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CENELEC
EN 60068-2-66:1994

EN 60068-2-66:1994

Current

Current

The latest, up-to-date edition.

Environmental testing - Part 2-66: Test methods - Test Cx: Damp heat, steady state (unsaturated pressurized vapour)

Published date

29-08-1994

Publisher

European Committee for Standards - Electrical

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Foreword
Clause
1. Scope
2. General description
3. Description of test apparatus
4. Severities
5. Initial measurements
6. Testing
7. Intermediate measurements
8. Recovery
9. Final measurements
10. Information to be given in the relevant specification
Annexes
A. Steam table
B. Physical significance of the test
C. Determination of humidity
D. Test apparatus and handling

Provides a standard test procedure for the prupose of evaluating, in an accelerated manner, the resistance of small electrotechnical products, primarily non-hermetically sealed components, to the deteriorative effect of damp heat. The test is not intended to evaluate external effects, such as corrosion and deformation. Has the status of a basic safety publication in accordance with IEC Guide 104.

Committee
CLC/SR 104
DocumentType
Standard
PublisherName
European Committee for Standards - Electrical
Status
Current

BS EN 60674-3-8 : 2011 PLASTIC FILMS FOR ELECTRICAL PURPOSES - PART 3: SPECIFICATIONS FOR INDIVIDUAL MATERIALS - SHEET 8: BALANCED BIAXIALLY ORIENTED POLYETHYLENE NAPHTHALATE (PEN) FILMS USED FOR ELECTRICAL INSULATION (IEC 60674-3-8:2011)
BS EN IEC 61189-5-503:2017 Test methods for electrical materials, printed board and other interconnection structures and assemblies General test method for materials and assemblies. Conductive anodic filaments (CAF) testing of circuit boards
I.S. EN 60068-2-69:2017 ENVIRONMENTAL TESTING - PART 2-69: TESTS - TEST TE/TC: SOLDERABILITY TESTING OF ELECTRONIC COMPONENTS AND PRINTED BOARDS BY THE WETTING BALANCE (FORCE MEASUREMENT) METHOD
EN 61189-5-503:2017 Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 5-503: General test method for materials and assemblies - Conductive anodic filaments (CAF) testing of circuit boards
EN 62878-1-1:2015 Device embedded substrate - Part 1-1: Generic specification - Test methods
VDE 0468-2-69 : 2018 ENVIRONMENTAL TESTING - PART 2-69: TESTS - TEST TE/TC: SOLDERABILITY TESTING OF ELECTRONIC COMPONENTS AND PRINTED BOARDS BY THE WETTING BALANCE (FORCE MEASUREMENT) METHOD (IEC 60068-2-69:2017)
CEI EN 60674-3-8 : 2012 PLASTIC FILMS FOR ELECTRICAL PURPOSES - PART 3: SPECIFICATIONS FOR INDIVIDUAL MATERIALS - SHEET 8: BALANCED BIAXIALLY ORIENTED POLYETHYLENE NAPHTHALATE (PEN) FILMS USED FOR ELECTRICAL INSULATION
DIN EN 60068-2-69 : 2007 ENVIRONMENTAL TESTING - PART 2-69: TESTS - TEST TE/TC: SOLDERABILITY TESTING OF ELECTRONIC COMPONENTS AND PRINTED BOARDS BY THE WETTING BALANCE (FORCE MEASUREMENT) METHOD (IEC 60068-2-69:2017)
OVE/ONORM EN 60068-2-20 : 2009 ENVIRONMENTAL TESTING - PART 2-20: TESTS - TEST T: TEST METHODS FOR SOLDERABILITY AND RESISTANCE TO SOLDERING HEAT OF DEVICES WITH LEADS
EN 60068-2-20:2008 Environmental testing - Part 2-20: Tests - Test T: Test methods for solderability and resistance to soldering heat of devices with leads
BS EN 62878-1-1:2015 Device embedded substrate Generic specification. Test methods
CEI EN 61189-5-503 : 1ED 2017 TEST METHODS FOR ELECTRICAL MATERIALS, PRINTED BOARD AND OTHER INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 5-503: GENERAL TEST METHOD FOR MATERIALS AND ASSEMBLIES - CONDUCTIVE ANODIC FILAMENTS (CAF) TESTING OF CIRCUIT BOARDS
BS EN 60068-2-20:2008 Environmental testing Tests. Test T. Test methods for solderability and resistance to soldering heat of devices with leads
EN 60068-2-69:2017/AC:2018-03 ENVIRONMENTAL TESTING - PART 2-69: TESTS - TEST TE/TC: SOLDERABILITY TESTING OF ELECTRONIC COMPONENTS AND PRINTED BOARDS BY THE WETTING BALANCE (FORCE MEASUREMENT) METHOD (IEC 60068-2-69:2017/COR1:2018)
I.S. EN 60068-2-20:2008 ENVIRONMENTAL TESTING - PART 2-20: TESTS - TEST T: TEST METHODS FOR SOLDERABILITY AND RESISTANCE TO SOLDERING HEAT OF DEVICES WITH LEADS
BS EN 60068-2-69:2017 Environmental testing Tests. Test Te/Tc. Solderability testing of electronic components and printed boards by the wetting balance (force measurement) method
CEI EN 60068-2-69 : 2008 ENVIRONMENTAL TESTING - PART 2-69: TESTS - TEST TE/TC: SOLDERABILITY TESTING OF ELECTRONIC COMPONENTS AND PRINTED BOARDS BY THE WETTING BALANCE (FORCE MEASUREMENT) METHOD
I.S. EN 60674-3-8:2011 PLASTIC FILMS FOR ELECTRICAL PURPOSES - PART 3: SPECIFICATIONS FOR INDIVIDUAL MATERIALS - SHEET 8: BALANCED BIAXIALLY ORIENTED POLYETHYLENE NAPHTHALATE (PEN) FILMS USED FOR ELECTRICAL INSULATION
I.S. EN 61189-5-503:2017 TEST METHODS FOR ELECTRICAL MATERIALS, PRINTED BOARD AND OTHER INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 5-503: GENERAL TEST METHOD FOR MATERIALS AND ASSEMBLIES - CONDUCTIVE ANODIC FILAMENTS (CAF) TESTING OF CIRCUIT BOARDS
CEI EN 60068-2-20 : 2009 ENVIRONMENTAL TESTING - PART 2-20: TESTS - TEST T: TEST METHODS FOR SOLDERABILITY AND RESISTANCE TO SOLDERING HEAT OF DEVICES WITH LEADS
EN 60674-3-8:2011/A1:2017 PLASTIC FILMS FOR ELECTRICAL PURPOSES - PART 3: SPECIFICATIONS FOR INDIVIDUAL MATERIALS - SHEET 8: BALANCED BIAXIALLY ORIENTED POLYETHYLENE NAPHTHALATE (PEN) FILMS USED FOR ELECTRICAL INSULATION (IEC 60674-3-8:2011/A1:2016)

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