC : 0 | BS EN 60747-14-8 ED 1.0 - SEMICONDUCTOR DEVICES - PART 14-8: SEMICONDUCTOR SENSORS - CAPACITIVE DEGRADATION SENSOR OF LIQUID |
BS EN 60749-43:2017 | Semiconductor devices - Mechanical and climatic test methods Guidelines for IC reliability qualification plans |
I.S. EN 60749-34:2010 | SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 34: POWER CYCLING |
BS EN 60749-34:2010 | Semiconductor devices. Mechanical and climatic test methods Power cycling |
I.S. EN 60749-43:2017 | SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 43: GUIDELINES FOR IC RELIABILITY QUALIFICATION PLANS |
IEC 60747-8:2010 | Semiconductor devices - Discrete devices - Part 8: Field-effect transistors |
IEC 60749-34:2010 | Semiconductor devices - Mechanical and climatic test methods - Part 34: Power cycling |
EN 60749-34:2010 | Semiconductor devices - Mechanical and climatic test methods - Part 34: Power cycling |
BS IEC 60747-6:2016 | Semiconductor devices Discrete devices. Thyristors |
02/207672 DC : DRAFT JULY 2002 | IEC 60749-34 ED.1 - POWER CYCLING |
EN 60749-43:2017 | Semiconductor devices - Mechanical and climatic test methods - Part 43: Guidelines for IC reliability qualification plans |
09/30209939 DC : 0 | BS EN 60749-34 - SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 34: POWER CYCLING |
13/30264591 DC : 0 | BS EN 60747-14-6 ED 1.0 - SEMICONDUCTOR DEVICES - PART 14-6: SEMICONDUCTOR SENSORS - HUMIDITY SENSOR |
CEI EN 60749-34 : 2012 | SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 34: POWER CYCLING |
BS IEC 60747-8:2000 | Discrete semiconductor devices and integrated circuits Field-effect transistors - Additional ratings and characteristics and amds in the measuring methods for power switching field effect transistors. |
15/30269562 DC : 0 | BS EN 60749-43 - SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 43: GUIDELINES FOR LSI RELIABILITY QUALIFICATION PLANS |
CEI EN 60749-43 : 1ED 2018 | SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 43: GUIDELINES FOR IC RELIABILITY QUALIFICATION PLANS |
IEC 60747-2:2016 | Semiconductor devices - Part 2: Discrete devices - Rectifier diodes |
IEC TS 62686-1:2015 | Process management for avionics - Electronic components for aerospace, defence and high performance (ADHP) applications - Part 1: General requirements for high reliability integrated circuits and discrete semiconductors |
IEC 60747-6:2016 | Semiconductor devices - Part 6: Discrete devices - Thyristors |
UNE-EN 60749-34:2011 | Semiconductor devices - Mechanical and climatic test methods -- Part 34: Power cycling |
PD IEC/TS 62686-1:2015 | Process management for avionics. Electronic components for aerospace, defence and high performance (ADHP) applications General requirements for high reliability integrated circuits and discrete semiconductors |
13/30264596 DC : 0 | BS EN 60747-14-7 ED 1.0 - SEMICONDUCTOR DEVICES - PART 14-7: SEMICONDUCTOR SENSORS - FLOW METER |
IEC 60749-43:2017 | Semiconductor devices - Mechanical and climatic test methods - Part 43: Guidelines for IC reliability qualification plans |
IEC 60749-34:2010 | Semiconductor devices - Mechanical and climatic test methods - Part 34: Power cycling |
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