ISO 9455-2:1993
Current
Current
The latest, up-to-date edition.
Soft soldering fluxes — Test methods — Part 2: Determination of non-volatile matter, ebulliometric method
Available format(s)
Hardcopy , PDF , PDF 3 Users , PDF 5 Users , PDF 9 Users
Language(s)
English, French
Published date
15-04-1993
Important note : Users cannot be edited or removed once added to your Multi user PDF.
The method specified is based on evaporating a weighed amount of the flux sample in an ebulliometer until the entire volatile part is driven off, which is determined by following the graph of distillation temperature against time. The flux residue is considered as the non-volatile content of flux. Applies only to flux with a non-volatile content of 10 % or more.
| Committee |
ISO/TC 44/SC 12
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| DocumentType |
Standard
|
| Pages |
5
|
| ProductNote |
This standard also refers to CEI 68-2-20
|
| PublisherName |
International Organization for Standardization
|
| Status |
Current
|
| Standards | Relationship |
| NBN EN ISO 9455-2 : 1996 | Identical |
| NBN EN 29455-5 : 1993 | Identical |
| NEN EN ISO 9455-2 : 1995 | Identical |
| NS EN ISO 9455-2 : 1ED 1995 | Identical |
| I.S. EN ISO 9455-2:1996 | Identical |
| PN EN ISO 9455-2 : 2002 | Identical |
| SN EN ISO 9455-2 : 1996 | Identical |
| UNI EN ISO 9455-2 : 1997 | Identical |
| UNE-EN ISO 9455-2:1996 | Identical |
| BS EN ISO 9455-2:1996 | Identical |
| EN ISO 9455-2:1995 | Identical |
| NF EN ISO 9455-2 : 1995 | Identical |
| DIN EN ISO 9455-2:1995-11 | Identical |
| BS IEC 61189-5-4 : 2015 | TEST METHODS FOR ELECTRICAL MATERIALS, PRINTED BOARDS AND OTHER INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 5-4: GENERAL TEST METHODS FOR MATERIALS AND ASSEMBLIES - SOLDER ALLOYS AND FLUXED AND NON-FLUXED SOLID WIRE FOR PRINTED BOARD ASSEMBLIES |
| BS EN ISO 9454-1:2016 | Soft soldering fluxes. Classification and requirements Classification, labelling and packaging |
| 12/30270787 DC : 0 | BS EN ISO 9455-5 - SOFT SOLDERING FLUXES - TEST METHODS - PART 5: COPPER MIRROR TEST |
| 12/30274796 DC : 0 | BS IEC 61189-5-2 ED.1 - TEST METHODS FOR ELECTRICAL MATERIALS, INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 5-2: TEST METHODS FOR PRINTED BOARD ASSEMBLIES: SOLDERING FLUX |
| 14/30309692 DC : 0 | BS EN 61189-5-1 ED 1.0 - TEST METHODS FOR ELECTRICAL MATERIALS, INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 5-1: TEST METHODS FOR PRINTED BOARD ASSEMBLIES AND MATERIALS USED IN MANUFACTURING ELECTRONIC ASSEMBLIES - GUIDANCE DOCUMENTS AND HANDBOOKS |
| CEI EN 61189-5-2 : 2016 | TEST METHODS FOR ELECTRICAL MATERIALS, PRINTED BOARDS AND OTHER INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 5-2: GENERAL TEST METHODS FOR MATERIALS AND ASSEMBLIES - SOLDERING FLUX FOR PRINTED BOARD ASSEMBLIES |
| I.S. EN ISO 9455-14:2017 | SOFT SOLDERING FLUXES - TEST METHODS - PART 14: ASSESSMENT OF TACKINESS OF FLUX RESIDUES (ISO 9455-14:2017) |
| UNE-EN ISO 9455-14:2018 | Soft soldering fluxes - Test methods - Part 14: Assessment of tackiness of flux residues (ISO 9455-14:2017) |
| IEC 61189-5-2:2015 | Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-2: General test methods for materials and assemblies - Soldering flux for printed board assemblies |
| ISO 9454-1:2016 | Soft soldering fluxes Classification and requirements Part 1: Classification, labelling and packaging |
