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IPC 7711/21 : B

Superseded

Superseded

A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.

View Superseded by

REWORK, MODIFICATION AND REPAIR OF ELECTRONIC ASSEMBLIES

Available format(s)

Hardcopy

Superseded date

05-02-2021

Superseded by

IPC 7711/21C : 2017

Language(s)

English

€414.56
Excluding VAT

Describes procedures for repairing and reworking printed board assemblies.

DevelopmentNote
Supersedes IPC R 700, IPC 7711 and IPC 7721. (05/2016) B2007 Edition is still available in Chinese, Czech, German, Danish, French, Hungarian, Italian, Korean, Polish, Romanian, Russian, Spanish, Swedish & Turkish languages, See separate records. (02/2017) Also available in Hardcopy format. (01/2018)
DocumentType
Standard
Pages
360
PublisherName
Institute of Printed Circuits
Status
Superseded
SupersededBy
Supersedes

IPC AJ 820 : A ASSEMBLY AND JOINING HANDBOOK
IPC 6012 RUSSIAN : C QUALIFICATION AND PERFORMANCE SPECIFICATION FOR RIGID PRINTED BOARDS
IPC A 610 DANISH : E ACCEPTABILITY OF ELECTRONIC ASSEMBLIES
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IPC A 610 ROMANIAN : E ACCEPTABILITY OF ELECTRONIC ASSEMBLIES
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IPC A 610 GERMAN : E ACCEPTABILITY OF ELECTRONIC ASSEMBLIES
IPC A 610 HINDI : E2010 ACCEPTABILITY OF ELECTRONIC ASSEMBLIES
IPC A 610 ESTONIAN : E2010 ACCEPTABILITY OF ELECTRONIC ASSEMBLIES
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IPC A 610 DUTCH : F2014 ACCEPTABILITY OF ELECTRONIC ASSEMBLIES
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IPC A 610 HUNGARIAN : E ACCEPTABILITY OF ELECTRONIC ASSEMBLIES
IPC 6013 GERMAN : B QUALIFICATION AND PERFORMANCE SPECIFICATION FOR FLEXIBLE PRINTED BOARDS
IPC 6012 FRENCH : C QUALIFICATION AND PERFORMANCE SPECIFICATION FOR RIGID PRINTED BOARDS
IPC 7351 GERMAN : B Basic requirements for SMT design and SMD patch guideline
IPC A 610 CHINESE : F ACCEPTABILITY OF ELECTRONIC ASSEMBLIES
IPC A 610 TURKISH : E2010 ACCEPTABILITY OF ELECTRONIC ASSEMBLIES
IPC J STD 001 ROMANIAN : F REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES
IPC A 610 JAPANESE : E ACCEPTABILITY OF ELECTRONIC ASSEMBLIES
MIL STD 11991 : A GENERAL STANDARD FOR PARTS, MATERIALS, AND PROCESSES
IPC A 610 RUSSIAN : D ACCEPTABILITY OF ELECTRONIC ASSEMBLIES
IPC 6018 CHINESE : B QUALIFICATION AND PERFORMANCE SPECIFICATION FOR HIGH FREQUENCY (MICROWAVE) PRINTED BOARD
IPC A 610 VIETNAMESE : E ACCEPTABILITY OF ELECTRONIC ASSEMBLIES
IPC 7095 : C DESIGN AND ASSEMBLY PROCESS IMPLEMENTATION FOR BGAS
IEC PAS 62647-23:2011 Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 23: Rework and repair guidance to address the implications of lead-free electronics and mixed assemblies
IPC 7351 : B GENERIC REQUIREMENTS FOR SURFACE MOUNT DESIGN AND LAND PATTERN STANDARD
IPC J STD 001 CHINESE : F REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES
IPC J STD 001 SPANISH : F REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES
IPC J STD 001 FRENCH : F REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES
NASA KSC E 165 : 2009 ELECTRICAL GROUND SUPPORT EQUIPMENT FABRICATION, SPECIFICATION FOR
CSA N290.14 : 2015 QUALIFICATION OF DIGITAL HARDWARE AND SOFTWARE FOR USE IN INSTRUMENTATION AND CONTROL APPLICATIONS FOR NUCLEAR POWER PLANTS
IPC J STD 030 : A SELECTION AND APPLICATION OF BOARD LEVEL UNDERFILL MATERIALS
IEC TS 62647-23:2013 Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 23: Rework and repair guidance to address the implications of lead-free electronics and mixed assemblies
PD IEC/TS 62647-23:2013 Process management for avionics. Aerospace and defence electronic systems containing lead-free solder Rework and repair guidance to address the implications of lead-free electronics and mixed assemblies
DD IEC PAS 62647-23 : DRAFT AUG 2011 PROCESS MANAGEMENT FOR AVIONICS - AEROSPACE AND DEFENCE ELECTRONIC SYSTEMS CONTAINING LEAD-FREE SOLDER - PART 23: REWORK AND REPAIR GUIDANCE TO ADDRESS THE IMPLICATIONS OF LEAD-FREE ELECTRONICS AND MIXED ASSEMBLIES
IPC 6013 CHINESE : B QUALIFICATION AND PERFORMANCE SPECIFICATION FOR FLEXIBLE PRINTED BOARDS

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