IEC TS 62686-1:2015
Superseded
Superseded
A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.
View Superseded by
Process management for avionics - Electronic components for aerospace, defence and high performance (ADHP) applications - Part 1: General requirements for high reliability integrated circuits and discrete semiconductors
Available format(s)
Hardcopy , PDF , PDF 3 Users , PDF 5 Users , PDF 9 Users
Superseded date
31-12-2021
Superseded by
Language(s)
English, Russian
Published date
22-04-2015
Publisher
Important note : Users cannot be edited or removed once added to your Multi user PDF.
FOREWORD
INTRODUCTION
1 Scope
2 Normative references
3 Terms, definitions and abbreviations
4 Technical requirements
Annex A (informative) - Test code (TC) information
Annex B (informative) - Cross-reference to STACK Specification
S/0001 revision 14
Bibliography
IEC TS 62686-1:2015(E) defines the minimum requirements for general purpose "off the shelf" COTS (commercial off-the-shelf) integrated circuits and discrete semiconductors for ADHP (aerospace, defence and high performance) applications. This Technical Specification applies to all components that can be operated in ADHP applications within the manufacturers' publicly available data sheet limits in conjunction with IEC TS 62239-1. It may be used by other high performance and high reliability industries, at their discretion. This new edition includes the following significant technical changes with respect to the previous edition:
- adoption and modification of STACK Specification S/0001 revision 14 notice 3, update of IEC semiconductor test methods;
- update of JEDEC semiconductor test methods;
- including addition of JEP148A, based on the Physics of Failure Risk and Opportunity assessment;
- update of Annex A with additional JEDEC and IEC test information;
- revision of lead-free termination finish requirements.
| Committee |
TC 107
|
| DevelopmentNote |
Supersedes IEC/PAS 62686-1. (09/2012) Stability Date: 2018. (10/2012)
|
| DocumentType |
Technical Specification
|
| Pages |
63
|
| PublisherName |
International Electrotechnical Committee
|
| Status |
Superseded
|
| SupersededBy | |
| Supersedes |
| Standards | Relationship |
| NEN NPR IEC/TS 62686-1 : 2015 | Identical |
| PD IEC/TS 62686-1:2015 | Identical |
| SAC GB/T 37312.1:2019 | Identical |
| 18/30373170 DC : 0 | BS EN 62668-2 - PROCESS MANAGEMENT FOR AVIONICS - COUNTERFEIT PREVENTION - PART 2: MANAGING ELECTRONIC COMPONENTS FROM NON-FRANCHISED SOURCES |
| EN IEC 62933-1:2018 | Electrical Energy Storage (EES) systems - Part 1: Vocabulary |
| PD IEC/TS 62564-1:2016 | Process management for avionics. Aerospace qualified electronic components (AQEC) Integrated circuits and discrete semiconductors |
| IEC 62933-1:2018 | Electrical energy storage (EES) systems - Part 1: Vocabulary |
| IEC TS 62239-1:2015 | Process management for avionics - Management plan - Part 1: Preparation and maintenance of an electronic components management plan |
| EIA STD 4899 : 2017-05 | REQUIREMENTS FOR AN ELECTRONIC COMPONENTS MANAGEMENT PLAN |
| I.S. EN IEC 62933-1:2018 | ELECTRICAL ENERGY STORAGE (EES) SYSTEMS - PART 1: VOCABULARY |
| IEC TS 62564-1:2016 | Process management for avionics - Aerospace qualified electronic components (AQEC) - Part 1: Integrated circuits and discrete semiconductors |
| IEC TS 62668-2:2016 | Process management for avionics - Counterfeit prevention - Part 2: Managing electronic components from non-franchised sources |
| PD IEC/TS 62239-1:2015 | Process management for avionics. Management plan Preparation and maintenance of an electronic components management plan |
| IEC TS 62933-5-1:2017 | Electrical energy storage (EES) systems - Part 5-1: Safety considerations for grid-integrated EES systems - General specification |
| PD IEC/TS 62668-2:2016 | Process management for avionics. Counterfeit prevention Managing electronic components from non-franchised sources |
| IPC J STD 609 : A | MARKING AND LABELING OF COMPONENTS, PCBS AND PCBAS TO IDENTIFY LEAD (PB), LEAD-FREE (PB-FREE) AND OTHER ATTRIBUTES |
| IEC 60749-20:2008 | Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat |
| IEC 60749-17:2003 | Semiconductor devices - Mechanical and climatic test methods - Part 17: Neutron irradiation |
| IEC 60749-38:2008 | Semiconductor devices - Mechanical and climatic test methods - Part 38: Soft error test method for semiconductor devices with memory |
| IEC 60749-8:2002 | Semiconductor devices - Mechanical and climatic test methods - Part 8: Sealing |
| IEC 60749-21:2011 | Semiconductor devices - Mechanical and climatic test methods - Part 21: Solderability |
| MIL-STD-883 Revision K:2016 | TEST METHOD STANDARD - MICROCIRCUITS |
| IEC 60749-25:2003 | Semiconductor devices - Mechanical and climatic test methods - Part 25: Temperature cycling |
| IEC 60749-30:2005+AMD1:2011 CSV | Semiconductor devices - Mechanical and climatic test methods - Part 30: Preconditioning of non-hermetic surface mount devices prior to reliability testing |
| IEC 60749-5:2017 | Semiconductor devices - Mechanical and climatic test methods - Part 5: Steady-state temperature humidity bias life test |
| IEC 60749-4:2017 | Semiconductor devices - Mechanical and climatic test methods - Part 4: Damp heat, steady state, highly accelerated stress test (HAST) |