| BS EN ISO 9454-2:2001 | Soft soldering fluxes. Classification and requirements Performance requirements |
| EN 61189-5-1:2016 | Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-1: General test methods for materials and assemblies - Guidance for printed board assemblies |
| ONORM EN ISO 9455-5 : 2014 | SOFT SOLDERING FLUXES - TEST METHODS - PART 5: COPPER MIRROR TEST (ISO 9455-5:2014) |
| EN 61189-5-4:2015 | Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-4: General test methods for materials and assemblies - Solder alloys and fluxed and non-fluxed solid wire for printed board assemblies |
| EN 61189-5-3:2015 | Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-3: General test methods for materials and assemblies - Soldering paste for printed board assemblies |
| I.S. EN ISO 9455-6:1997 | SOFT SOLDERING FLUXES - TEST METHODS - PART 6: DETERMINATION AND DETECTION OF HALIDE (EXCLUDING FLUORIDE) CONTENT |
| BS IEC 61189-5-3 : 2015 | TEST METHODS FOR ELECTRICAL MATERIALS, PRINTED BOARDS AND OTHER INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 5-3: GENERAL TEST METHODS FOR MATERIALS AND ASSEMBLIES - SOLDERING PASTE FOR PRINTED BOARD ASSEMBLIES |
| BS EN 61189-5:2006 | Test methods for electrical materials, interconnection structures and assemblies Test methods for printed board assemblies |
| BS EN 61189-5-2:2015 | Test methods for electrical materials, printed boards and other interconnection structures and assemblies General test methods for materials and assemblies. Soldering flux for printed board assemblies |
| BS EN ISO 9455-15:2017 | Soft soldering fluxes. Test methods Copper corrosion test |
| 12/30274800 DC : 0 | BS IEC 61189-5-3 ED.1 - TEST METHODS FOR ELECTRICAL MATERIALS, INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 5-3: TEST METHODS FOR PRINTED BOARD ASSEMBLIES: SOLDERING PASTE |
| NF EN 61189-5 : 2008 | TEST METHODS FOR ELECTRICAL MATERIALS, INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 5: TEST METHODS FOR PRINTED BOARD ASSEMBLIES |
| DIN EN ISO 9455-3:1994-11 | SOFT SOLDERING FLUXES - TEST METHODS - PART 3: DETERMINATION OF ACID VALUE, POTENTIOMETRIC AND VISUAL TITRATION METHODS |
| BS EN 61189-5-1:2016 | Test methods for electrical materials, printed boards and other interconnection structures and assemblies General test methods for materials and assemblies. Guidance for printed board assemblies |
| IEC 61189-5-4:2015 | Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-4: General test methods for materials and assemblies - Solder alloys and fluxed and non-fluxed solid wire for printed board assemblies |
| BS EN ISO 9455-6:1997 | Soft soldering fluxes. Test methods Determination and detection of halide (excluding fluoride) content |
| I.S. EN ISO 9454-2:2000 | SOFT SOLDERING FLUXES - CLASSIFICATION AND REQUIREMENTS - PART 2: PERFORMANCE REQUIREMENTS |
| BS EN 61189-5-4:2015 | Test methods for electrical materials, printed boards and other interconnection structures and assemblies General test methods for materials and assemblies. Solder alloys and fluxed and non-fluxed solid wire for printed board assemblies |
| 16/30337155 DC : 0 | BS EN ISO 9455-14 - SOFT SOLDERING FLUXES - TEST METHODS - PART 14: ASSESSMENT OF TACKINESS OF FLUX RESIDUES |
| 14/30285529 DC : 0 | BS EN ISO 9454-1 - SOFT SOLDERING FLUXES - CLASSIFICATION AND REQUIREMENTS - PART 1: CLASSIFICATION, LABELLING AND PACKAGING |
