IEC 60068-3-13:2016
Current
The latest, up-to-date edition.
Environmental testing - Part 3-13: Supporting documentation and guidance on Test T - Soldering
Hardcopy , PDF
English - French
13-05-2016
FOREWORD
1 Scope
2 Normative references
3 Terms, definitions and abbreviations
4 Overview
5 Component soldering - Processes
6 Soldering tests
7 Soldering tests - Methods
8 Requirements and statistical character of results
Bibliography
IEC 60068-3-13:2016 provides background information and guidance for writers and users of specifications for electric and electronic components, containing references to the test standards IEC 60068-2-20, IEC 60068-2-58, IEC 60068-2-69, IEC 60068-2-83, and to IEC 61760-1, which defines requirements to the specification of surface mounting components. This first edition cancels and replaces IEC 60068-2-44:1995 and constitutes a technical revision. This edition includes the following significant technical changes with respect to the previous edition:
- information for lead-free solders are added;
- technical update and restructuring.
| Committee |
TC 91
|
| DevelopmentNote |
Supersedes IEC 60068-2-44. Stability date: 2019. (05/2016)
|
| DocumentType |
Standard
|
| Pages |
55
|
| PublisherName |
International Electrotechnical Committee
|
| Status |
Current
|
| Supersedes |
| Standards | Relationship |
| DIN EN 60068-3-13 : 2017 | Identical |
| NF EN 60068-3-13 : 2016 | Identical |
| NBN EN 60068-3-13 : 2016 | Identical |
| NEN EN IEC 60068-3-13 : 2016 | Identical |
| PN EN 60068-3-13 : 2016 | Identical |
| DIN EN 60068-3-13 : 2012 | Identical |
| VDE 0468-3-13 : 2017 | Identical |
| BS EN 60068-3-13:2016 | Identical |
| CEI EN 60068-3-13 : 1ED 2017 | Identical |
| EN 60068-3-13:2016 | Identical |
| JIS C 60068-3-13:2018 | Identical |
| UNE-EN 60068-3-13:2016 | Identical |
| IEC 62211:2017 | Inductive components - Reliability management |
| VDE 0468-2-69 : 2018 | ENVIRONMENTAL TESTING - PART 2-69: TESTS - TEST TE/TC: SOLDERABILITY TESTING OF ELECTRONIC COMPONENTS AND PRINTED BOARDS BY THE WETTING BALANCE (FORCE MEASUREMENT) METHOD (IEC 60068-2-69:2017) |
| EN 60068-2-69:2017/AC:2018-03 | ENVIRONMENTAL TESTING - PART 2-69: TESTS - TEST TE/TC: SOLDERABILITY TESTING OF ELECTRONIC COMPONENTS AND PRINTED BOARDS BY THE WETTING BALANCE (FORCE MEASUREMENT) METHOD (IEC 60068-2-69:2017/COR1:2018) |
| I.S. EN 62211:2017 | INDUCTIVE COMPONENTS - RELIABILITY MANAGEMENT |
| I.S. EN 60068-2-69:2017 | ENVIRONMENTAL TESTING - PART 2-69: TESTS - TEST TE/TC: SOLDERABILITY TESTING OF ELECTRONIC COMPONENTS AND PRINTED BOARDS BY THE WETTING BALANCE (FORCE MEASUREMENT) METHOD |
| DIN EN 60068-2-69 : 2007 | ENVIRONMENTAL TESTING - PART 2-69: TESTS - TEST TE/TC: SOLDERABILITY TESTING OF ELECTRONIC COMPONENTS AND PRINTED BOARDS BY THE WETTING BALANCE (FORCE MEASUREMENT) METHOD (IEC 60068-2-69:2017) |
| IEC 60068-2-69:2017 | Environmental testing - Part 2-69: Tests - Test Te/Tc: Solderability testing of electronic components and printed boards by the wetting balance (force measurement) method |
| BS EN 60068-2-58 : 2015 | ENVIRONMENTAL TESTING - PART 2-58: TESTS - TEST TD: TEST METHODS FOR SOLDERABILITY, RESISTANCE TO DISSOLUTION OF METALLIZATION AND TO SOLDERING HEAT OF SURFACE MOUNTING DEVICES (SMD) |
| BS EN 60068-2-69:2017 | Environmental testing Tests. Test Te/Tc. Solderability testing of electronic components and printed boards by the wetting balance (force measurement) method |
| IEC 60068-2-58:2015+AMD1:2017 CSV | Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD) |
| I.S. EN 60068-2-58:2015 | ENVIRONMENTAL TESTING - PART 2-58: TESTS - TEST TD: TEST METHODS FOR SOLDERABILITY, RESISTANCE TO DISSOLUTION OF METALLIZATION AND TO SOLDERING HEAT OF SURFACE MOUNTING DEVICES (SMD) |
| EN 60068-2-58:2015/A1:2018 | ENVIRONMENTAL TESTING - PART 2-58: TESTS - TEST TD: TEST METHODS FOR SOLDERABILITY, RESISTANCE TO DISSOLUTION OF METALLIZATION AND TO SOLDERING HEAT OF SURFACE MOUNTING DEVICES (SMD) (IEC 60068-2-58:2015/A1:2017) |
| IEC 60749-20:2008 | Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat |
| IEC 60068-2-58:2015+AMD1:2017 CSV | Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD) |
| IEC 60068-2-20:2008 | Environmental testing - Part 2-20: Tests - Test T: Test methods for solderability and resistance to soldering heat of devices with leads |
| IEC 62137-3:2011 | Electronics assembly technology - Part 3: Selection guidance of environmental and endurance test methods for solder joints |
| IEC 60068-2-83:2011 | Environmental testing - Part 2-83: Tests - Test Tf: Solderability testing of electronic components for surface mounting devices (SMD) by the wetting balance method using solder paste |
| IEC 61760-1:2006 | Surface mounting technology - Part 1: Standard method for the specification of surface mounting components (SMDs) |
| IEC 61760-4:2015 | Surface mounting technology - Part 4: Classification, packaging, labelling and handling of moisture sensitive devices |
| IEC TR 60068-3-12:2014 | Environmental testing - Part 3-12: Supporting documentation and guidance - Method to evaluate a possible lead-free solder reflow temperature profile |
| IEC 61190-1-1:2002 | Attachment materials for electronic assembly - Part 1-1: Requirements for soldering fluxes for high-quality interconnections in electronics assembly |
| IEC 60068-2-69:2017 | Environmental testing - Part 2-69: Tests - Test Te/Tc: Solderability testing of electronic components and printed boards by the wetting balance (force measurement) method |
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