I.S. EN 61188-5-2:2003
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PRINTED BOARDS AND PRINTED BOARD ASSEMBLIES - DESIGN AND USE - PART 5-2: ATTACHMENT (LAND/JOINT) CONSIDERATIONS - DISCRETE COMPONENTS
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BS EN 61760-2:2007
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Surface mounting technology Transportation and storage conditions of surface mounting devices (SMD). Application guide
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CEI EN 61760-2 : 2008
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SURFACE MOUNTING TECHNOLOGY - PART 2: TRANSPORTATION AND STORAGE CONDITIONS OF SURFACE MOUNTING DEVICES (SMD) - APPLICATION GUIDE
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IPC 1758 : 0
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DECLARATION REQUIREMENTS FOR SHIPPING, PACK AND PACKING MATERIALS
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96/202502 DC : 0
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IEC 91/95/CDV - GUIDANCE DOCUMENT FOR TRANSPORTATION AND STORAGE CONDITIONS OF SURFACE MOUNTING DEVICES (SMDS)
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CEI EN 61760-1 : 2007
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SURFACE MOUNTING TECHNOLOGY - PART 1: STANDARD METHOD FOR THE SPECIFICATION OF SURFACE MOUNTING COMPONENTS (SMDS)
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IEC 62090:2017
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Product package labels for electronic components using bar code and two-dimensional symbologies
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EN 62090:2017
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Product package labels for electronic components using bar code and two- dimensional symbologies
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EN 61188-5-2:2003
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Printed boards and printed board assemblies - Design and use - Part 5-2: Attachment (land/joint) considerations - Discrete components
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09/30186180 DC : 0
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BS EN 61760-3 ED.1 - SURFACE-MOUNTING TECHNOLOGY - PART 3: STANDARDS METHOD FOR THE SPECIFICATION OF COMPONENTS FOR THROUGH HOLE REFLOW (THR) SOLDERING
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I.S. EN 61188-5-4:2007
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PRINTED BOARDS AND PRINTED BOARD ASSEMBLIES - DESIGN AND USE - PART 5-4: ATTACHMENT (LAND/JOINT) CONSIDERATIONS - COMPONENTS WITH J LEADS ON TWO SIDES
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I.S. EN 61760-1:2006
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SURFACE MOUNTING TECHNOLOGY - PART 1: STANDARD METHOD FOR THE SPECIFICATION OF SURFACE MOUNTING COMPONENTS (SMDS)
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EN 61760-3:2010
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Surface mounting technology - Part 3: Standard method for the specification of components for Through Hole Reflow (THR) soldering
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OVE/ONORM EN 61760-1 : 2006
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SURFACE MOUNTING TECHNOLOGY - PART 1: STANDARD METHOD FOR THE SPECIFICATION OF SURFACE MOUNTING COMPONENTS (SMDS)
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BS ISO 21067-1:2016
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Packaging. Vocabulary General terms
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BS EN 61188-5-4:2007
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Printed boards and printed board assemblies. Design and use Attachments (land/joint) considerations. Components with J leads on two sides
|
BS EN 62090:2017
|
Product package labels for electronic components using bar code and two- dimensional symbologies
|
BS EN 61760-1:2006
|
Surface mounting technology Standard method for the specification of surface mounting components (SMDs)
|
BS EN 61760-3:2010
|
Surface mounting technology Standard method for the specification of components for through hole reflow (THR) soldering
|
NF EN 61760-3 : 2010
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SURFACE MOUNTING TECHNOLOGY - PART 3: STANDARD METHOD FOR THE SPECIFICATION OF COMPONENTS FOR THROUGH HOLE REFLOW (THR) SOLDERING
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EN 61760-2:2007
|
Surface mounting technology - Part 2: Transportation and storage conditions of surface mounting devices (SMD) - Application guide
|
ISO 21067-1:2016
|
Packaging Vocabulary Part 1: General terms
|
EN 61760-1:2006
|
SURFACE MOUNTING TECHNOLOGY - PART 1: STANDARD METHOD FOR THE SPECIFICATION OF SURFACE MOUNTING COMPONENTS (SMDS)
|
OVE/ONORM EN 61760-2 : 2007
|
SURFACE MOUNTING TECHNOLOGY - PART 2: TRANSPORTATION AND STORAGE CONDITIONS OF SURFACE MOUNTING DEVICES (SMD) - APPLICATION GUIDE
|
I.S. EN 62090:2017
|
PRODUCT PACKAGE LABELS FOR ELECTRONIC COMPONENTS USING BAR CODE AND TWO-DIMENSIONAL SYMBOLOGIES
|
I.S. EN 61760-3:2010
|
SURFACE MOUNTING TECHNOLOGY - PART 3: STANDARD METHOD FOR THE SPECIFICATION OF COMPONENTS FOR THROUGH HOLE REFLOW (THR) SOLDERING
|
IEC 61188-5-4:2007
|
Printed boards and printed board assemblies - Design and use - Part 5-4: Attachment (land/joint) considerations - Components with J leads on two sides
|
IEC 61188-5-2:2003
|
Printed boards and printed board assemblies - Design and use - Part 5-2: Attachment (land/joint) considerations - Discrete components
|
IEC 61760-1:2006
|
Surface mounting technology - Part 1: Standard method for the specification of surface mounting components (SMDs)
|
16/30333617 DC : 0
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BS EN 62090 - PRODUCT PACKAGE LABELS FOR ELECTRONIC COMPONENTS USING BAR CODE AND TWO-DIMENSIONAL SYMBOLOGIES
|
CEI EN 61760-3 : 2010
|
SURFACE MOUNTING TECHNOLOGY - PART 3: STANDARD METHOD FOR THE SPECIFICATION OF COMPONENTS FOR THROUGH HOLE REFLOW (THR) SOLDERING
|
I.S. EN 61760-2:2007
|
SURFACE MOUNTING TECHNOLOGY - PART 2: TRANSPORTATION AND STORAGE CONDITIONS OF SURFACE MOUNTING DEVICES (SMD) - APPLICATION GUIDE
|
BS EN 61188-5-2:2003
|
Printed boards and assemblies. Design and use. Attachment (land/joint) considerations Discrete components
|
IEC 61760-2:2007
|
Surface mounting technology - Part 2: Transportation and storage conditions of surface mounting devices (SMD) - Application guide
|
EN 61188-5-4 : 2007
|
PRINTED BOARDS AND PRINTED BOARD ASSEMBLIES - DESIGN AND USE - PART 5-4: ATTACHMENT (LAND/JOINT) CONSIDERATIONS - COMPONENTS WITH J LEADS ON TWO SIDES
|