IEC 62258-1:2009
Current
Current
The latest, up-to-date edition.
Semiconductor die products - Part 1: Procurement and use
Available format(s)
Hardcopy , PDF , PDF 3 Users , PDF 5 Users , PDF 9 Users
Language(s)
English - French
Published date
07-04-2009
Publisher
Important note : Users cannot be edited or removed once added to your Multi user PDF.
IEC 62258-1:2009 has been developed to facilitate the production, supply and use of semiconductor die products, including:
- wafers,
- singulated bare die,
- die and wafers with attached connection structures,
- minimally or partially encapsulated die and wafers.
This standard defines the minimum requirements for the data that are needed to describe such die products and is intended as an aid to the design of and procurement for assemblies incorporating die products. It covers the requirements for data, including:
- product identity,
- product data,
- die mechanical information,
- test, quality, assembly and reliability information,
- handling, shipping and storage information.
The main changes that have been introduced in this edition have been to ensure consistency across all parts of the standard. The ordering of the subclauses, particularly in Clause 6, has been changed to be more logical and the text of some of the requirements has been amended to add requirements on further information as covered by IEC/TR 62258-4, IEC/TR 62258-7 and IEC/TR 62258-8. New requirements include information on permutability of terminals and functional elements (6.6.4) and moisture sensitivity for partially encapsulated devices (8.8).
| Committee |
TC 47
|
| DevelopmentNote |
Stability Date: 2020. (11/2017)
|
| DocumentType |
Standard
|
| Pages |
90
|
| PublisherName |
International Electrotechnical Committee
|
| Status |
Current
|
| Supersedes |
| Standards | Relationship |
| NF EN 62258-1 : 2011 | Identical |
| NBN EN 62258-1 : 2010 | Identical |
| NEN EN IEC 62258-1 : 2010 | Identical |
| NEN IEC 62258-1 : 2009 | Identical |
| DIN EN 62258-1 : 2011 | Identical |
| VDE 0884-101 : 2011 | Identical |
| CEI EN 62258-1 : 2011 | Identical |
| BS EN 62258-1:2010 | Identical |
| I.S. EN 62258-1:2010 | Identical |
| SN EN 62258-1 : 2005 | Identical |
| EN 62258-1:2010 | Identical |
| PN EN 62258-1 : 2011 | Identical |
| UNE-EN 62258-1:2010 | Identical |
| PNE-FprEN 62258-1 | Identical |
| CEI CLC/TR 62258-7 : 2009 | SEMICONDUCTOR DIE PRODUCTS - PART 7: XML SCHEMA FOR DATA EXCHANGE |
| 06/30123954 DC : DRAFT MAR 2006 | |
| BS EN 62258-5:2006 | Semiconductor die products Requirements for information concerning electrical simulation |
| I.S. CLC/TR 62258-3:2007 | SEMICONDUCTOR DIE PRODUCTS - PART 3: RECOMMENDATIONS FOR GOOD PRACTICE IN HANDLING, PACKING AND STORAGE |
| 04/30110525 DC : DRAFT MARCH 2004 | IEC 62258-3 ED.1 - SEMICONDUCTOR DIE PRODUCTS - PART 3 - RECOMMENDATIONS FOR GOOD PRACTICE IN HANDLING, PACKING AND STORAGE |
| IEC TR 62258-7:2007 | Semiconductor die products - Part 7: XML schema for data exchange |
| CLC/TR 62258-7:2007 | Semiconductor die products - Part 7: XML schema for data exchange |
| 06/30146849 DC : DRAFT FEB 2006 | IEC TR 62258-7 - SEMICONDUCTOR DIE PRODUCTS - PART 7: XML SCHEMA FOR DATA EXCHANGE |
| CLC/TR 62258-4:2013 | Semiconductor die products - Part 4: Questionnaire for die users and suppliers |
| CLC/TR 62258-3:2007 | Semiconductor die products - Part 3: Recommendations for good practice in handling, packing and storage |
| EN 62258-5 : 2006 | SEMICONDUCTOR DIE PRODUCTS - PART 5: REQUIREMENTS FOR INFORMATION CONCERNING ELECTRICAL SIMULATION |
