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CENELEC
EN 62258-1:2010

EN 62258-1:2010

Current

Current

The latest, up-to-date edition.

Semiconductor die products - Part 1: Procurement and use

Published date

15-10-2010

Publisher

European Committee for Standards - Electrical

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FOREWORD
INTRODUCTION
1 Scope
2 Normative references
3 Terms and definitions
4 General requirements
5 Data exchange
6 Requirements for all devices
7 Requirements for bare die and wafers with or without
   connection structures
8 Minimally-packaged devices
9 Quality, test and reliability
10 Handling and packing
11 Storage
12 Assembly
Annex A (informative) - Terminology
Annex B (informative) - Acronyms
Bibliography
Annex ZA (normative) - Normative references to international
         publications with their corresponding European
         publications

IEC 62258-1:2009 has been developed to facilitate the production, supply and use of semiconductor die products, including: - wafers, - singulated bare die, - die and wafers with attached connection structures, - minimally or partially encapsulated die and wafers. This standard defines the minimum requirements for the data that are needed to describe such die products and is intended as an aid to the design of and procurement for assemblies incorporating die products. It covers the requirements for data, including: - product identity, - product data, - die mechanical information, - test, quality, assembly and reliability information, - handling, shipping and storage information. The main changes that have been introduced in this edition have been to ensure consistency across all parts of the standard. The ordering of the subclauses, particularly in Clause 6, has been changed to be more logical and the text of some of the requirements has been amended to add requirements on further information as covered by IEC/TR 62258-4, IEC/TR 62258-7 and IEC/TR 62258-8. New requirements include information on permutability of terminals and functional elements (6.6.4) and moisture sensitivity for partially encapsulated devices (8.8).

Committee
CLC/TC 47X
DevelopmentNote
Supersedes ES 59008-1, ES 59008-2 & ES 59008-3 (11/2005)
DocumentType
Standard
PublisherName
European Committee for Standards - Electrical
Status
Current
Supersedes

CEI CLC/TR 62258-7 : 2009 SEMICONDUCTOR DIE PRODUCTS - PART 7: XML SCHEMA FOR DATA EXCHANGE
BS EN 62258-5:2006 Semiconductor die products Requirements for information concerning electrical simulation
CLC/TR 62258-7:2007 Semiconductor die products - Part 7: XML schema for data exchange
CLC/TR 62258-4:2013 Semiconductor die products - Part 4: Questionnaire for die users and suppliers
CLC/TR 62258-3:2007 Semiconductor die products - Part 3: Recommendations for good practice in handling, packing and storage
EN 62258-5 : 2006 SEMICONDUCTOR DIE PRODUCTS - PART 5: REQUIREMENTS FOR INFORMATION CONCERNING ELECTRICAL SIMULATION
S.R. CLC/TR 62258-4:2013 SEMICONDUCTOR DIE PRODUCTS - PART 4: QUESTIONNAIRE FOR DIE USERS AND SUPPLIERS (IEC/TR 62258-4:2012 (EQV))
PD CLC/TR 62258-3:2007 Semiconductor die products Recommendations for good practice in handling, packing and storage
BS EN 62258-2:2011 Semiconductor die products Exchange data formats
S.R. TR 62258-7:2007 SEMICONDUCTOR DIE PRODUCTS - PART 7: XML SCHEMA FOR DATA EXCHANGE
I.S. EN 62258-5:2006 SEMICONDUCTOR DIE PRODUCTS - PART 5: REQUIREMENTS FOR INFORMATION CONCERNING ELECTRICAL SIMULATION
CEI CLC/TR 62258-8 : 2009 SEMICONDUCTOR DIE PRODUCTS - PART 8: EXPRESS MODEL SCHEMA FOR DATA EXCHANGE
CEI EN 62258-5 : 2007 SEMICONDUCTOR DIE PRODUCTS - PART 5: REQUIREMENTS FOR INFORMATION CONCERNING ELECTRICAL SIMULATION
PD CLC/TR 62258-4:2013 Semiconductor die products Questionnaire for die users and suppliers
CEI CLC/TR 62258-4 : 2013 SEMICONDUCTOR DIE PRODUCTS - PART 4: QUESTIONNAIRE FOR DIE USERS AND SUPPLIERS
I.S. EN 62258-2:2011 SEMICONDUCTOR DIE PRODUCTS - PART 2: EXCHANGE DATA FORMATS
S.R. TR 62258-4:2007 SEMICONDUCTOR DIE PRODUCTS - PART 4: QUESTIONNAIRE FOR DIE USERS AND SUPPLIERS
CLC/TR 62258-8:2008 Semiconductor die products - Part 8: EXPRESS model schema for data exchange
BS EN 62258-6:2006 Semiconductor die products Requirements for information concerning thermal simulation
CEI EN 62258-6 : 2007 SEMICONDUCTOR DIE PRODUCTS - PART 6: REQUIREMENTS FOR INFORMATION CONCERNING THERMAL SIMULATION
I.S. CLC/TR 62258-3:2007 SEMICONDUCTOR DIE PRODUCTS - PART 3: RECOMMENDATIONS FOR GOOD PRACTICE IN HANDLING, PACKING AND STORAGE
I.S. EN 62258-6:2006 SEMICONDUCTOR DIE PRODUCTS - PART 6: REQUIREMENTS FOR INFORMATION CONCERNING THERMAL SIMULATION
CEI CLC/TR 62258-3 : 2007 SEMICONDUCTOR DIE PRODUCTS - PART 3: RECOMMENDATIONS FOR GOOD PRACTICE IN HANDLING, PACKING AND STORAGE
CEI EN 62258-2 : 2012 SEMICONDUCTOR DIE PRODUCTS - PART 2: EXCHANGE DATA FORMATS
S.R. CLC/TR 62258-8:2008 SEMICONDUCTOR DIE PRODUCTS - PART 8: EXPRESS MODEL SCHEMA FOR DATA EXCHANGE
EN 62258-6 : 2006 SEMICONDUCTOR DIE PRODUCTS - PART 6: REQUIREMENTS FOR INFORMATION CONCERNING THERMAL SIMULATION
EN 62258-2:2011 SEMICONDUCTOR DIE PRODUCTS - PART 2: EXCHANGE DATA FORMATS

