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IPC D 325 : A

Current

Current

The latest, up-to-date edition.

DOCUMENTATION REQUIREMENTS FOR PRINTED BOARDS

Available format(s)

Hardcopy

Language(s)

English

Published date

01-05-1995

€179.64
Excluding VAT

1.0 Scope
1.1 Purpose
1.2 Classification
1.3 Interpretation 'shall'
1.4 Documentation Media
1.5 Artwork - Generation
1.6 Presentation
1.7 Conflict - military application
1.8 Order of precedence
2.0 Applicable Documents
2.1 IPC
2.2 Department of Defense
2.3 Other documents
3.0 Requirements
3.1 Terms and Definitions
3.2 Drawing sizes and format
3.3 Title block
3.4 Titles and subtitles
3.5 Sign-off column
3.6 Multiple sheets
3.7 Master drawing number/bare board part number
3.8 Preliminary release
3.9 Initial release
3.10 Master drawing revision level/bare board revision
      level
3.11 Approvals block
3.12 Revision letters
3.13 Temporary revision (optional)
3.14 Updated and/or redrawn drawings
3.15 Contract number
3.16 Application block (optional)
3.17 Commercial and government entity (cage code)
3.18 Distribution key (optional)
3.19 Material block (optional)
3.20 Configuration control
3.21 Numbering of notes
4.0 Documentation package
4.1 Documentation and electronic data
4.2 Master Drawing
4.3 Marking
4.4 Grid systems
5.0 Sample figures and examples
6.0 Master drawing notes and check list
6.1 Examples of typical notes:
6.2 Master drawing check list
7.0 Design outputs
7.1 Design verification
7.2 Final documentation package
7.3 CAD system outputs
7.4 Data transfer
7.5 Readme file
8.0 Printed board assembly drawings
8.1 Assembly drawing definition
8.2 Dash/group numbers
8.3 Printed board assembly drawing requirements
8.4 Special assembly drawing notes
8.5 Parts list (PL) definition
8.6 Separate parts list
8.7 Integral parts list
8.8 Item (find) number
8.9 Electrical component cross reference listing
8.10 Revision level control (RLC) chart (optional)
8.11 Spare component locations chart (optional)
8.12 Cover sheets (optional)
8.13 Parts information
8.14 Non-standard part information
8.15 Manufacturing tools charts (optional)
8.16 Electrostatic sensitive deviced (ESD)
8.17 Quality conformance coupons
9.0 Printed board support drawings
9.1 Fixtures
10.0 Schematic/logic diagrams
10.1 Scope
10.2 Definition schematic diagram
10.3 Referenced standards
10.4 Format
10.5 Line styles and lettering
10.6 Graphic symbols and cell libraries
10.7 Abbreviations and acronyms
10.8 Layout
10.9 Connecting lines
10.10 Junctions
10.11 Terminals
10.12 Wire leads
10.13 Interrupted paths
10.14 Mechanical linkages
10.15 Connectors
10.16 Numerical values
10.17 Multi-element symbols
10.18 Functions
10.19 Reference designations
10.20 Type designations
10.21 Unused pins
10.22 Spares
10.23 Gnd and power table
10.24 Notes on schematics
10.25 Schematic/logic diagram
10.26 Final schematic/logic

Provides general requirements for documentation necessary to fully describe end product printed boards, regardless of raw material, special fabrication requirements, layer count or end product usage. Includes master drawing requirements, board definition and artwork/photo tooling.

DevelopmentNote
Supersedes IPC ML 975. (03/2002) Included in IPC C 106. (06/2008) Included in IPC C 105 & IPC C 1000. (07/2008)
DocumentType
Standard
Pages
137
PublisherName
Institute of Printed Circuits
Status
Current
Supersedes

