DIN EN 60068-2-2 : 1995
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ENVIRONMENTAL TESTING - PART 2-2: TESTS - TEST B: DRY HEAT |
IEC 60068-1 : 7.0
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ENVIRONMENTAL TESTING - PART 1: GENERAL AND GUIDANCE |
IEC 60068-2-20 : 5.0
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ENVIRONMENTAL TESTING - PART 2-20: TESTS - TEST T: TEST METHODS FOR SOLDERABILITY AND RESISTANCE TO SOLDERING HEAT OF DEVICES WITH LEADS |
EN 60068-2-20 : 2008
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ENVIRONMENTAL TESTING - PART 2-20: TESTS - TEST T: TEST METHODS FOR SOLDERABILITY AND RESISTANCE TO SOLDERING HEAT OF DEVICES WITH LEADS |
EN 60068-2-2 : 2007
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ENVIRONMENTAL TESTING - PART 2-2: TESTS - TEST B: DRY HEAT |
DIN EN 60068-2-20:2009-02
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ENVIRONMENTAL TESTING - PART 2-20: TESTS - TEST T: TEST METHODS FOR SOLDERABILITY AND RESISTANCE TO SOLDERING HEAT OF DEVICES WITH LEADS |
EN 60068-1 : 2014
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ENVIRONMENTAL TESTING - PART 1: GENERAL AND GUIDANCE (IEC 60068-1:2013) |
VDE 0468-1 : 2015
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UMGEBUNGSEINFLUESSE - TEIL 1: ALLGEMEINES UND LEITFADEN (IEC 60068-1:2013) |
IEC 60068-2-66 : 1.0
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ENVIRONMENTAL TESTING - TESTS - TEST CX: DAMP HEAT, STEADY STATE (UNSATURATED PRESSURIZED VAPOUR) |
ISO 9454-1 : 2016
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SOFT SOLDERING FLUXES - CLASSIFICATION AND REQUIREMENTS - PART 1: CLASSIFICATION, LABELLING AND PACKAGING |
VDE 0468-2-2 : 2008
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ENVIRONMENTAL TESTING - PART 2-2: TESTS - TEST B: DRY HEAT |
J STD 002 : D
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SOLDERABILITY TESTS FOR COMPONENT LEADS, TERMINATIONS, LUGS, TERMINALS AND WIRES |
DIN EN 60068-1 : 2015
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ENVIRONMENTAL TESTING - PART 1: GENERAL AND GUIDANCE (IEC 60068-1:2013) |
DIN EN 61190-1-3 : 2015
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ATTACHMENT MATERIALS FOR ELECTRONIC ASSEMBLY - PART 1-3: REQUIREMENTS FOR ELECTRONIC GRADE SOLDER ALLOYS AND FLUXED AND NON-FLUXED SOLID SOLDERS FOR ELECTRONIC SOLDERING APPLICATIONS |
IEC 60068-3-13 : 1ED 2016
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ENVIRONMENTAL TESTING - PART 3-13: SUPPORTING DOCUMENTATION AND GUIDANCE ON TEST T - SOLDERING |
IEC 61190-1-1 : 1.0
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ATTACHMENT MATERIALS FOR ELECTRONIC ASSEMBLY - PART 1-1: REQUIREMENTS FOR SOLDERING FLUXES FOR HIGH-QUALITY INTERCONNECTIONS IN ELECTRONICS ASSEMBLY |
IEC 60068-2-2 : 5.0:2007
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ENVIRONMENTAL TESTING - PART 2-2: TESTS - TEST B: DRY HEAT |
ISO 9453 : 2014
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SOFT SOLDER ALLOYS - CHEMICAL COMPOSITIONS AND FORMS |
DIN EN 60068-2-66:1995-06
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ENVIRONMENTAL TESTING - TEST METHODS - TEST CX: DAMP HEAT, STEADY STATE (UNSATURATED PRESSURIZED VAPOUR) |
EN 60068-2-66 : 1994
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ENVIRONMENTAL TESTING - PART 2: TEST METHODS - TEST CX: DAMP HEAT, STEADY STATE (UNSATURATED PRESSURIZED VAPOUR) |
EN 61190-1-3 : 2007 AMD 1 2010
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ATTACHMENT MATERIALS FOR ELECTRONIC ASSEMBLY - PART 1-3: REQUIREMENTS FOR ELECTRONIC GRADE SOLDER ALLOYS AND FLUXED AND NON-FLUXED SOLID SOLDER FOR ELECTRONIC SOLDERING APPLICATIONS |
J STD 003 : C
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SOLDERABILITY TESTS FOR PRINTED BOARDS |
IEC 61190-1-3 : 2.1
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ATTACHMENT MATERIALS FOR ELECTRONIC ASSEMBLY - PART 1-3: REQUIREMENTS FOR ELECTRONIC GRADE SOLDER ALLOYS AND FLUXED AND NON-FLUXED SOLID SOLDERS FOR ELECTRONIC SOLDERING APPLICATIONS |