IPC D 325 : A
Current
The latest, up-to-date edition.
DOCUMENTATION REQUIREMENTS FOR PRINTED BOARDS
Hardcopy
English
01-05-1995
1.0 Scope
1.1 Purpose
1.2 Classification
1.3 Interpretation 'shall'
1.4 Documentation Media
1.5 Artwork - Generation
1.6 Presentation
1.7 Conflict - military application
1.8 Order of precedence
2.0 Applicable Documents
2.1 IPC
2.2 Department of Defense
2.3 Other documents
3.0 Requirements
3.1 Terms and Definitions
3.2 Drawing sizes and format
3.3 Title block
3.4 Titles and subtitles
3.5 Sign-off column
3.6 Multiple sheets
3.7 Master drawing number/bare board part number
3.8 Preliminary release
3.9 Initial release
3.10 Master drawing revision level/bare board revision
level
3.11 Approvals block
3.12 Revision letters
3.13 Temporary revision (optional)
3.14 Updated and/or redrawn drawings
3.15 Contract number
3.16 Application block (optional)
3.17 Commercial and government entity (cage code)
3.18 Distribution key (optional)
3.19 Material block (optional)
3.20 Configuration control
3.21 Numbering of notes
4.0 Documentation package
4.1 Documentation and electronic data
4.2 Master Drawing
4.3 Marking
4.4 Grid systems
5.0 Sample figures and examples
6.0 Master drawing notes and check list
6.1 Examples of typical notes:
6.2 Master drawing check list
7.0 Design outputs
7.1 Design verification
7.2 Final documentation package
7.3 CAD system outputs
7.4 Data transfer
7.5 Readme file
8.0 Printed board assembly drawings
8.1 Assembly drawing definition
8.2 Dash/group numbers
8.3 Printed board assembly drawing requirements
8.4 Special assembly drawing notes
8.5 Parts list (PL) definition
8.6 Separate parts list
8.7 Integral parts list
8.8 Item (find) number
8.9 Electrical component cross reference listing
8.10 Revision level control (RLC) chart (optional)
8.11 Spare component locations chart (optional)
8.12 Cover sheets (optional)
8.13 Parts information
8.14 Non-standard part information
8.15 Manufacturing tools charts (optional)
8.16 Electrostatic sensitive deviced (ESD)
8.17 Quality conformance coupons
9.0 Printed board support drawings
9.1 Fixtures
10.0 Schematic/logic diagrams
10.1 Scope
10.2 Definition schematic diagram
10.3 Referenced standards
10.4 Format
10.5 Line styles and lettering
10.6 Graphic symbols and cell libraries
10.7 Abbreviations and acronyms
10.8 Layout
10.9 Connecting lines
10.10 Junctions
10.11 Terminals
10.12 Wire leads
10.13 Interrupted paths
10.14 Mechanical linkages
10.15 Connectors
10.16 Numerical values
10.17 Multi-element symbols
10.18 Functions
10.19 Reference designations
10.20 Type designations
10.21 Unused pins
10.22 Spares
10.23 Gnd and power table
10.24 Notes on schematics
10.25 Schematic/logic diagram
10.26 Final schematic/logic
Provides general requirements for documentation necessary to fully describe end product printed boards, regardless of raw material, special fabrication requirements, layer count or end product usage. Includes master drawing requirements, board definition and artwork/photo tooling.
