BS EN 61192-3:2003
Withdrawn
A Withdrawn Standard is one, which is removed from sale, and its unique number can no longer be used. The Standard can be withdrawn and not replaced, or it can be withdrawn and replaced by a Standard with a different number.
Workmanship requirements for soldered electronic assemblies Through-hole mount assemblies
Hardcopy , PDF
08-05-2019
English
07-04-2003
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INTRODUCTION
1 Scope
2 Normative references
3 Terms and definitions
4 General requirements
4.1 Classification
4.2 Conflict
4.3 Inspection techniques
4.4 Interpretation of requirements
5 Component preparation processes
5.1 Lead forming
5.2 Lead protrusion and clinching
5.3 Lead cutting/cropping
5.4 Pre-tinning
6 Masking attributes
6.1 Misalignment
6.2 Improper adhesion
6.3 Thermal capability
7 Insertion of through-hole components
7.1 General requirements
7.2 Orientation and mounting criteria
7.3 Missing components
7.4 Wrong components
7.5 Damaged components
8 Soldering process attributes
8.1 General requirements
8.2 Misalignment
8.3 Damaged components
8.4 Solder joint characteristics
9 Cleaning attributes
9.1 Flux residues
9.2 Other residues
10 Rework/replacement attributes
Annex ZA (normative) Normative references to international
publications with their corresponding European publications
Provides general requirements for workmanship in through-hole mount soldered assemblies on organic substrates, on printed boards, and on similar laminates attached to the surface(s) of inorganic substrates.
| Committee |
EPL/501
|
| DevelopmentNote |
Supersedes 98/232815 DC (04/2003)
|
| DocumentType |
Standard
|
| Pages |
50
|
| PublisherName |
British Standards Institution
|
| Status |
Withdrawn
|
| Supersedes |
Specifies general requirements for workmanship in through-hole mount soldered assemblies on organic substrates, on printed boards, and on similar laminates attached to the surface(s) of inorganic substrates. It applies to assemblies that are totally through-hole or mixed assemblies that include surface-mounting or other related assembly technologies, for example, terminals, wires.
| Standards | Relationship |
| NF EN 61192-3 : 2003 | Identical |
| I.S. EN 61192-3:2003 | Identical |
| NBN EN 61192-3 : 2004 | Identical |
| IEC 61192-3:2002 | Identical |
| EN 61192-3:2003 | Identical |
| DIN EN 61192-3:2003-10 | Identical |
| SN EN 61192-3 : 2003 | Identical |
| EN 61192-4:2003 | Workmanship requirements for soldered electronic assemblies - Part 4: Terminal assemblies |
| IEC 61192-4:2002 | Workmanship requirements for soldered electronic assemblies - Part 4: Terminal assemblies |
| EN 61191-2:2017 | Printed board assemblies - Part 2: Sectional specification - Requirements for surface mount soldered assemblies |
| EN 61191-3:2017 | Printed board assemblies - Part 3: Sectional specification - Requirements for through-hole mount soldered assemblies |
| IEC 61191-1:2013 | Printed board assemblies - Part 1: Generic specification - Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies |
| IEC 61192-1:2003 | Workmanship requirements for soldered electronic assemblies - Part 1: General |
| IEC 60194:2015 | Printed board design, manufacture and assembly - Terms and definitions |
| EN 61192-2:2003 | Workmanship requirements for soldered electronic assemblies - Part 2: Surface-mount assemblies |
| IEC 61191-2:2017 | Printed board assemblies - Part 2: Sectional specification - Requirements for surface mount soldered assemblies |
| IEC 61191-4:2017 | Printed board assemblies - Part 4: Sectional specification - Requirements for terminal soldered assemblies |
| EN 61191-1:2013 | PRINTED BOARD ASSEMBLIES - PART 1: GENERIC SPECIFICATION - REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES USING SURFACE MOUNT AND RELATED ASSEMBLY TECHNOLOGIES (IEC 61191-1:2013) |
| IEC 61192-2:2003 | Workmanship requirements for soldered electronic assemblies - Part 2: Surface-mount assemblies |
| EN 61192-1:2003 | Workmanship requirements for soldered electronic assemblies - Part 1: General |
| EN 61191-4:2017 | Printed board assemblies - Part 4: Sectional specification - Requirements for terminal soldered assemblies |
| IEC 61191-3:2017 | Printed board assemblies - Part 3: Sectional specification - Requirements for through-hole mount soldered assemblies |
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