| S.R. CLC/TR 62258-4:2013 | SEMICONDUCTOR DIE PRODUCTS - PART 4: QUESTIONNAIRE FOR DIE USERS AND SUPPLIERS (IEC/TR 62258-4:2012 (EQV)) |
| 05/30130553 DC : DRAFT MAR 2005 | IEC 62258-5 ED 1 - SEMICONDUCTOR DIE PRODUCTS - PART 5: REQUIREMENTS FOR INFORMATION CONCERNING ELECTRICAL SIMULATION |
| PD CLC/TR 62258-3:2007 | Semiconductor die products Recommendations for good practice in handling, packing and storage |
| PD IEC/TR 62258-4:2007 | Semiconductor die products Questionnaire for die users and suppliers |
| BS EN 62258-2:2011 | Semiconductor die products Exchange data formats |
| S.R. TR 62258-7:2007 | SEMICONDUCTOR DIE PRODUCTS - PART 7: XML SCHEMA FOR DATA EXCHANGE |
| I.S. EN 62258-5:2006 | SEMICONDUCTOR DIE PRODUCTS - PART 5: REQUIREMENTS FOR INFORMATION CONCERNING ELECTRICAL SIMULATION |
| CEI CLC/TR 62258-8 : 2009 | SEMICONDUCTOR DIE PRODUCTS - PART 8: EXPRESS MODEL SCHEMA FOR DATA EXCHANGE |
| IEC TR 62258-4:2012 | Semiconductor die products - Part 4: Questionnaire for die users and suppliers |
| CEI EN 62258-5 : 2007 | SEMICONDUCTOR DIE PRODUCTS - PART 5: REQUIREMENTS FOR INFORMATION CONCERNING ELECTRICAL SIMULATION |
| 05/30127455 DC : DRAFT JAN 2005 | IEC 62258-4 ED.1 - SEMICONDUCTOR DIE PRODUCTS - PART 4: QUESTIONNAIRE FOR DIE USERS AND SUPPLIERS |
| PD CLC/TR 62258-4:2013 | Semiconductor die products Questionnaire for die users and suppliers |
| CEI CLC/TR 62258-4 : 2013 | SEMICONDUCTOR DIE PRODUCTS - PART 4: QUESTIONNAIRE FOR DIE USERS AND SUPPLIERS |
| PD IEC/TR 62258-7:2007 | Semiconductor die products XML schema for data exchange |
| I.S. EN 62258-2:2011 | SEMICONDUCTOR DIE PRODUCTS - PART 2: EXCHANGE DATA FORMATS |
| IEC TR 62258-8:2008 | Semiconductor die products - Part 8: EXPRESS model schema for data exchange |
| S.R. TR 62258-4:2007 | SEMICONDUCTOR DIE PRODUCTS - PART 4: QUESTIONNAIRE FOR DIE USERS AND SUPPLIERS |
| PD IEC/TR 62258-8:2008 | Semiconductor die products EXPRESS model schema for data exchange |
| 05/30130559 DC : DRAFT MAR 2005 | IEC 62258-6 ED 1 - SEMICONDUCTOR DIE PRODUCTS - PART 6: REQUIREMENTS FOR INFORMATION CONCERNING THERMAL SIMULATION |
| CLC/TR 62258-8:2008 | Semiconductor die products - Part 8: EXPRESS model schema for data exchange |
| IEC TR 62258-3:2010 | Semiconductor die products - Part 3: Recommendations for good practice in handling, packing and storage |
| IEC 62258-6:2006 | Semiconductor die products - Part 6: Requirements for information concerning thermal simulation |
| IEC 62258-2:2011 | Semiconductor die products - Part 2: Exchange data formats |
| IEC 62258-5:2006 | Semiconductor die products - Part 5: Requirements for information concerning electrical simulation |
| BS PD IEC TR 62258-3 : 2005 | SEMICONDUCTOR DIE PRODUCTS - PART 3: RECOMMENDATIONS FOR GOOD PRACTICE IN HANDLING, PACKING AND STORAGE |
| 02/207675 DC : DRAFT JULY 2002 | IEC 62258-2 ED.1 - SEMICONDUCTOR DIE PRODUCTS - PART 2: EXCHANGE DATA FORMATS |
| BS EN 62258-6:2006 | Semiconductor die products Requirements for information concerning thermal simulation |
| CEI EN 62258-6 : 2007 | SEMICONDUCTOR DIE PRODUCTS - PART 6: REQUIREMENTS FOR INFORMATION CONCERNING THERMAL SIMULATION |
| I.S. EN 62258-6:2006 | SEMICONDUCTOR DIE PRODUCTS - PART 6: REQUIREMENTS FOR INFORMATION CONCERNING THERMAL SIMULATION |
| CEI CLC/TR 62258-3 : 2007 | SEMICONDUCTOR DIE PRODUCTS - PART 3: RECOMMENDATIONS FOR GOOD PRACTICE IN HANDLING, PACKING AND STORAGE |