DSCC 11001 : 0 PRINTED WIRING BOARD, FLEXIBLE, TYPE 1 (SINGLE-SIDED ) WITH UNSUPPORTED HOLES, WITH OR WITHOUT STIFFENER
BS EN 61182-2-2:2012 Printed board assembly products. Manufacturing description data and transfer methodology Sectional requirements for implementation of printed board fabrication data description
DSCC 11004 : 0 PRINTED WIRING BOARD, RIGID FLEX, TYPE 4 (MULTILAYERED) WITH SUPPORTED HOLES, WITH STIFFENER
IPC 6017 : 0 QUALIFICATION AND PERFORMANCE SPECIFICATION FOR PRINTED BOARDS CONTAINING EMBEDDED PASSIVE DEVICES
DSCC 11005 : 0 PRINTED WIRING BOARD, RIGID FLEX, TYPE 5 (MULTILAYER) WITH UNSUPPORTED HOLES, WITH OR WITHOUT STIFFENER
PD IEC/PAS 61182-12:2014 Generic requirements for printed board assembly products manufacturing description data and transfer methodology
IEC 61182-2:2006 Printed board assembly products - Manufacturing description data and transfer methodology - Part 2: Generic requirements
IEC PAS 62250:2001 Qualification and performance specification for rigid printed boards (IPC 6012A with Amendment 1)
EN 61182-2-2:2012 Printed board assembly products - Manufacturing description data and transfer methodology - Part 2-2: Sectional requirements for implementation of printed board fabrication data description
IPC D 326 : A INFORMATION REQUIREMENTS FOR MANUFACTURING PRINTED CIRCUIT BOARDS AND OTHER ELECTRONIC ASSEMBLIES
IPC FC 250 : A1986 SPECIFICATION FOR SINGLE AND DOUBLE-SIDED FLEXIBLE PRINTED WIRING
IPC 6012 RUSSIAN : C QUALIFICATION AND PERFORMANCE SPECIFICATION FOR RIGID PRINTED BOARDS
IPC A 610 DANISH : E ACCEPTABILITY OF ELECTRONIC ASSEMBLIES
IPC A 610 SPANISH : E ACCEPTABILITY OF ELECTRONIC ASSEMBLIES
IPC A 610 ROMANIAN : E ACCEPTABILITY OF ELECTRONIC ASSEMBLIES
IPC 6012 POLISH : C QUALIFICATION AND PERFORMANCE SPECIFICATION FOR RIGID PRINTED BOARDS
IPC A 610 CZECH : E ACCEPTABILITY OF ELECTRONIC ASSEMBLIES
IPC A 610 GERMAN : E ACCEPTABILITY OF ELECTRONIC ASSEMBLIES
IPC A 610 HINDI : E2010 ACCEPTABILITY OF ELECTRONIC ASSEMBLIES
IPC A 610 ESTONIAN : E2010 ACCEPTABILITY OF ELECTRONIC ASSEMBLIES
IPC A 610 POLISH : E ACCEPTABILITY OF ELECTRONIC ASSEMBLIES
IPC A 610 DUTCH : F2014 ACCEPTABILITY OF ELECTRONIC ASSEMBLIES
IPC A 610 KOREAN : F2014 ACCEPTABILITY OF ELECTRONIC ASSEMBLIES
IPC 2588 : 2007 SECTIONAL REQUIREMENTS FOR IMPLEMENTATION OF PART LIST PRODUCT DATA DESCRIPTION
IPC 2583 : 2007 SECTIONAL REQUIREMENTS FOR IMPLEMENTATION OF DESIGN CHARACTERISTICS FOR MANUFACTURING DATA DESCRIPTION
IPC A 610 ITALIAN : E ACCEPTABILITY OF ELECTRONIC ASSEMBLIES
IPC A 610 FRENCH : F ACCEPTABILITY OF ELECTRONIC ASSEMBLIES
IPC A 610 SWEDISH : E ACCEPTABILITY OF ELECTRONIC ASSEMBLIES
IPC A 610 HUNGARIAN : E ACCEPTABILITY OF ELECTRONIC ASSEMBLIES
IPC 6013 GERMAN : B QUALIFICATION AND PERFORMANCE SPECIFICATION FOR FLEXIBLE PRINTED BOARDS
IPC 6012 FRENCH : C QUALIFICATION AND PERFORMANCE SPECIFICATION FOR RIGID PRINTED BOARDS
IPC 2582 : 2007 SECTIONAL REQUIREMENTS FOR IMPLEMENTATION OF ADMINISTRATIVE METHODS FOR MANUFACTURING DATA DESCRIPTION
IPC D 949 : 1987 RIGID MULTILAYER PRINTED BOARDS, DESIGN STANDARD FOR,
IPC PWB-CRT-SG : A2007 PCB DESIGNERS CERTIFICATION STUDY GUIDE
IPC A 610 CHINESE : F ACCEPTABILITY OF ELECTRONIC ASSEMBLIES
IPC A 610 TURKISH : E2010 ACCEPTABILITY OF ELECTRONIC ASSEMBLIES
IPC A 610 JAPANESE : E ACCEPTABILITY OF ELECTRONIC ASSEMBLIES