MIL-STD-883 Revision K:2016 TEST METHOD STANDARD - MICROCIRCUITS
IPC J STD 026 : 0 SEMICONDUCTOR DESIGN STANDARD FOR FLIP CHIP APPLICATIONS
ISO/IEC 11179-3:2013 Information technology — Metadata registries (MDR) — Part 3: Registry metamodel and basic attributes
EN 62258-2:2011 SEMICONDUCTOR DIE PRODUCTS - PART 2: EXCHANGE DATA FORMATS
IEC 61340-5-1:2016 Electrostatics - Part 5-1: Protection of electronic devices from electrostatic phenomena - General requirements
MIL-PRF-19500 Revision P:2010 SEMICONDUCTOR DEVICES, GENERAL SPECIFICATION FOR
EIA 554 : 1996 METHOD SELECTION FOR ASSESSMENT OF NONCONFORMING LEVELS IN PARTS PER MILLION (PPM)
MIL-PRF-38534 Revision J:2015 HYBRID MICROCIRCUITS, GENERAL SPECIFICATION FOR
IEC TR 61340-5-2:2007 Electrostatics - Part 5-2: Protection of electronic devices from electrostatic phenomena - User guide
IEC 60749-27:2006+AMD1:2012 CSV Semiconductor devices - Mechanical and climatic test methods - Part27: Electrostatic discharge (ESD) sensitivity testing - Machine model (MM)
IEC 62258-5:2006 Semiconductor die products - Part 5: Requirements for information concerning electrical simulation
FED-STD-209 Revision E:1992 AIRBORNE PARTICULATE CLEANLINESS CLASSES IN CLEANROOMS AND CLEAN ZONES
IPC J STD 033C-1:2014 HANDLING, PACKING, SHIPPING AND USE OF MOISTURE, REFLOW, AND PROCESS SENSITIVE DEVICES
IPC J STD 012 : 0 IMPLEMENTATION OF FLIP CHIP AND CHIP SCALE TECHNOLOGY
IEC TR 62258-8:2008 Semiconductor die products - Part 8: EXPRESS model schema for data exchange
IEC 61360-1:2017 Standard data element types with associated classification scheme - Part 1: Definitions - Principles and methods
CLC/TR 62258-8:2008 Semiconductor die products - Part 8: EXPRESS model schema for data exchange
CLC/TR 62258-3:2007 Semiconductor die products - Part 3: Recommendations for good practice in handling, packing and storage
IEEE 1076-2008 REDLINE IEEE Standard VHDL Language Reference Manual
EN 62258-6 : 2006 SEMICONDUCTOR DIE PRODUCTS - PART 6: REQUIREMENTS FOR INFORMATION CONCERNING THERMAL SIMULATION
IEC 60749-26:2013 Semiconductor devices - Mechanical and climatic test methods - Part 26: Electrostatic discharge (ESD) sensitivity testing - Human body model (HBM)
EN 62258-5 : 2006 SEMICONDUCTOR DIE PRODUCTS - PART 5: REQUIREMENTS FOR INFORMATION CONCERNING ELECTRICAL SIMULATION
IEC TR 62258-7:2007 Semiconductor die products - Part 7: XML schema for data exchange
ISO 8879:1986 Information processing Text and office systems Standard Generalized Markup Language (SGML)
IEC 62258-2:2011 Semiconductor die products - Part 2: Exchange data formats
IEC TR 62258-3:2010 Semiconductor die products - Part 3: Recommendations for good practice in handling, packing and storage
ISO 14644-1:2015 Cleanrooms and associated controlled environments Part 1: Classification of air cleanliness by particle concentration
IEC 62258-6:2006 Semiconductor die products - Part 6: Requirements for information concerning thermal simulation
ISO 9000:2015 Quality management systems — Fundamentals and vocabulary
IPC J STD 028 : 0 PERFORMANCE STANDARD FOR CONSTRUCTION OF FLIP CHIP AND CHIP SCALE BUMPS
IEC 60191-4:2013 Mechanical standardization of semiconductor devices - Part 4: Coding system and classification into forms of package outlines for semiconductor device packages
CLC/TR 62258-4:2013 Semiconductor die products - Part 4: Questionnaire for die users and suppliers
IEC TR 62258-4:2012 Semiconductor die products - Part 4: Questionnaire for die users and suppliers
EIA 557 : 2006 STATISTICAL PROCESS CONTROL SYSTEMS
EN ISO 14644-1:2015 Cleanrooms and associated controlled environments - Part 1: Classification of air cleanliness by particle concentration (ISO 14644-1:2015)
CLC/TR 62258-7:2007 Semiconductor die products - Part 7: XML schema for data exchange

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