IEC 62047-3:2006
Current
The latest, up-to-date edition.
Semiconductor devices - Micro-electromechanical devices - Part 3: Thin film standard test piece for tensile testing
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English - French
15-08-2006
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FOREWORD
1 Scope
2 Normative references
3 Test piece materials
4 Test piece fabrications
5 Plane shape of test piece
6 Test piece thickness
7 Gauge mark
8 Test
9 Document attached to standard test pieces
Annex A (informative) Test piece
Specifies a standard test piece, which is used to guarantee the propriety and accuracy of a tensile testing system for thin film materials with length and width under 1 mm and thickness under 10 m, which are main structural materials for microelectromechanical systems (MEMS), micromachines and similar devices. It is based on such a concept that a tensile testing system can be guaranteed in propriety and accuracy, when the measured tensile strengths of the standard test pieces, whose tensile strength is pre-determined, are within the designated range. It also specifies the test pieces to minimize characteristics deviation among the pieces.
| DevelopmentNote |
Stability Date: 2018. (09/2017)
|
| DocumentType |
Standard
|
| Pages |
15
|
| PublisherName |
International Electrotechnical Committee
|
| Status |
Current
|
| Standards | Relationship |
| NF EN 62047-3 : 2006 | Identical |
| NEN EN IEC 62047-3 : 2006 | Identical |
| I.S. EN 62047-3:2006 | Identical |
| PN EN 62047-3 : 2006 | Identical |
| UNE-EN 62047-3:2006 | Identical |
| BS EN 62047-3:2006 | Identical |
| CEI EN 62047-3 : 2007 | Identical |
| EN 62047-3 : 2006 | Identical |
| DIN EN 62047-3:2007-02 | Identical |
| BS EN 50201:2001 | Identical |
| PNE-prEN 62047-3 | Identical |
| BS EN 62047-22:2014 | Semiconductor devices. Micro-electromechanical devices Electromechanical tensile test method for conductive thin films on flexible substrates |
| 10/30211446 DC : 0 | BS EN 62047-11 - SEMICONDUCTOR DEVICES - MICRO-ELECTROMECHANICAL DEVICES - PART 11: TEST METHOD FOR LINEAR THERMAL EXPANSION COEFFICIENTS OF MEMS MATERIALS |
| 17/30352696 DC : DRAFT SEP 2017 | BS IEC 62047-31 ED1.0 - SEMICONDUCTOR DEVICES - MICRO-ELECTROMECHANICAL DEVICES - PART 31: FOUR-POINT BENDING TEST METHOD FOR INTERFACIAL ADHESION ENERGY OF LAYERED MEMS MATERIALS |
| 08/30172398 DC : DRAFT FEB 2008 | BS EN 62047-8 - SEMICONDUCTOR DEVICES - MICRO - ELECTROMECHANICAL DEVICES - PART 8: STRIP BENDING TEST METHOD FOR TENSILE PROPERTY MEASUREMENT OF THIN FILMS |
| NF EN 62047-12 : 2012 | SEMICONDUCTOR DEVICES - MICRO-ELECTROMECHANICAL DEVICES - PART 12: BENDING FATIGUE TESTING METHOD OF THIN FILM MATERIALS USING RESONANT VIBRATION OF MEMS STRUCTURES |
| EN 62047-8:2011 | Semiconductor devices - Micro-electromechanical devices - Part 8: Strip bending test method for tensile property measurement of thin films |
| EN 62047-12 : 2011 | SEMICONDUCTOR DEVICES - MICRO-ELECTROMECHANICAL DEVICES - PART 12: BENDING FATIGUE TESTING METHOD OF THIN FILM MATERIALS USING RESONANT VIBRATION OF MEMS STRUCTURES (IEC 62047-12:2011) |
| EN 62047-11 : 2013 | SEMICONDUCTOR DEVICES - MICRO-ELECTROMECHANICAL DEVICES - PART 11: TEST METHOD FOR COEFFICIENTS OF LINEAR THERMAL EXPANSION OF FREE-STANDING MATERIALS FOR MICRO-ELECTROMECHANICAL SYSTEMS (IEC 62047-11:2013) |
| I.S. EN 62047-11:2013 | SEMICONDUCTOR DEVICES - MICRO-ELECTROMECHANICAL DEVICES - PART 11: TEST METHOD FOR COEFFICIENTS OF LINEAR THERMAL EXPANSION OF FREE-STANDING MATERIALS FOR MICRO-ELECTROMECHANICAL SYSTEMS (IEC 62047-11:2013 (EQV)) |