| BS EN 61189-5-3:2015 | Test methods for electrical materials, printed boards and other interconnection structures and assemblies General test methods for materials and assemblies. Soldering paste for printed board assemblies |
| BS EN ISO 9455-5:2014 | Soft soldering fluxes. Test methods Copper mirror test |
| DIN EN ISO 9454-1:2016-07 | SOFT SOLDERING FLUXES - CLASSIFICATION AND REQUIREMENTS - PART 1: CLASSIFICATION, LABELLING AND PACKAGING (ISO 9454-1:2016) |
| UNE-EN ISO 9454-1:2016 | Soft soldering fluxes - Classification and requirements - Part 1: Classification, labelling and packaging (ISO 9454-1:2016) |
| I.S. EN ISO 9454-1:2016 | SOFT SOLDERING FLUXES - CLASSIFICATION AND REQUIREMENTS - PART 1: CLASSIFICATION, LABELLING AND PACKAGING (ISO 9454-1:2016) |
| I.S. EN 61189-5:2006 | TEST METHODS FOR ELECTRICAL MATERIALS, INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 5: TEST METHODS FOR PRINTED BOARD ASSEMBLIES |
| EN ISO 9455-14:2017 | Soft soldering fluxes - Test methods - Part 14: Assessment of tackiness of flux residues (ISO 9455-14:2017) |
| IEC 61189-5:2006 | Test methods for electrical materials, interconnection structures and assemblies - Part 5: Test methods for printed board assemblies |
| EN ISO 9454-2:2000 | Soft soldering fluxes - Classification and requirements - Part 2: Performance requirements (ISO 9454-2:1998) |
| EN ISO 9455-5:2014 | Soft soldering fluxes - Test methods - Part 5: Copper mirror test (ISO 9455-5:2014) |
| 12/30274804 DC : 0 | BS IEC 61189-5-4 ED.1 - TEST METHODS FOR ELECTRICAL MATERIALS, INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 5-4: TEST METHODS FOR PRINTED BOARD ASSEMBLIES: SOLDER ALLOYS AND FLUXED AND NON-FLUXED SOLID WIRE |
| BS EN ISO 9455-14:2017 | Soft soldering fluxes. Test methods Assessment of tackiness of flux residues |
| UNI EN ISO 9455-5 : 2014 | SOFT SOLDERING FLUXES - TEST METHODS - PART 5: COPPER MIRROR TEST |
| I.S. EN ISO 9455-5:2014 | SOFT SOLDERING FLUXES - TEST METHODS - PART 5: COPPER MIRROR TEST (ISO 9455-5:2014) |
| I.S. EN ISO 9455-15:2017 | SOFT SOLDERING FLUXES - TEST METHODS - PART 15: COPPER CORROSION TEST (ISO 9455-15:2017) |
| I.S. EN 61189-5-4:2015 | TEST METHODS FOR ELECTRICAL MATERIALS, PRINTED BOARDS AND OTHER INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 5-4: GENERAL TEST METHODS FOR MATERIALS AND ASSEMBLIES - SOLDER ALLOYS AND FLUXED AND NON-FLUXED SOLID WIRE FOR PRINTED BOARD ASSEMBLIES |
| ISO 9455-14:2017 | Soft soldering fluxes — Test methods — Part 14: Assessment of tackiness of flux residues |
| DIN EN ISO 9455-9:1995-11 | Soft soldering fluxes - Test methods - Part 9: Determination of ammonia content (ISO 9455-9:1993); German version EN ISO 9455-9:1995 |
| DIN EN ISO 9455-2:1995-11 | SOFT SOLDERING FLUXES - TEST METHODS - PART 2: DETERMINATION OF NON-VOLATILE MATTER, EBULLIOMETRIC METHOD |
| DIN EN ISO 9455-6:1997-03 | Soft soldering fluxes - Test methods - Part 6: Determination and detection of halide (excluding fluoride) content (ISO 9455-6:1995); German version EN ISO 9455-6:1997 |
| ISO 9455-3:1992 | Soft soldering fluxes — Test methods — Part 3: Determination of acid value, potentiometric and visual titration methods |
| IEC 61189-5-1:2016 | Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-1: General test methods for materials and assemblies - Guidance for printed board assemblies |
| IEC 61189-5-3:2015 | Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-3: General test methods for materials and assemblies - Soldering paste for printed board assemblies |
