
CEI EN 60204-33 : 2012
Current
The latest, up-to-date edition.

SAFETY OF MACHINERY - ELECTRICAL EQUIPMENT OF MACHINES - PART 33: REQUIREMENTS FOR SEMICONDUCTOR FABRICATION EQUIPMENT
Hardcopy , PDF
English
01-01-2012
FOREWORD
INTRODUCTION
1. Scope
2. Normative references
3. Terms and definitions
4. General requirements
5. Incoming supply conductor terminations
and devices for disconnecting and
switching off
6. Protection against electric shock
7. Protection of equipment
8. Equipotential bonding
9. Control circuits, emergency off (EMO),
and protective interlock circuits
10. Operator interfaces
11. Controlgear: location, mounting, and
enclosures
12. Conductors and cables
13. Wiring practices
14. Electric motors and associated equipment
15. Accessories and lighting
16. Marking, warning signs and reference
designations
17. Technical documentation
18. Testing
Annex A (normative) - Basic protection
(protection against indirect contact) in
TNsystems
Annex B (normative) - Protection against
indirect contact in TT-systems (Derived
from IEC 60364-4-41:2005 and IEC
60364-6:2006)
Annex C (normative) - Conductor ampacity,
and creepage and clearance distances
Annex D (normative) - Standard test fingers
Annex E (informative) - Types of system
earthing (Derived from IEC 60364-1: 2005)
Bibliography
Annex ZA (normative) - Normative references to
international publications with their
corresponding European publications
Describes the electrical and electronic equipment associated with semiconductor fabrication equipment for the manufacture, measurement, assembly, and test of semiconductors.
Committee |
CT 44
|
DevelopmentNote |
Classificazione CEI 44-21. (03/2012)
|
DocumentType |
Standard
|
Pages |
134
|
PublisherName |
Comitato Elettrotecnico Italiano
|
Status |
Current
|
Standards | Relationship |
EN 60204-33:2011 | Identical |
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