IPC 7351 GERMAN : B
Current
The latest, up-to-date edition.
Basic requirements for SMT design and SMD patch guideline
Hardcopy
German
30-06-2010
Dieses Dokument enthält Informationen über die Geome-trien der Anschlussflächen-Bilder (Land Pattern) für die Oberflächenmontage elektronischer Bauelemente. Ziel der gegebenen Informationen ist es, Angaben über die geeignete Grösse, Form und Toleranz der Anschlussflächen-Bilder für oberflächenmontierte Bauelemente an die Hand zu geben, um sicherzustellen, dass eine ausreichende Fläche zur Ausbildung von Lotmenisken zur Verfügung steht, die den Anforderungen der IPC J-STD-001 entspricht.
| DocumentType |
Standard
|
| ISBN |
978-1-61193-013-9
|
| Pages |
100
|
| PublisherName |
Institute of Printed Circuits
|
| Status |
Current
|
| Supersedes |
| IPC S 816 : 0 | SMT PROCESS GUIDELINE AND CHECKLIST |
| IPC T 50 : M | TERMS AND DEFINITIONS FOR INTERCONNECTING AND PACKAGING ELECTRONIC CIRCUITS |
| IPC 4761 : 0 | DESIGN GUIDE FOR PROTECTION OF PRINTED BOARD VIA STRUCTURES |
| IPC J STD 001 : F | REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES |
| IPC 2226 : 0 | SECTIONAL DESIGN STANDARD FOR HIGH DENSITY INTERCONNECT (HDI) PRINTED BOARDS |
| IPC J STD 033C-1:2014 | HANDLING, PACKING, SHIPPING AND USE OF MOISTURE, REFLOW, AND PROCESS SENSITIVE DEVICES |
| IPC A 610 : F | ACCEPTABILITY OF ELECTRONIC ASSEMBLIES |
| IPC 7530 : 0 | GUIDELINES FOR TEMPERATURE PROFILING FOR MASS SOLDERING PROCESSES (REFLOW AND WAVE) |
| IPC J STD 002 : D | SOLDERABILITY TESTS FOR COMPONENT LEADS, TERMINATIONS, LUGS, TERMINALS AND WIRES |
| IPC 2221B:2012 | GENERIC STANDARD ON PRINTED BOARD DESIGN |
| IPC 1902 : 1998 | GRID SYSTEMS FOR PRINTED CIRCUITS |
| IPC 7525 : B | STENCIL DESIGN GUIDELINES |
| IPC 7711/21 : B | REWORK, MODIFICATION AND REPAIR OF ELECTRONIC ASSEMBLIES |
| IPC 9701 : A | PERFORMANCE TEST METHODS AND QUALIFICATION REQUIREMENTS FOR SURFACE MOUNT SOLDER ATTACHMENTS |
| IPC J STD 003 : C | SOLDERABILITY TESTS FOR PRINTED BOARDS |
| IPC 2581 : B | GENERIC REQUIREMENTS FOR PRINTED BOARD ASSEMBLY PRODUCTS MANUFACTURING DESCRIPTION DATA AND TRANSFER METHODOLOGY |
| IPC 7095 : C | DESIGN AND ASSEMBLY PROCESS IMPLEMENTATION FOR BGAS |
| IPC SM 785 : 0 | GUIDELINES FOR ACCELERATED RELIABILITY TESTING OF SURFACE MOUNT ATTACHMENTS |
| IPC 6012 : C | QUALIFICATION AND PERFORMANCE SPECIFICATION FOR RIGID PRINTED BOARDS |
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