IPC J STD 609 : A
Superseded
Superseded
A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.
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MARKING AND LABELING OF COMPONENTS, PCBS AND PCBAS TO IDENTIFY LEAD (PB), LEAD-FREE (PB-FREE) AND OTHER ATTRIBUTES
Available format(s)
Hardcopy
Superseded date
22-06-2020
Superseded by
Language(s)
English
Publisher
Important note : Users cannot be edited or removed once added to your Multi user PDF.
Foreword
1 Scope
2 Reference Documents
3 Terms and Definitions
4 Symbols, Labels, and Marks
5 Marking/Labeling Categories
6 Component Marking and Labeling
7 PCB/Assembly Marking and Labeling
8 Marking and/or Labeling of Pb-Containing Components,
PCBs, and PCB Assemblies
9 Summary of Marking and Labeling Requirements
Annex A - Example Alloys and Associated Material Codes
Annex B - Material Code Flow Chart
Pertains to components and assemblies that contain Pb-free and Pb-containing solders and finishes. Also describes the marking of components and the labeling of their shipping containers to identify their 2nd level terminal finish or material, and applies to components that are intended to be attached to boards or assemblies with solder or mechanical clamping or are press fit.
| DevelopmentNote |
Supersedes IPC 1066 & EIA JESD 97. (11/2007) Also available in CD-ROM format. Also available in Chinese Language, See J STD 609 CHINESE. (06/2011)
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| DocumentType |
Standard
|
| Pages |
24
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| PublisherName |
Institute of Printed Circuits
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| Status |
Superseded
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| SupersededBy | |
| Supersedes |
| DSCC 11001 : 0 | PRINTED WIRING BOARD, FLEXIBLE, TYPE 1 (SINGLE-SIDED ) WITH UNSUPPORTED HOLES, WITH OR WITHOUT STIFFENER |
| DSCC 11004 : 0 | PRINTED WIRING BOARD, RIGID FLEX, TYPE 4 (MULTILAYERED) WITH SUPPORTED HOLES, WITH STIFFENER |
| DSCC 11005 : 0 | PRINTED WIRING BOARD, RIGID FLEX, TYPE 5 (MULTILAYER) WITH UNSUPPORTED HOLES, WITH OR WITHOUT STIFFENER |
| IEC PAS 63015:2016 | Definition of "Low-Halogen" for electronic products |
| IPC AJ 820 : A | ASSEMBLY AND JOINING HANDBOOK |
| IPC 6012 RUSSIAN : C | QUALIFICATION AND PERFORMANCE SPECIFICATION FOR RIGID PRINTED BOARDS |
| IPC 1601 GERMAN : - | PRINTED BOARD HANDLING AND STORAGE GUIDELINES |
| IPC 6012 POLISH : C | QUALIFICATION AND PERFORMANCE SPECIFICATION FOR RIGID PRINTED BOARDS |
| IPC 6012 FRENCH : C | QUALIFICATION AND PERFORMANCE SPECIFICATION FOR RIGID PRINTED BOARDS |
| IPC J STD 006 CHINESE : B-2 | REQUIREMENTS FOR ELECTRONIC GRADE SOLDER ALLOYS AND FLUXED AND NON-FLUXED SOLID SOLDERS FOR ELECTRONIC SOLDERING APPLICATIONS |
| IPC 8701 : 0 | FINAL ACCEPTANCE CRITERIA STANDARD FOR PV MODULES-FINAL MODULE ASSEMBLY |
| MIL STD 11991 : A | GENERAL STANDARD FOR PARTS, MATERIALS, AND PROCESSES |
| IPC 6018 CHINESE : B | QUALIFICATION AND PERFORMANCE SPECIFICATION FOR HIGH FREQUENCY (MICROWAVE) PRINTED BOARD |
| PD IEC/TS 62564-1:2016 | Process management for avionics. Aerospace qualified electronic components (AQEC) Integrated circuits and discrete semiconductors |
| DSCC 11002 : 0 | PRINTED WIRING BOARD, FLEXIBLE, TYPE 2 (DOUBLE-SIDED) WITH PLATED THROUGH HOLES, WITH OR WITHOUT STIFFENER |
| MIL-DTL-39032 Revision E:2000 | RESISTORS, PACKAGING OF |
| PD IEC/TS 62647-1:2012 | Process management for avionics. Aerospace and defence electronic systems containing lead-free solder Preparation for a lead-free control plan |
| IEC PAS 62647-23:2011 | Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 23: Rework and repair guidance to address the implications of lead-free electronics and mixed assemblies |
| GEIA HB 0005-3 : 2008 | REWORK/REPAIR HANDBOOK TO ADDRESS THE IMPLICATIONS OF LEAD-FREE ELECTRONICS AND MIXED ASSEMBLIES IN AEROSPACE AND HIGH PERFORMANCE ELECTRONIC SYSTEMS |
| GEIA HB 0005-2 : 2007 | TECHNICAL GUIDELINES FOR AEROSPACE AND HIGH PERFORMANCE ELECTRONIC SYSTEMS CONTAINING LEAD-FREE SOLDER AND FINISHES |