| ISO 9454-2:1998 | Soft soldering fluxes Classification and requirements Part 2: Performance requirements |
| ISO 9455-5:2014 | Soft soldering fluxes Test methods Part 5: Copper mirror test |
| ISO 9455-6:1995 | Soft soldering fluxes — Test methods — Part 6: Determination and detection of halide (excluding fluoride) content |
| BS EN 29455-5:1993 | Soft soldering fluxes. Test methods Copper mirror test |
| EN 29455-5:1993 | Soft soldering fluxes - Test methods - Part 5: Copper mirror test (ISO 9455-5:1992) |
| EN ISO 9455-6:1997 | Soft soldering fluxes - Test methods - Part 6: Determination and detection of halide (excluding fluoride) content (ISO 9455-6:1995) |
| EN ISO 9454-1:2016 | Soft soldering fluxes - Classification and requirements - Part 1: Classification, labelling and packaging (ISO 9454-1:2016) |
| 16/30337159 DC : 0 | BS EN ISO 9455-15 - SOFT SOLDERING FLUXES - TEST METHODS - PART 15: COPPER CORROSION TEST |
| BS IEC 61189-5-2 : 2015 | TEST METHODS FOR ELECTRICAL MATERIALS, PRINTED BOARDS AND OTHER INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 5-2: GENERAL TEST METHODS FOR MATERIALS AND ASSEMBLIES - SOLDERING FLUX FOR PRINTED BOARD ASSEMBLIES |
| UNE-EN ISO 9455-5:2015 | Soft soldering fluxes - Test methods - Part 5: Copper mirror test (ISO 9455-5:2014) |
| DIN EN ISO 9455-5:2014-10 | Soft soldering fluxes - Test methods - Part 5: Copper mirror test (ISO 9455-5:2014) |
| I.S. EN 61189-5-3:2015 | TEST METHODS FOR ELECTRICAL MATERIALS, PRINTED BOARDS AND OTHER INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 5-3: GENERAL TEST METHODS FOR MATERIALS AND ASSEMBLIES - SOLDERING PASTE FOR PRINTED BOARD ASSEMBLIES |
| I.S. EN 61189-5-2:2015 | TEST METHODS FOR ELECTRICAL MATERIALS, PRINTED BOARDS AND OTHER INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 5-2: GENERAL TEST METHODS FOR MATERIALS AND ASSEMBLIES - SOLDERING FLUX FOR PRINTED BOARD ASSEMBLIES |
| EN ISO 9455-15:2017 | Soft soldering fluxes - Test methods - Part 15: Copper corrosion test (ISO 9455-15:2017) |
| ISO 9455-15:2017 | Soft soldering fluxes — Test methods — Part 15: Copper corrosion test |
| BS EN 29454-1:1994 | Soft soldering fluxes. Classification and requirements Classification, labelling and packaging |
| BS EN ISO 9455-3:1995 | Soft soldering fluxes. Test methods Determination of acid value, potentiometric and visual titration methods |
| EN 61189-5-2:2015 | Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-2: General test methods for materials and assemblies - Soldering flux for printed board assemblies |
| DIN EN ISO 9455-12:1994-11 | SOFT SOLDERING FLUXES - TEST METHODS - PART 12: STEEL TUBE CORROSION TEST |
| EN 61189-5 : 2006 | TEST METHODS FOR ELECTRICAL MATERIALS, INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 5: TEST METHODS FOR PRINTED BOARD ASSEMBLIES |
| IEC 60068-2-20:2008 | Environmental testing - Part 2-20: Tests - Test T: Test methods for solderability and resistance to soldering heat of devices with leads |
| ISO 4791-1:1985 | Laboratory apparatus — Vocabulary relating to apparatus made essentially from glass, porcelain or vitreous silica — Part 1: Names for items of apparatus |
| ISO 9454-1:2016 | Soft soldering fluxes Classification and requirements Part 1: Classification, labelling and packaging |
| EN 29454-1:1993 | Soft soldering fluxes - Classification and requirements - Part 1: Classification, labelling and packaging (ISO 9454-1:1990) |
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