DevelopmentNote |
Supersedes IPC ML 975. (03/2002) Included in IPC C 106. (06/2008) Included in IPC C 105 & IPC C 1000. (07/2008)
|
DocumentType |
Standard
|
Pages |
137
|
PublisherName |
Institute of Printed Circuits
|
Status |
Current
|
Supersedes |
DSCC 11001 : 0 | PRINTED WIRING BOARD, FLEXIBLE, TYPE 1 (SINGLE-SIDED ) WITH UNSUPPORTED HOLES, WITH OR WITHOUT STIFFENER |
BS EN 61182-2-2:2012 | Printed board assembly products. Manufacturing description data and transfer methodology Sectional requirements for implementation of printed board fabrication data description |
DSCC 11004 : 0 | PRINTED WIRING BOARD, RIGID FLEX, TYPE 4 (MULTILAYERED) WITH SUPPORTED HOLES, WITH STIFFENER |
IPC 6017 : 0 | QUALIFICATION AND PERFORMANCE SPECIFICATION FOR PRINTED BOARDS CONTAINING EMBEDDED PASSIVE DEVICES |
DSCC 11005 : 0 | PRINTED WIRING BOARD, RIGID FLEX, TYPE 5 (MULTILAYER) WITH UNSUPPORTED HOLES, WITH OR WITHOUT STIFFENER |
PD IEC/PAS 61182-12:2014 | Generic requirements for printed board assembly products manufacturing description data and transfer methodology |
IEC 61182-2:2006 | Printed board assembly products - Manufacturing description data and transfer methodology - Part 2: Generic requirements |
IEC PAS 62250:2001 | Qualification and performance specification for rigid printed boards (IPC 6012A with Amendment 1) |
EN 61182-2-2:2012 | Printed board assembly products - Manufacturing description data and transfer methodology - Part 2-2: Sectional requirements for implementation of printed board fabrication data description |
IPC D 326 : A | INFORMATION REQUIREMENTS FOR MANUFACTURING PRINTED CIRCUIT BOARDS AND OTHER ELECTRONIC ASSEMBLIES |
IPC FC 250 : A1986 | SPECIFICATION FOR SINGLE AND DOUBLE-SIDED FLEXIBLE PRINTED WIRING |
IPC 6012 RUSSIAN : C | QUALIFICATION AND PERFORMANCE SPECIFICATION FOR RIGID PRINTED BOARDS |
IPC A 610 DANISH : E | ACCEPTABILITY OF ELECTRONIC ASSEMBLIES |
IPC A 610 SPANISH : E | ACCEPTABILITY OF ELECTRONIC ASSEMBLIES |
IPC A 610 ROMANIAN : E | ACCEPTABILITY OF ELECTRONIC ASSEMBLIES |
IPC 6012 POLISH : C | QUALIFICATION AND PERFORMANCE SPECIFICATION FOR RIGID PRINTED BOARDS |
IPC A 610 CZECH : E | ACCEPTABILITY OF ELECTRONIC ASSEMBLIES |
IPC A 610 GERMAN : E | ACCEPTABILITY OF ELECTRONIC ASSEMBLIES |
IPC A 610 HINDI : E2010 | ACCEPTABILITY OF ELECTRONIC ASSEMBLIES |
IPC A 610 ESTONIAN : E2010 | ACCEPTABILITY OF ELECTRONIC ASSEMBLIES |
IPC A 610 POLISH : E | ACCEPTABILITY OF ELECTRONIC ASSEMBLIES |
IPC A 610 DUTCH : F2014 | ACCEPTABILITY OF ELECTRONIC ASSEMBLIES |
IPC A 610 KOREAN : F2014 | ACCEPTABILITY OF ELECTRONIC ASSEMBLIES |
IPC 2588 : 2007 | SECTIONAL REQUIREMENTS FOR IMPLEMENTATION OF PART LIST PRODUCT DATA DESCRIPTION |
IPC 2583 : 2007 | SECTIONAL REQUIREMENTS FOR IMPLEMENTATION OF DESIGN CHARACTERISTICS FOR MANUFACTURING DATA DESCRIPTION |
IPC A 610 ITALIAN : E | ACCEPTABILITY OF ELECTRONIC ASSEMBLIES |
IPC A 610 FRENCH : F | ACCEPTABILITY OF ELECTRONIC ASSEMBLIES |
IPC A 610 SWEDISH : E | ACCEPTABILITY OF ELECTRONIC ASSEMBLIES |
IPC A 610 HUNGARIAN : E | ACCEPTABILITY OF ELECTRONIC ASSEMBLIES |
IPC 6013 GERMAN : B | QUALIFICATION AND PERFORMANCE SPECIFICATION FOR FLEXIBLE PRINTED BOARDS |
IPC 6012 FRENCH : C | QUALIFICATION AND PERFORMANCE SPECIFICATION FOR RIGID PRINTED BOARDS |
IPC 2582 : 2007 | SECTIONAL REQUIREMENTS FOR IMPLEMENTATION OF ADMINISTRATIVE METHODS FOR MANUFACTURING DATA DESCRIPTION |
IPC D 949 : 1987 | RIGID MULTILAYER PRINTED BOARDS, DESIGN STANDARD FOR, |
IPC PWB-CRT-SG : A2007 | PCB DESIGNERS CERTIFICATION STUDY GUIDE |
IPC A 610 CHINESE : F | ACCEPTABILITY OF ELECTRONIC ASSEMBLIES |
IPC A 610 TURKISH : E2010 | ACCEPTABILITY OF ELECTRONIC ASSEMBLIES |