| GEIA STD 0006 : 2008 | REQUIREMENTS FOR USING ROBOTIC HOT SOLDER DIP TO REPLACE THE FINISH ON ELECTRONIC PIECE PARTS |
| GEIA STD 0005-1 : 2012 | PERFORMANCE STANDARD FOR AEROSPACE AND HIGH PERFORMANCE ELECTRONIC SYSTEMS CONTAINING LEAD-FREE SOLDER |
| NASA JSC 66491 : 2013 | STANDARD FOR JSC LEAD-FREE CONTROL PLANS (LFCP) |
| IEC TS 62647-1:2012 | Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 1: Preparation for a lead-free control plan |
| IPC 7095 : C | DESIGN AND ASSEMBLY PROCESS IMPLEMENTATION FOR BGAS |
| IEC PAS 62686-2:2016 | Process management for avionics - Electronic components for aerospace, defence and high performance (ADHP) applications - Part 2: General requirements for passive components |
| DSCC 11003 : 0 | PRINTED WIRING BOARD, FLEXIBLE, TYPE 3 (MULTILAYER) WITH PLATED THROUGH HOLES, WITH OR WITHOUT STIFFENER |
| IEC TS 62686-1:2015 | Process management for avionics - Electronic components for aerospace, defence and high performance (ADHP) applications - Part 1: General requirements for high reliability integrated circuits and discrete semiconductors |
| IEC TS 62564-1:2016 | Process management for avionics - Aerospace qualified electronic components (AQEC) - Part 1: Integrated circuits and discrete semiconductors |
| IEC TS 62647-23:2013 | Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 23: Rework and repair guidance to address the implications of lead-free electronics and mixed assemblies |
| PD IEC/PAS 62686-2:2016 | Process management for avionics. Electronic components for aerospace, defence and high performance (ADHP) applications General requirements for passive components |
| PD IEC/TS 62647-23:2013 | Process management for avionics. Aerospace and defence electronic systems containing lead-free solder Rework and repair guidance to address the implications of lead-free electronics and mixed assemblies |
| IEC TS 62647-22:2013 | Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 22: Technical guidelines |
| IEC PAS 62647-22:2011 | Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 22: Technical guidelines |
| PD IEC/PAS 63015:2016 | Definition of “Low-Halogen” for electronic products |
| PD IEC/TS 62686-1:2015 | Process management for avionics. Electronic components for aerospace, defence and high performance (ADHP) applications General requirements for high reliability integrated circuits and discrete semiconductors |
| 12/30262664 DC : DRAFT APR 2012 | BS EN 62588 - MARKING AND LABELING OF COMPONENTS, PCBS AND PCBAS TO IDENTIFY LEAD (PB), LEAD-FREE (PB-FREE) AND OTHER ATTRIBUTES |
| DD IEC PAS 62647-23 : DRAFT AUG 2011 | PROCESS MANAGEMENT FOR AVIONICS - AEROSPACE AND DEFENCE ELECTRONIC SYSTEMS CONTAINING LEAD-FREE SOLDER - PART 23: REWORK AND REPAIR GUIDANCE TO ADDRESS THE IMPLICATIONS OF LEAD-FREE ELECTRONICS AND MIXED ASSEMBLIES |
| PD IEC/TS 62647-22:2013 | Process management for avionics. Aerospace and defence electronic systems containing lead-free solder Technical guidelines |
| IPC J STD 006 : C | REQUIREMENTS FOR ELECTRONIC GRADE SOLDER ALLOYS AND FLUXED AND NON-FLUXED SOLID SOLDERS FOR ELECTRONIC SOLDERING APPLICATIONS |
| DSCC 10012 : 0 | PRINTED WIRING BOARD, RIGID, MULTILAYERED, GENERAL DRAWING |
| DSCC 10013 : 0 | PRINTED WIRING BOARD, RIGID, MULTILAYERED, TYPE 3 WITH PLATED-THROUGH HOLES |
| IPC 1601 CHINESE : 2016 | PRINTED BOARD HANDLING AND STORAGE GUIDELINES |
| DSCC 11006 : 0 | PRINTED WIRING BOARD, FLEXIBLE RIGID FLEX, GENERAL DRAWING |
| DSCC 10014:2012 | PRINTED WIRING BOARD, RIGID, MULTILAYERED, TYPE 4 WITH BLIND AND BURIED VIAS |
| IPC T 50 : M | TERMS AND DEFINITIONS FOR INTERCONNECTING AND PACKAGING ELECTRONIC CIRCUITS |
| IPC CC 830 : B | QUALIFICATION AND PERFORMANCE OF ELECTRICAL INSULATING COMPOUND FOR PRINTED WIRING ASSEMBLIES |
| IPC 4101 : D | SPECIFICATION FOR BASE MATERIALS FOR RIGID AND MULTILAYER PRINTED BOARDS |
| IEC 61249-2-21:2003 | Materials for printed boards and other interconnecting structures - Part 2-21: Reinforced base materials, clad and unclad - Non-halogenated epoxide woven E-glass reinforced laminated sheets of defined flammability (vertical burning test), copper-clad |
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