| CEI EN 62047-12 : 2012 | SEMICONDUCTOR DEVICES - MICROELECTROMECHANICAL DEVICES - PART 12: BENDING FATIGUE TESTING METHOD OF THIN FILM MATERIALS USING RESONANT VIBRATION OF MEMS STRUCTURES |
| I.S. EN 62047-22:2014 | SEMICONDUCTOR DEVICES - MICROELECTROMECHANICAL DEVICES - PART 22: ELECTROMECHANICAL TENSILE TEST METHOD FOR CONDUCTIVE THIN FILMS ON FLEXIBLE SUBSTRATES |
| CEI EN 62047-11 : 2014 | SEMICONDUCTOR DEVICES - MICRO-ELECTROMECHANICAL DEVICES - PART 11: TEST METHOD FOR COEFFICIENTS OF LINEAR THERMAL EXPANSION OF FREE-STANDING MATERIALS FOR MICRO-ELECTROMECHANICAL SYSTEMS |
| NF EN 62047-22 : 2014 | SEMICONDUCTOR DEVICES - MICRO-ELECTROMECHANICAL DEVICES - PART 22: ELECTROMECHANICAL TENSILE TEST METHOD FOR CONDUCTIVE THIN FILMS ON FLEXIBLE SUBSTRATES |
| BS EN 62047-11:2013 | Semiconductor devices. Micro-electromechanical devices Test method for coefficients of linear thermal expansion of free-standing materials for micro-electromechanical systems |
| IEC 62047-29:2017 | Semiconductor devices - Micro-electromechanical devices - Part 29: Electromechanical relaxation test method for freestanding conductive thin-films under room temperature |
| BS EN 62047-12:2011 | Semiconductor devices. Micro-electromechanical devices Bending fatigue testing method of thin film materials using resonant vibration of MEMS structures |
| BS EN 62047-8:2011 | Semiconductor devices. Micro-electromechanical devices Strip bending test method for tensile property measurement of thin films |
| IEC 62047-11:2013 | Semiconductor devices - Micro-electromechanical devices - Part 11: Test method for coefficients of linear thermal expansion of free-standing materials for micro-electromechanical systems |
| IEC 62047-12:2011 | Semiconductor devices - Micro-electromechanical devices - Part 12: Bending fatigue testing method of thin film materials using resonant vibration of MEMS structures |
| IEC 62047-8:2011 | Semiconductor devices - Micro-electromechanical devices - Part 8: Strip bending test method for tensile property measurement of thin films |
| EN 62047-22:2014 | Semiconductor devices - Micro-electromechanical devices - Part 22: Electromechanical tensile test method for conductive thin films on flexible substrates |
| 10/30205425 DC : 0 | BS IEC 62047-12 - SEMICONDUCTOR DEVICES - MICRO-ELECTROMECHANICAL DEVICES - PART 12: A METHOD FOR FATIGUE TESTING THIN FILM MATERIALS USING THE RESONANT VIBRATION OF A MEMS STRUCTURE |
| CEI EN 62047-8 : 2012 | SEMICONDUCTOR DEVICES - MICRO-ELECTROMECHANICAL DEVICES - PART 8: STRIP BENDING TEST METHOD FOR TENSILE PROPERTY MEASUREMENT OF THIN FILMS |
| I.S. EN 62047-8:2011 | SEMICONDUCTOR DEVICES - MICRO-ELECTROMECHANICAL DEVICES - PART 8: STRIP BENDING TEST METHOD FOR TENSILE PROPERTY MEASUREMENT OF THIN FILMS |
| I.S. EN 62047-12:2011 | SEMICONDUCTOR DEVICES - MICRO-ELECTROMECHANICAL DEVICES - PART 12: BENDING FATIGUE TESTING METHOD OF THIN FILM MATERIALS USING RESONANT VIBRATION OF MEMS STRUCTURES (IEC 62047-12:2011) |
| IEC 62047-22:2014 | Semiconductor devices - Micro-electromechanical devices - Part 22: Electromechanical tensile test method for conductive thin films on flexible substrates |
| IEC 62047-2:2006 | Semiconductor devices - Micro-electromechanical devices - Part 2: Tensile testing method of thin film materials |
| ISO 17561:2016 | Fine ceramics (advanced ceramics, advanced technical ceramics) — Test method for elastic moduli of monolithic ceramics at room temperature by sonic resonance |
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