| IEC 61340-5-1:2016 | Electrostatics - Part 5-1: Protection of electronic devices from electrostatic phenomena - General requirements |
| SAE J 1879 : 2014 | HANDBOOK FOR ROBUSTNESS VALIDATION OF SEMICONDUCTOR DEVICES IN AUTOMOTIVE APPLICATIONS |
| IEC 60749-29:2011 | Semiconductor devices - Mechanical and climatic test methods - Part 29: Latch-up test |
| MIL-PRF-19500 Revision P:2010 | SEMICONDUCTOR DEVICES, GENERAL SPECIFICATION FOR |
| IEC 62374:2007 | Semiconductor devices - Time dependent dielectric breakdown (TDDB) test for gate dielectric films |
| IEC 62483:2013 | Environmental acceptance requirements for tin whisker susceptibility of tin and tin alloy surface finishes on semiconductor devices |
| IEC 60749-36:2003 | Semiconductor devices - Mechanical and climatic test methods - Part 36: Acceleration, steady state |
| ISO/TS 16949:2009 | Quality management systems Particular requirements for the application of ISO 9001:2008 for automotive production and relevant service part organizations |
| RTCA DO 254 : 2000 | DESIGN ASSURANCE GUIDANCE FOR AIRBORNE ELECTRONIC HARDWARE |
| MIL-STD-750 Revision F:2011 | TEST METHODS FOR SEMICONDUCTOR DEVICES |
| IEC 60749-9:2017 | Semiconductor devices - Mechanical and climatic test methods - Part 9: Permanence of marking |
| IEC TS 62239-1:2015 | Process management for avionics - Management plan - Part 1: Preparation and maintenance of an electronic components management plan |
| IPC J STD 033C-1:2014 | HANDLING, PACKING, SHIPPING AND USE OF MOISTURE, REFLOW, AND PROCESS SENSITIVE DEVICES |
| IEC 60749-33:2004 | Semiconductor devices - Mechanical and climatic test methods - Part 33: Accelerated moisture resistance - Unbiased autoclave |
| IEC TS 62564-1:2016 | Process management for avionics - Aerospace qualified electronic components (AQEC) - Part 1: Integrated circuits and discrete semiconductors |
| IEC 60749-15:2010 | Semiconductor devices - Mechanical and climatic test methods - Part 15: Resistance to soldering temperature for through-hole mounted devices |
| IEC 60749-26:2013 | Semiconductor devices - Mechanical and climatic test methods - Part 26: Electrostatic discharge (ESD) sensitivity testing - Human body model (HBM) |
| IEC 60749-7:2011 | Semiconductor devices - Mechanical and climatic test methods - Part 7: Internal moisture content measurement and the analysis of other residual gases |
| ISO 14001:2015 | Environmental management systems — Requirements with guidance for use |
| IPC J STD 035 : 0 | ACOUSTIC MICROSCOPY FOR NON-HERMETIC ENCAPSULATED ELECTRONIC COMPONENTS |
| IEC 62418:2010 | Semiconductor devices - Metallization stress void test |
| IEC 60749-34:2010 | Semiconductor devices - Mechanical and climatic test methods - Part 34: Power cycling |
| IEC 60749-6:2017 | Semiconductor devices - Mechanical and climatic test methods - Part 6: Storage at high temperature |
| ISO 9001:2015 | Quality management systems — Requirements |
| IEC 62416:2010 | Semiconductor devices - Hot carrier test on MOS transistors |
| MIL-STD-1580 Revision B:2003 | DESTRUCTIVE PHYSICAL ANALYSIS FOR ELECTRONIC, ELECTROMAGNETIC, AND ELECTROMECHANICAL PARTS |
| IEC 60749-3:2017 | Semiconductor devices - Mechanical and climatic test methods - Part 3: External visual examination |
| IEC 62417:2010 | Semiconductor devices - Mobile ion tests for metal-oxide semiconductor field effect transistors (MOSFETs) |
| IEC 60749-10:2002 | Semiconductor devices - Mechanical and climatic test methods - Part 10: Mechanical shock |
| IEC 60749-32:2002+AMD1:2010 CSV | Semiconductor devices - Mechanical and climatic test methods - Part 32: Flammability of plastic-encapsulated devices (externally induced) |
| IEC 60695-11-5:2016 | Fire hazard testing - Part 11-5: Test flames - Needle-flame test method - Apparatus, confirmatory test arrangement and guidance |
| IEC 60749-14:2003 | Semiconductor devices - Mechanical and climatic test methods - Part 14: Robustness of terminations (lead integrity) |
| IEC 60749-19:2003+AMD1:2010 CSV | Semiconductor devices - Mechanical and climatic test methods - Part 19: Die shear strength |
| IEC 62415:2010 | Semiconductor devices - Constant current electromigration test |
| IEC 60749-22:2002 | Semiconductor devices - Mechanical and climatic test methods - Part 22: Bond strength |
| IEC 60749-20-1:2009 | Semiconductor devices - Mechanical and climatic test methods - Part 20-1: Handling, packing, labelling and shipping of surface-mount devices sensitive to the combined effect of moisture and soldering heat |
| IEC 60749-12:2002 | Semiconductor devices - Mechanical and climatic test methods - Part 12: Vibration, variable frequency |
| IEC 62374-1:2010 | Semiconductor devices - Part 1: Time-dependent dielectric breakdown (TDDB) test for inter-metal layers |
| IEC 60749-23:2004+AMD1:2011 CSV | Semiconductor devices - Mechanical and climatic test methods - Part 23: High temperature operating life |
Access your standards online with a subscription
Features
-
Simple online access to standards, technical information and regulations.
-
Critical updates of standards and customisable alerts and notifications.
-
Multi-user online standards collection: secure, flexible and cost effective.