I.S. EN 62878-1-1:2015
Superseded
Superseded
A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.
DEVICE EMBEDDED SUBSTRATE - PART 1-1: GENERIC SPECIFICATION - TEST METHODS
Available format(s)
Hardcopy , PDF
Superseded date
09-01-2020
Language(s)
English
Published date
01-01-2015
Publisher
For Harmonized Standards, check the EU site to confirm that the Standard is cited in the Official Journal.
Only cited Standards give presumption of conformance to New Approach Directives/Regulations.
Dates of withdrawal of national standards are available from NSAI.
Important note : Users cannot be edited or removed once added to your Multi user PDF.
FOREWORD
1 Scope
2 Normative references
3 Terms, definitions and abbreviations
4 Test methods
5 Shipping inspection
Annex A (informative) - Related test methods
Bibliography
Annex ZA (normative) - Normative references to
international publications with their
corresponding European publications
Defines the test methods of passive and active device embedded substrates.
| DevelopmentNote |
For CENELEC adoptions of IEC publications, please check www.iec.ch to be sure that you have any corrigenda that may apply. (01/2017)
|
| DocumentType |
Standard
|
| Pages |
122
|
| PublisherName |
National Standards Authority of Ireland
|
| Status |
Superseded
|
| Standards | Relationship |
| EN 62878-1-1:2015 | Identical |
| IEC TS 62878-2-3:2015 | Device embedded substrate - Part 2-3: Guidelines - Design guide |
| IEC 61189-11:2013 | Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 11: Measurement of melting temperature or melting temperature ranges of solder alloys |
| IEC 62421:2007 | Electronics assembly technology - Electronic modules |
| IEC TS 62878-2-1:2015 | Device embedded substrate - Part 2-1: Guidelines - General description of technology |
| IEC 60068-1:2013 | Environmental testing - Part 1: General and guidance |
| IEC TR 62866:2014 | Electrochemical migration in printed wiring boards and assemblies - Mechanisms and testing |
| IEC 60068-2-58:2015+AMD1:2017 CSV | Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD) |
| IEC 60068-2-20:2008 | Environmental testing - Part 2-20: Tests - Test T: Test methods for solderability and resistance to soldering heat of devices with leads |
| IEC TS 62878-2-4:2015 | Device embedded substrate - Part 2-4: Guidelines - Test element groups (TEG) |
| EN 60068-2-1:2007 | Environmental testing - Part 2-1: Tests - Test A: Cold |
| IEC 61190-1-2:2014 | Attachment materials for electronic assembly - Part 1-2: Requirements for soldering pastes for high-quality interconnects in electronics assembly |
| EN 60068-2-2:2007 | Environmental testing - Part 2-2: Tests - Test B: Dry heat |
| IEC 60068-2-21:2006 | Environmental testing - Part 2-21: Tests - Test U: Robustness of terminations and integral mounting devices |
| ISO 3366:1999 | Coated abrasives Abrasive rolls |
| IEC 62137-1-3:2008 | Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-3: Cyclic drop test |
| IEC 60068-2-66:1994 | Environmental testing - Part 2: Test methods - Test Cx: Damp heat, steady state (unsaturated pressurized vapour) |
| ISO 4957:1999 | Tool steels |
| IEC 61189-1:1997+AMD1:2001 CSV | Test methods for electrical materials, interconnection structures and assemblies - Part 1: General test methods and methodology |
| ISO 9454-1:2016 | Soft soldering fluxes Classification and requirements Part 1: Classification, labelling and packaging |
| IEC 60068-2-64:2008 | Environmental testing - Part 2-64: Tests - Test Fh: Vibration, broadband random and guidance |
| IEC 60068-2-53:2010 | Environmental testing - Part 2-53: Tests and guidance - Combined climatic (temperature/humidity) and dynamic (vibration/shock) tests |
| ISO 15184:2012 | Paints and varnishes Determination of film hardness by pencil test |
| IEC 60068-2-38:2009 | Environmental testing - Part 2-38: Tests - Test Z/AD: Composite temperature/humidity cyclic test |
| EN 61189-3:2008 | Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3: Test methods for interconnection structures (printed boards) |
| ISO 6906:1984 | Vernier callipers reading to 0,02 mm |
| ISO 29864:2007 | Self adhesive tapes Measurement of breaking strength and elongation at break |
| ISO 9180:1988 | Black leads for wood-cased pencils Classification and diameters |
| ISO 6353-3:1987 | Reagents for chemical analysis — Part 3: Specifications — Second series |
| IEC 61189-3:2007 | Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3: Test methods for interconnection structures (printed boards) |
| ISO 29863:2007 | Self adhesive tapes Measurement of static shear adhesion |
| IEC 62137-1-2:2007 | Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-2: Shear strength test |
| ISO 29862:2007 | Self adhesive tapes Determination of peel adhesion properties |
| ISO 3599:1976 | Vernier callipers reading to 0,1 and 0,05 mm |
| IEC 60068-2-2:2007 | Environmental testing - Part 2-2: Tests - Test B: Dry heat |
| IEC 60194:2015 | Printed board design, manufacture and assembly - Terms and definitions |
| ISO 8512-1:1990 | Surface plates — Part 1: Cast iron |
| ISO 291:2008 | Plastics Standard atmospheres for conditioning and testing |
| IEC 60068-2-80:2005 | Environmental testing - Part 2-80: Tests - Test Fi: Vibration - Mixed mode |
| ISO 3611:2010 | Geometrical product specifications (GPS) — Dimensional measuring equipment: Micrometers for external measurements — Design and metrological characteristics |
| ISO 9453:2014 | Soft solder alloys Chemical compositions and forms |
| ISO 8512-2:1990 | Surface plates — Part 2: Granite |
| ISO 21948:2001 | Coated abrasives Plain sheets |
| IEC 60068-2-1:2007 | Environmental testing - Part 2-1: Tests - Test A: Cold |
| ISO 2409:2013 | Paints and varnishes Cross-cut test |
| IEC 60068-2-14:2009 | Environmental testing - Part 2-14: Tests - Test N: Change of temperature |
| ISO 9445-1:2009 | Continuously cold-rolled stainless steel Tolerances on dimensions and form Part 1: Narrow strip and cut lengths |
| IEC 61189-2:2006 | Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2: Test methods for materials for interconnection structures |
| EN 60194:2006 | Printed board design, manufacture and assembly - Terms and definitions |
| IEC 61190-1-3:2007+AMD1:2010 CSV | Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications |
| IEC 60068-2-30:2005 | Environmental testing - Part 2-30: Tests - Test Db: Damp heat, cyclic (12 h + 12 h cycle) |
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