IEC 60749-28:2017
Superseded
A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.
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Semiconductor devices - Mechanical and climatic test methods - Part 28: Electrostatic discharge (ESD) sensitivity testing - Charged device model (CDM) - device level
Hardcopy , PDF , PDF 3 Users , PDF 5 Users , PDF 9 Users
01-03-2022
English, English - French
28-03-2017
FOREWORD
INTRODUCTION
1 Scope
2 Normative references
3 Terms and definitions
4 Required equipment
5 Periodic tester qualification, waveform records,
and waveform verification requirements
6 CDM ESD testing requirements and procedures
7 CDM classification criteria
Annex A (normative) - Verification module (metal
disc) specifications and cleaning guidelines for
verification modules and testers
Annex B (normative) - Capacitance measurement
of verification modules (metal discs) sitting on
a tester field plate dielectric
Annex C (informative) - CDM test hardware and
metrology improvements
Annex D (informative) - CDM tester electrical
schematic
Annex E (informative) - Sample oscilloscope setup
and waveform
Annex F (informative) - Field-induced CDM tester
discharge procedures
Annex G (informative) - Waveform verification
procedures
Annex H (informative) - Determining the appropriate
charge delay for full charging of a large module
or device
Annex I (informative) - Electrostatic discharge (ESD)
sensitivity testing direct contact charged device
model (DC-CDM)
Bibliography
IEC 60749-28:2017(E) establishes the procedure for testing, evaluating, and classifying devices and microcircuits according to their susceptibility (sensitivity) to damage or degradation by exposure to a defined field-induced charged device model (CDM) electrostatic discharge (ESD). All packaged semiconductor devices, thin film circuits, surface acoustic wave (SAW) devices, opto-electronic devices, hybrid integrated circuits (HICs), and multi-chip modules (MCMs) containing any of these devices are to be evaluated according to this document. To perform the tests, the devices are assembled into a package similar to that expected in the final application. This CDM document does not apply to socketed discharge model testers. This document describes the field-induced (FI) method. An alternative, the direct contact (DC) method, is described in Annex I.
The purpose of this document is to establish a test method that will replicate CDM failures and provide reliable, repeatable CDM ESD test results from tester to tester, regardless of device type. Repeatable data will allow accurate classifications and comparisons of CDM ESD sensitivity levels.
Committee |
TC 47
|
DevelopmentNote |
Stability Date: 2021. (03/2017)
|
DocumentType |
Standard
|
Pages |
44
|
PublisherName |
International Electrotechnical Committee
|
Status |
Superseded
|
SupersededBy |
Standards | Relationship |
DIN EN 60749-28 : 2018 | Identical |
EN 60749-28:2017 | Identical |
BS EN 60749-28:2017 | Identical |
NEN EN IEC 60749-28 : 2017 | Identical |
UNE-EN 60749-28:2017 | Identical |
CEI EN 60749-28 : 1ED 2017 | Identical |
PN EN 60749-28 : 2017 | Identical |
PNE-FprEN 60749-28:2016 | Identical |
NF EN 60749-28 : 2013 PR | Identical |
VDE 0884-749-28 : 2018 | Identical |
DIN EN 60749-28 : 2012 | Identical |
BS EN 62575-1:2016 | Radio frequency (RF) bulk acoustic wave (BAW) filters of assessed quality Generic specification |
BS EN 60749-43:2017 | Semiconductor devices - Mechanical and climatic test methods Guidelines for IC reliability qualification plans |
IEC 60749-43:2017 | Semiconductor devices - Mechanical and climatic test methods - Part 43: Guidelines for IC reliability qualification plans |
I.S. EN 62575-1:2016 | RADIO FREQUENCY (RF) BULK ACOUSTIC WAVE (BAW) FILTERS OF ASSESSED QUALITY - PART 1: GENERIC SPECIFICATION |
EN 62604-1:2015 | Surface acoustic wave (SAW) and bulk acoustic wave (BAW) duplexers of assessed quality - Part 1: Generic specification |
BS EN 60862-1:2015 | Surface acoustic wave (SAW) filters of assessed quality Generic specification |
EN 60749-43:2017 | Semiconductor devices - Mechanical and climatic test methods - Part 43: Guidelines for IC reliability qualification plans |
IEC 62615:2010 | Electrostatic discharge sensitivity testing - Transmission line pulse (TLP) - Component level |
IEC 62575-1:2015 | Radio frequency (RF) bulk acoustic wave (BAW) filters of assessed quality - Part 1: Generic specification |
BS EN 62604-1:2015 | Surface acoustic wave (SAW) and bulk acoustic wave (BAW) duplexers of assessed quality Generic specification |
15/30269562 DC : 0 | BS EN 60749-43 - SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 43: GUIDELINES FOR LSI RELIABILITY QUALIFICATION PLANS |
CEI EN 60749-43 : 1ED 2018 | SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 43: GUIDELINES FOR IC RELIABILITY QUALIFICATION PLANS |
IEC 62604-1:2015 | Surface acoustic wave (SAW) and bulk acoustic wave (BAW) duplexers of assessed quality - Part 1: Generic specification |
IEC 60862-1:2015 | Surface acoustic wave (SAW) filters of assessed quality - Part 1: Generic specification |
EN 60862-1:2015 | Surface acoustic wave (SAW) filters of assessed quality - Part 1: Generic specification |
BS IEC 62615:2010 | Electrostatic discharge sensitivity testing. Transmission line pulse (TLP). Component level |
I.S. EN 62604-1:2015 | SURFACE ACOUSTIC WAVE (SAW) AND BULK ACOUSTIC WAVE (BAW) DUPLEXERS OF ASSESSED QUALITY - PART 1: GENERIC SPECIFICATION |
I.S. EN 60749-43:2017 | SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 43: GUIDELINES FOR IC RELIABILITY QUALIFICATION PLANS |
I.S. EN 60862-1:2015 | SURFACE ACOUSTIC WAVE (SAW) FILTERS OF ASSESSED QUALITY - PART 1: GENERIC SPECIFICATION |
EN 62575-1:2016 | Radio frequency (RF) bulk acoustic wave (BAW) filters of assessed quality - Part 1: Generic specification |
IEC 60749-26:2013 | Semiconductor devices - Mechanical and climatic test methods - Part 26: Electrostatic discharge (ESD) sensitivity testing - Human body model (HBM) |
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