| CEI EN 62258-2 : 2012 | SEMICONDUCTOR DIE PRODUCTS - PART 2: EXCHANGE DATA FORMATS |
| S.R. CLC/TR 62258-8:2008 | SEMICONDUCTOR DIE PRODUCTS - PART 8: EXPRESS MODEL SCHEMA FOR DATA EXCHANGE |
| EN 62258-6 : 2006 | SEMICONDUCTOR DIE PRODUCTS - PART 6: REQUIREMENTS FOR INFORMATION CONCERNING THERMAL SIMULATION |
| EN 62258-2:2011 | SEMICONDUCTOR DIE PRODUCTS - PART 2: EXCHANGE DATA FORMATS |
| MIL-STD-883 Revision K:2016 | TEST METHOD STANDARD - MICROCIRCUITS |
| IPC J STD 026 : 0 | SEMICONDUCTOR DESIGN STANDARD FOR FLIP CHIP APPLICATIONS |
| ISO/IEC 11179-3:2013 | Information technology — Metadata registries (MDR) — Part 3: Registry metamodel and basic attributes |
| IEC 61340-5-1:2016 | Electrostatics - Part 5-1: Protection of electronic devices from electrostatic phenomena - General requirements |
| MIL-PRF-19500 Revision P:2010 | SEMICONDUCTOR DEVICES, GENERAL SPECIFICATION FOR |
| EIA 554 : 1996 | METHOD SELECTION FOR ASSESSMENT OF NONCONFORMING LEVELS IN PARTS PER MILLION (PPM) |
| MIL-PRF-38534 Revision J:2015 | HYBRID MICROCIRCUITS, GENERAL SPECIFICATION FOR |
| IEC TR 61340-5-2:2007 | Electrostatics - Part 5-2: Protection of electronic devices from electrostatic phenomena - User guide |
| IEC 60749-27:2006+AMD1:2012 CSV | Semiconductor devices - Mechanical and climatic test methods - Part27: Electrostatic discharge (ESD) sensitivity testing - Machine model (MM) |
| IEC 62258-5:2006 | Semiconductor die products - Part 5: Requirements for information concerning electrical simulation |
| FED-STD-209 Revision E:1992 | AIRBORNE PARTICULATE CLEANLINESS CLASSES IN CLEANROOMS AND CLEAN ZONES |
| IPC J STD 033C-1:2014 | HANDLING, PACKING, SHIPPING AND USE OF MOISTURE, REFLOW, AND PROCESS SENSITIVE DEVICES |
| IPC J STD 012 : 0 | IMPLEMENTATION OF FLIP CHIP AND CHIP SCALE TECHNOLOGY |
| IEC TR 62258-8:2008 | Semiconductor die products - Part 8: EXPRESS model schema for data exchange |
| IEC 61360-1:2017 | Standard data element types with associated classification scheme - Part 1: Definitions - Principles and methods |
| IEEE 1076-2008 REDLINE | IEEE Standard VHDL Language Reference Manual |
| IEC 60749-26:2013 | Semiconductor devices - Mechanical and climatic test methods - Part 26: Electrostatic discharge (ESD) sensitivity testing - Human body model (HBM) |
| IEC TR 62258-7:2007 | Semiconductor die products - Part 7: XML schema for data exchange |
| ISO 8879:1986 | Information processing Text and office systems Standard Generalized Markup Language (SGML) |
| IEC 62258-2:2011 | Semiconductor die products - Part 2: Exchange data formats |
| IEC TR 62258-3:2010 | Semiconductor die products - Part 3: Recommendations for good practice in handling, packing and storage |
| ISO 14644-1:2015 | Cleanrooms and associated controlled environments Part 1: Classification of air cleanliness by particle concentration |
| IEC 62258-6:2006 | Semiconductor die products - Part 6: Requirements for information concerning thermal simulation |
| ISO 9000:2015 | Quality management systems — Fundamentals and vocabulary |
| IPC J STD 028 : 0 | PERFORMANCE STANDARD FOR CONSTRUCTION OF FLIP CHIP AND CHIP SCALE BUMPS |
| IEC 60191-4:2013 | Mechanical standardization of semiconductor devices - Part 4: Coding system and classification into forms of package outlines for semiconductor device packages |
| IEC TR 62258-4:2012 | Semiconductor die products - Part 4: Questionnaire for die users and suppliers |
| EIA 557 : 2006 | STATISTICAL PROCESS CONTROL SYSTEMS |
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