IEC 61188-1-1:1997
Withdrawn
A Withdrawn Standard is one, which is removed from sale, and its unique number can no longer be used. The Standard can be withdrawn and not replaced, or it can be withdrawn and replaced by a Standard with a different number.
Printed boards and printed board assemblies - Design and use - Part 1-1: Generic requirements - Flatness considerations for electronic assemblies
Hardcopy , PDF , PDF 3 Users , PDF 5 Users , PDF 9 Users
12-09-2022
English - French
26-08-1997
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FOREWORD
INTRODUCTION
1 Scope
2 Normative reference
3 Basic requirements
3.1 Design
3.2 Rigid board manufacture
3.3 Assembly
3.4 Use
4 Deviations from flatness - rigid copper-clad base
material
4.1 Causes
4.2 Prevention and correction
4.3 Test methods and requirements
5 Deviations from flatness - Unassembled rigid
printed boards
5.1 Causes
5.2 Prevention
5.3 Rectification
5.4 Requirements for flatness
5.5 Measurement methods
6 Deviations from flatness - Rigid printed board
assemblies
6.1 Causes
6.2 Prevention
6.3 Correction
7 Problems associated with placement of surface-mounted
components
7.1 Placement of components (assembly)
7.2 Requirements for 'pick-and-place' machines
8 Deviations from flatness in service
9 Prevention summary
10 Corrective action summary
Describes those factors which control the flatness of rigid printed boards and their assemblies. This standard incorporates advice regarding design, base material, unassembled printed boards, and printed board assemblies.
| Committee |
TC 91
|
| DevelopmentNote |
Also numbered as BS EN 61188-1.1 (11/2005) Stability Date: 2017. (09/2017)
|
| DocumentType |
Standard
|
| Pages |
23
|
| PublisherName |
International Electrotechnical Committee
|
| Status |
Withdrawn
|
| Standards | Relationship |
| NF EN 61188 1-1 : 1998 | Identical |
| GOST IEC 61188-1-1 : 2013 | Identical |
| NEN EN IEC 61188-1-1 : 1997 | Identical |
| I.S. EN 61188-1-1:1999 | Identical |
| PN EN 61188-1-1 : 2002 | Identical |
| SN EN 61188-1-1 : 1997 | Identical |
| UNE-EN 61188-1-1:1997 | Identical |
| CEI EN 61188-1-1 : 2001 | Identical |
| EN 61188-1-1:1997 | Identical |
| DIN EN 61188-1-1:1998-03 | Identical |
| BS EN 61192-1:2003 | Workmanship requirements for soldered electronic assemblies General |
| BS EN 61188-5-1:2002 | Printed boards and assemblies. Design and use. Attachment (land/joint) considerations Attachment (land/joint) considerations. Generic requirements |
| I.S. EN 61192-1:2003 | WORKMANSHIP REQUIREMENTS FOR SOLDERED ELECTRONIC ASSEMBLIES - GENERAL |
| BS EN 61191-1:2013 | Printed board assemblies Generic specification. Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies |
| EN 61188-5-1:2002 | Printed boards and printed board assemblies - Design and use - Part 5-1: Attachment (land/joint) considerations - Generic requirements |
| I.S. EN 61191-1:2013 | PRINTED BOARD ASSEMBLIES - PART 1: GENERIC SPECIFICATION - REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES USING SURFACE MOUNT AND RELATED ASSEMBLY TECHNOLOGIES (IEC 61191-1:2013 (EQV)) |
| IEC 61188-5-1:2002 | Printed boards and printed board assemblies - Design and use - Part 5-1: Attachment (land/joint) considerations - Generic requirements |
| BS EN 62326-4:1997 | Printed boards Rigid multilayer printed boards with interlayer connections. Sectional specification |
| I.S. EN 61188-5-1:2002 | PRINTED BOARDS AND PRINTED BOARD ASSEMBLIES - DESIGN AND USE - PART 5-1: ATTACHMENT (LAND/JOINT) CONSIDERATIONS - GENERIC REQUIREMENTS |
| IEC 61191-1:2013 | Printed board assemblies - Part 1: Generic specification - Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies |
| 11/30255124 DC : 0 | BS EN 61191-1 - PRINTED BOARD ASSEMBLIES - PART 1: GENERIC SPECIFICATION - REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES USING SURFACE MOUNT AND RELATED ASSEMBLY TECHNOLOGIES |
| IEC 61192-1:2003 | Workmanship requirements for soldered electronic assemblies - Part 1: General |
| BS EN 62326-4-1:1997 | Printed boards. Rigid multilayer printed boards with interlayer connections. Sectional specification Capability detail specification. Performance levels, A, B and C |
| EN 61191-1:2013 | PRINTED BOARD ASSEMBLIES - PART 1: GENERIC SPECIFICATION - REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES USING SURFACE MOUNT AND RELATED ASSEMBLY TECHNOLOGIES (IEC 61191-1:2013) |
| EN 61192-1:2003 | Workmanship requirements for soldered electronic assemblies - Part 1: General |
| NF EN 61188-5-1 : 2003 | PRINTED BOARDS AND PRINTED BOARD ASSEMBLIES - DESIGN AND USE - PART 5-1: ATTACHMENT (LAND/JOINT) CONSIDERATIONS - GENERIC REQUIREMENTS |
| IEC 61189-2:2006 | Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2: Test methods for materials for interconnection structures |
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