IPC A 610 RUSSIAN : D ACCEPTABILITY OF ELECTRONIC ASSEMBLIES
IPC A 610 VIETNAMESE : E ACCEPTABILITY OF ELECTRONIC ASSEMBLIES
IPC 6018 CHINESE : B QUALIFICATION AND PERFORMANCE SPECIFICATION FOR HIGH FREQUENCY (MICROWAVE) PRINTED BOARD
DSCC 11002 : 0 PRINTED WIRING BOARD, FLEXIBLE, TYPE 2 (DOUBLE-SIDED) WITH PLATED THROUGH HOLES, WITH OR WITHOUT STIFFENER
IPC 2615 : 0 PRINTED BOARD DIMENSIONS AND TOLERANCES
IPC D 356 : B BARE SUBSTRATE ELECTRICAL TEST DATA FORMAT
IEC 61182-1:1994 Printed boards - Electronic data description and transfer - Part 1: Printed board description in digital form
IPC 2581 : B GENERIC REQUIREMENTS FOR PRINTED BOARD ASSEMBLY PRODUCTS MANUFACTURING DESCRIPTION DATA AND TRANSFER METHODOLOGY
IEC PAS 61182-12:2014 Generic requirements for printed board assembly products manufacturing description data and transfer methodology
DSCC 11003 : 0 PRINTED WIRING BOARD, FLEXIBLE, TYPE 3 (MULTILAYER) WITH PLATED THROUGH HOLES, WITH OR WITHOUT STIFFENER
I.S. EN 61182-7:1998 PRINTED BOARDS - ELECTRONIC DATA DESCRIPTION AND TRANSFER - PART 7: BARE BOARD ELECTRIC TEST INFORMATION IN DIGITAL FORM
IEC 61182-2-2:2012 Printed board assembly products - Manufacturing description data and transfer methodology - Part 2-2: Sectional requirements for implementation of printed board fabrication data description
IEC PAS 62249:2001 Qualification and performance specification for flexible printed boards
IEC 61182-7:1995 Printed boards - Electronic data description and transfer - Part 7: Bare board electrical test information in digital form
BS IEC 61182-2:2006 Printed board assembly products. Manufacturing description data and transfer methodology Generic requirements
EN 61182-7 : 1995 PRINTED BOARDS - ELECTRONIC DATA DESCRIPTION AND TRANSFER - PART 7: BARE BOARD ELECTRIC TEST INFORMATION IN DIGITAL FORM
BS EN 61182-7:1996 Printed boards. Electronic data description and transfer Bare board electric test information in digital form
I.S. EN 61182-2-2:2012 PRINTED BOARD ASSEMBLY PRODUCTS - MANUFACTURING DESCRIPTION DATA AND TRANSFER METHODOLOGY - PART 2-2: SECTIONAL REQUIREMENTS FOR IMPLEMENTATION OF PRINTED BOARD FABRICATION DATA DESCRIPTION (IEC 61182-2-2:2012 (EQV))
DSCC 10012 : 0 PRINTED WIRING BOARD, RIGID, MULTILAYERED, GENERAL DRAWING
ASME Y14.24 : 2012 TYPES AND APPLICATIONS OF ENGINEERING DRAWINGS - ENGINEERING DRAWING AND RELATED DOCUMENTATION PRACTICES
ASME Y14.100 : 2017 ENGINEERING DRAWING PRACTICES - ENGINEERING DRAWING AND RELATED DOCUMENTATION PRACTICES
DSCC 10013 : 0 PRINTED WIRING BOARD, RIGID, MULTILAYERED, TYPE 3 WITH PLATED-THROUGH HOLES
DSCC 11006 : 0 PRINTED WIRING BOARD, FLEXIBLE RIGID FLEX, GENERAL DRAWING
IPC 6013 CHINESE : B QUALIFICATION AND PERFORMANCE SPECIFICATION FOR FLEXIBLE PRINTED BOARDS
DSCC 10014:2012 PRINTED WIRING BOARD, RIGID, MULTILAYERED, TYPE 4 WITH BLIND AND BURIED VIAS

IPC 2220 : LATEST IPC 2220 FAMILY OF DESIGN DOCUMENTS
IPC D 326 : A INFORMATION REQUIREMENTS FOR MANUFACTURING PRINTED CIRCUIT BOARDS AND OTHER ELECTRONIC ASSEMBLIES
IPC S 100 : LATEST STANDARDS AND SPECIFICATIONS MANUAL
IPC 2615 : 0 PRINTED BOARD DIMENSIONS AND TOLERANCES
IPC M 105 : LATEST RIGID PRINTED BOARD MANUAL
IPC M 106 : LATEST TECHNOLOGY REFERENCE FOR DESIGN MANUAL

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