CEI EN 60204-33 : 2012

FOREWORD
INTRODUCTION
1. Scope
2. Normative references
3. Terms and definitions
4. General requirements
5. Incoming supply conductor terminations
    and devices for disconnecting and
    switching off
6. Protection against electric shock
7. Protection of equipment
8. Equipotential bonding
9. Control circuits, emergency off (EMO),
    and protective interlock circuits
10. Operator interfaces
11. Controlgear: location, mounting, and
    enclosures
12. Conductors and cables
13. Wiring practices
14. Electric motors and associated equipment
15. Accessories and lighting
16. Marking, warning signs and reference
    designations
17. Technical documentation
18. Testing
Annex A (normative) - Basic protection
        (protection against indirect contact) in
        TNsystems
Annex B (normative) - Protection against
        indirect contact in TT-systems (Derived
        from IEC 60364-4-41:2005 and IEC
        60364-6:2006)
Annex C (normative) - Conductor ampacity,
        and creepage and clearance distances
Annex D (normative) - Standard test fingers
Annex E (informative) - Types of system
        earthing (Derived from IEC 60364-1: 2005)
Bibliography
Annex ZA (normative) - Normative references to
         international publications with their
         corresponding European publications

Describes the electrical and electronic equipment associated with semiconductor fabrication equipment for the manufacture, measurement, assembly, and test of semiconductors.