IEC 60749-8:2002
Current
The latest, up-to-date edition.
Semiconductor devices - Mechanical and climatic test methods - Part 8: Sealing
Hardcopy , PDF , PDF 3 Users , PDF 5 Users , PDF 9 Users
30-08-2002
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FOREWORD
INTRODUCTION
1 Scope and object
2 Normative references
3 General terms
3.1 Units of pressure
3.2 Standard leak rate
3.3 Measured leak rate
3.4 Equivalent standard leak rate
4 Bomb pressure test
5 Fine leak detection: radioactive krypton method
5.1 Object
5.2 General description
5.3 Personnel precautions
5.4 Procedure
5.5 Specified conditions
5.6 Gross leak detection
6 Fine leak detection: tracer gas (helium) method with mass
spectrometer
6.1 General
6.2 Method 1: specimens not filled with helium during
manufacture - Fixed method
6.3 Method 2: specimens not filled with helium during
manufacture - Flexible method
6.4 Method 3: specimens filled with helium during manufacture
6.5 Gross leak detection
7 Gross leaks, perfluorocarbon vapour method using electronic
detection apparatus
7.1 Object
7.2 General description
7.3 Test apparatus
7.4 Test method
7.5 Reject criterion
8 Gross leak - Perfluorocarbon - bubble detection method
9 Test condition E, weight-gain gross-leak detection
9.1 Object
9.2 Equipment
9.3 Procedure
9.4 Failure criteria
10 Penetrant dye gross leak detection
11 Gross leak re-test
Applicable to semiconductor devices (discrete devices and integrated circuits), it determines the leak rate of semiconductor devices.The contents of the corrigenda of April 2003 and August 2003 have been included in this copy.
| Committee |
TC 47
|
| DevelopmentNote |
Supersedes IEC 60749. (03/2008) Stability Date: 2021. (11/2017)
|
| DocumentType |
Standard
|
| Pages |
31
|
| PublisherName |
International Electrotechnical Committee
|
| Status |
Current
|
| Supersedes |
| Standards | Relationship |
| NF EN 60749-8 : 2003 | Identical |
| UNE-EN 60749-8:2004 | Identical |
| NEN EN IEC 60749-8 : 2003 | Identical |
| I.S. EN 60749-8:2003 | Identical |
| PN EN 60749-8 : 2005 | Identical |
| SN EN 60749-8 : 2003 | Identical |
| BS EN 60749-8:2003 | Identical |
| CEI EN 60749-8 : 2004 | Identical |
| EN 60749-8:2003 | Identical |
| DIN EN 60749-8:2003-12 | Identical |
| 13/30264591 DC : 0 | BS EN 60747-14-6 ED 1.0 - SEMICONDUCTOR DEVICES - PART 14-6: SEMICONDUCTOR SENSORS - HUMIDITY SENSOR |
| BS EN 60749-14:2003 | Semiconductor devices. Mechanical and climatic test methods Robustness of terminations (lead integrity) |
| I.S. EN 62572-3:2016 | FIBRE OPTIC ACTIVE COMPONENTS AND DEVICES - RELIABILITY STANDARDS - PART 3: LASER MODULES USED FOR TELECOMMUNICATION |
| I.S. EN 60749-7:2011 | SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 7: INTERNAL MOISTURE CONTENT MEASUREMENT AND THE ANALYSIS OF OTHER RESIDUAL GASES (IEC 60749-7:2011 (EQV)) |
| BS EN 60749-7:2011 | Semiconductor devices. Mechanical and climatic test methods Internal moisture content measurement and the analysis of other residual gases |
| I.S. EN 60749-14:2003 | SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 14: ROBUSTNESS OF TERMINATIONS (LEAD INTEGRITY) |
| IEC 60749-14:2003 | Semiconductor devices - Mechanical and climatic test methods - Part 14: Robustness of terminations (lead integrity) |
| 15/30323391 DC : 0 | BS EN 62572-3 - FIBRE OPTIC ACTIVE COMPONENTS AND DEVICES - RELIABILITY STANDARDS PART 3: LASER MODULES USED FOR TELECOMMUNICATION |
| 13/30277892 DC : 0 | BS EN 62572-3 ED 2.0 - FIBRE OPTIC ACTIVE COMPONENTS AND DEVICES - RELIABILITY STANDARDS - PART 3: LASER MODULES USED FOR TELECOMMUNICATION |
| 13/30264600 DC : 0 | BS EN 60747-14-8 ED 1.0 - SEMICONDUCTOR DEVICES - PART 14-8: SEMICONDUCTOR SENSORS - CAPACITIVE DEGRADATION SENSOR OF LIQUID |
| BS EN 62572-3:2016 | Fibre optic active components and devices. Reliability standards Laser modules used for telecommunication |
| IEC TS 62686-1:2015 | Process management for avionics - Electronic components for aerospace, defence and high performance (ADHP) applications - Part 1: General requirements for high reliability integrated circuits and discrete semiconductors |
| CEI EN 60749-7 : 2012 | SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 7: INTERNAL MOISTURE CONTENT MEASUREMENT AND THE ANALYSIS OF OTHER RESIDUAL GASES |
| IEC 62572-3:2016 | Fibre optic active components and devices - Reliability standards - Part 3: Laser modules used for telecommunication |
| PD IEC/TS 62686-1:2015 | Process management for avionics. Electronic components for aerospace, defence and high performance (ADHP) applications General requirements for high reliability integrated circuits and discrete semiconductors |
| 13/30264596 DC : 0 | BS EN 60747-14-7 ED 1.0 - SEMICONDUCTOR DEVICES - PART 14-7: SEMICONDUCTOR SENSORS - FLOW METER |
| CEI EN 60749-14 : 2004 | SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 14: ROBUSTNESS OF TERMINATIONS (LEAD INTEGRITY) |
| IEC 60749-7:2011 | Semiconductor devices - Mechanical and climatic test methods - Part 7: Internal moisture content measurement and the analysis of other residual gases |
| EN 62572-3:2016 | Fibre optic active components and devices - Reliability standards - Part 3: Laser modules used for telecommunication |
| EN 60749-14:2003 | Semiconductor devices - Mechanical and climatic test methods - Part 14: Robustness of terminations (lead integrity) |
| EN 60749-7:2011 | Semiconductor devices - Mechanical and climatic test methods - Part 7: Internal moisture content measurement and the analysis of other residual gases |
| IEC 60068-2-17:1994 | Basic environmental testing procedures - Part 2-17: Tests - Test Q: Sealing |
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