IPC A 610 JAPANESE : E | ACCEPTABILITY OF ELECTRONIC ASSEMBLIES |
IPC A 610 RUSSIAN : D | ACCEPTABILITY OF ELECTRONIC ASSEMBLIES |
IPC A 610 VIETNAMESE : E | ACCEPTABILITY OF ELECTRONIC ASSEMBLIES |
IPC 6018 CHINESE : B | QUALIFICATION AND PERFORMANCE SPECIFICATION FOR HIGH FREQUENCY (MICROWAVE) PRINTED BOARD |
DSCC 11002 : 0 | PRINTED WIRING BOARD, FLEXIBLE, TYPE 2 (DOUBLE-SIDED) WITH PLATED THROUGH HOLES, WITH OR WITHOUT STIFFENER |
IPC 2615 : 0 | PRINTED BOARD DIMENSIONS AND TOLERANCES |
IPC D 356 : B | BARE SUBSTRATE ELECTRICAL TEST DATA FORMAT |
IEC 61182-1:1994 | Printed boards - Electronic data description and transfer - Part 1: Printed board description in digital form |
IPC 2581 : B | GENERIC REQUIREMENTS FOR PRINTED BOARD ASSEMBLY PRODUCTS MANUFACTURING DESCRIPTION DATA AND TRANSFER METHODOLOGY |
IEC PAS 61182-12:2014 | Generic requirements for printed board assembly products manufacturing description data and transfer methodology |
DSCC 11003 : 0 | PRINTED WIRING BOARD, FLEXIBLE, TYPE 3 (MULTILAYER) WITH PLATED THROUGH HOLES, WITH OR WITHOUT STIFFENER |
I.S. EN 61182-7:1998 | PRINTED BOARDS - ELECTRONIC DATA DESCRIPTION AND TRANSFER - PART 7: BARE BOARD ELECTRIC TEST INFORMATION IN DIGITAL FORM |
IEC 61182-2-2:2012 | Printed board assembly products - Manufacturing description data and transfer methodology - Part 2-2: Sectional requirements for implementation of printed board fabrication data description |
IEC PAS 62249:2001 | Qualification and performance specification for flexible printed boards |
IEC 61182-7:1995 | Printed boards - Electronic data description and transfer - Part 7: Bare board electrical test information in digital form |
BS IEC 61182-2:2006 | Printed board assembly products. Manufacturing description data and transfer methodology Generic requirements |
EN 61182-7 : 1995 | PRINTED BOARDS - ELECTRONIC DATA DESCRIPTION AND TRANSFER - PART 7: BARE BOARD ELECTRIC TEST INFORMATION IN DIGITAL FORM |
BS EN 61182-7:1996 | Printed boards. Electronic data description and transfer Bare board electric test information in digital form |
I.S. EN 61182-2-2:2012 | PRINTED BOARD ASSEMBLY PRODUCTS - MANUFACTURING DESCRIPTION DATA AND TRANSFER METHODOLOGY - PART 2-2: SECTIONAL REQUIREMENTS FOR IMPLEMENTATION OF PRINTED BOARD FABRICATION DATA DESCRIPTION (IEC 61182-2-2:2012 (EQV)) |
DSCC 10012 : 0 | PRINTED WIRING BOARD, RIGID, MULTILAYERED, GENERAL DRAWING |
ASME Y14.24 : 2012 | TYPES AND APPLICATIONS OF ENGINEERING DRAWINGS - ENGINEERING DRAWING AND RELATED DOCUMENTATION PRACTICES |
ASME Y14.100 : 2017 | ENGINEERING DRAWING PRACTICES - ENGINEERING DRAWING AND RELATED DOCUMENTATION PRACTICES |
DSCC 10013 : 0 | PRINTED WIRING BOARD, RIGID, MULTILAYERED, TYPE 3 WITH PLATED-THROUGH HOLES |
DSCC 11006 : 0 | PRINTED WIRING BOARD, FLEXIBLE RIGID FLEX, GENERAL DRAWING |
IPC 6013 CHINESE : B | QUALIFICATION AND PERFORMANCE SPECIFICATION FOR FLEXIBLE PRINTED BOARDS |
DSCC 10014:2012 | PRINTED WIRING BOARD, RIGID, MULTILAYERED, TYPE 4 WITH BLIND AND BURIED VIAS |
IPC 2220 : LATEST | IPC 2220 FAMILY OF DESIGN DOCUMENTS |
IPC D 326 : A | INFORMATION REQUIREMENTS FOR MANUFACTURING PRINTED CIRCUIT BOARDS AND OTHER ELECTRONIC ASSEMBLIES |
IPC S 100 : LATEST | STANDARDS AND SPECIFICATIONS MANUAL |
IPC 2615 : 0 | PRINTED BOARD DIMENSIONS AND TOLERANCES |
IPC M 105 : LATEST | RIGID PRINTED BOARD MANUAL |
IPC M 106 : LATEST | TECHNOLOGY REFERENCE FOR DESIGN MANUAL |
Access your standards online with a subscription
Features
-
Simple online access to standards, technical information and regulations.
-
Critical updates of standards and customisable alerts and notifications.
-
Multi-user online standards collection: secure, flexible and cost effective.