IPC S 815 : B1987
Withdrawn
A Withdrawn Standard is one, which is removed from sale, and its unique number can no longer be used. The Standard can be withdrawn and not replaced, or it can be withdrawn and replaced by a Standard with a different number.
GENERAL REQUIREMENTS FOR SOLDERING OF ELECTRONIC INTERCONNECTIONS
13-09-2023
23-11-2012
Prescribes general requirements for high-quality soldering of electronic interconnections. (Processes are restricted to those soldering alloys having liquidus temperatures below 427 degrees C (800 degrees F). Defines the approved materials, methods, and inspection criteria for producing the quality of electrical soldering workmanship necessary for soldering of electrical connection and printed board assemblies. Recognizes that an assembly with soldered electrical interconnection will be subject to classification by intended end item use. Toward this end, recommended classes for assembly, flux and cleanliness have been established in this document.
| DocumentType |
Standard
|
| PublisherName |
Institute of Printed Circuits
|
| Status |
Withdrawn
|
| MIL P 28809 : A | PRINTED WIRING ASSEMBLIES |
| MIL-C-28809 Revision B:1988 | CIRCUIT CARD ASSEMBLIES, RIGID, FLEXIBLE & RIGID FLEX |
| IPC S 804 : A1987 | PRINTED WIRING BOARDS, SOLDERABILITY TEST METHODS FOR, |
| IPC D 949 : 1987 | RIGID MULTILAYER PRINTED BOARDS, DESIGN STANDARD FOR, |
| MIL-PRF-49404 Revision A:1997 | Bias Voltage Regulator, CN-1559/UA (No S/S Document) |
| MIL-PRF-49177 Revision B:1997 | SCAN-INTERLACE, PL-1408/UA |
| MIL-PRF-49176 Revision B:1997 | REGULATOR, BIAS VOLTAGE, CN-1503/UA |
| MIL-STD-2118 Base Document:1984 | FLEXIBLE AND RIGID FLEX PRINTED WIRING FOR ELECTRONIC EQUIPMENT DESIGN REQUIREMENTS FOR |
| MIL-PRF-49164 Revision C:1997 | VIDEO POSTAMPLIFIER-CONTROL DRIVER, AM-6924/UA |
| MIL-PRF-49166 Revision C:1999 | Mechanical Scanner, MX-9872(V)/UA; General Specification for (No S/S Document) |
| IPC A 600 : H | ACCEPTABILITY OF PRINTED BOARDS |
| IPC T 50 : M | TERMS AND DEFINITIONS FOR INTERCONNECTING AND PACKAGING ELECTRONIC CIRCUITS |
| IPC SM 780 : 0 | COMPONENT PACKAGING AND INTERCONNECTING WITH EMPHASIS ON SURFACE MOUNTING |
| IPC TM 650 : 0 | TEST METHODS MANUAL |
| IPC A 610 : F | ACCEPTABILITY OF ELECTRONIC ASSEMBLIES |
| IPC CM 770 : E | COMPONENT MOUNTING GUIDELINES FOR PRINTED BOARDS |
| IPC S 805 : 1985 | PRINTED CIRCUITS - SOLDERABILITY TEST FOR COMPONENT LEADS AND TERMINATIONS, |
| IPC SF 818 : 1991 | GENERAL REQUIREMENTS FOR ELECTRONIC SOLDERING FLUXES |
| IPC S 804 : A1987 | PRINTED WIRING BOARDS, SOLDERABILITY TEST METHODS FOR, |
| IPC TR 460 : A1984 | TROUBLE-SHOOTING CHECKLIST FOR WAVE SOLDERING PRINTED WIRING BOARDS |
| IPC SP 819 : 1988 | SPECIFICATION FOR SOLDER PASTES |
| IPC R 700 : C1988 | SUGGESTED GUIDELINES FOR MODIFICATION, REWORK AND REPAIR OF PRINTED BOARDS AND ASSEMBLIES |
| IPC AJ 820 : A | ASSEMBLY AND JOINING HANDBOOK |
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