EN 60749-25:2003
Current
The latest, up-to-date edition.
Semiconductor devices - Mechanical and climatic test methods - Part 25: Temperature cycling
18-09-2003
1 Scope
2 Normative references
3 Terms and definitions
4 Test apparatus
5 Procedure
5.1 Initial measurements
5.2 Conditioning
5.3 Cycle rates
5.4 Upper and lower soak times
5.5 Upper and lower soak temperatures
5.6 Soak modes
5.7 Cycle time
5.8 Ramp rate
5.9 Load transfer time
5.10 Recovery
5.11 Final measurements
5.12 Failure criteria
6 Summary
Annex ZA (normative) - Normative references to international
publications with their corresponding European
publications
Provides a test procedure for determining the ability of semiconductor devices and components and/or board assemblies to withstand mechanical stresses induced by alternating high and low temperature extremes. Permanent changes in electrical and/or physical characteristics can result from these mechanical stresses. Applies to single, dual and triple chamber temperature cycling and covers component and solder interconnection testing.
Committee |
CLC/TC 47X
|
DocumentType |
Standard
|
PublisherName |
European Committee for Standards - Electrical
|
Status |
Current
|
Standards | Relationship |
UNE-EN 60749-25:2004 | Identical |
BS EN 60749-25:2003 | Identical |
CEI EN 60749-25 : 2004 | Identical |
PN EN 60749-25 : 2006 | Identical |
NEN EN IEC 60749-25 : 2003 | Identical |
SN EN 60749-25 : 2003 | Identical |
NBN EN 60749-25 : 2004 | Identical |
NF EN 60749-25 : 2003 | Identical |
DIN EN 60749-25:2004-04 | Identical |
IEC 60749-25:2003 | Identical |
I.S. EN 60749-25:2003 | Identical |
BS EN 62149-2:2014 | Fibre optic active components and devices. Performance standards 850 nm discrete vertical cavity surface emitting laser devices |
BS EN 62149-4:2010 | Fibre optic active components and devices. Performance standards 1300 nm fibre optic transceivers for Gigabit Ethernet application |
BS EN 60749-43:2017 | Semiconductor devices - Mechanical and climatic test methods Guidelines for IC reliability qualification plans |
CEI EN 60747-15 : 2012 | SEMICONDUCTOR DEVICES - DISCRETE DEVICES - PART 15: ISOLATED POWER SEMICONDUCTOR DEVICES |
BS EN 60749-30 : 2005 | SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 30: PRECONDITIONING OF NON-HERMETIC SURFACE MOUNT DEVICES PRIOR TO RELIABILITY TESTING |
EN 60747-15:2012 | Semiconductor devices - Discrete devices - Part 15: Isolated power semiconductor devices |
EN 62149-8:2014 | Fibre optic active components and devices - Performance standards - Part 8: Seeded reflective semiconductor optical amplifier devices |
BS EN 62149-8:2014 | Fibre optic active components and devices. Performance standards Seeded reflective semiconductor optical amplifier devices |
BS EN 62149-9:2014 | Fibre optic active components and devices. Performance standards Seeded reflective semiconductor optical amplifier transceivers |
CEI EN 62149-4 : 2011 | FIBRE OPTIC ACTIVE COMPONENTS AND DEVICES - PERFORMANCE STANDARDS - PART 4: 1300 NM FIBRE OPTIC TRANSCEIVERS FOR GIGABIT ETHERNET APPLICATION |
I.S. EN 60747-15:2012 | SEMICONDUCTOR DEVICES - DISCRETE DEVICES - PART 15: ISOLATED POWER SEMICONDUCTOR DEVICES (IEC 60747-15:2010 (EQV)) |
I.S. EN 62572-3:2016 | FIBRE OPTIC ACTIVE COMPONENTS AND DEVICES - RELIABILITY STANDARDS - PART 3: LASER MODULES USED FOR TELECOMMUNICATION |
EN 60749-43:2017 | Semiconductor devices - Mechanical and climatic test methods - Part 43: Guidelines for IC reliability qualification plans |
BS EN 60747-15:2012 | Semiconductor devices. Discrete devices Isolated power semiconductor devices |
I.S. EN 62149-4:2010 | FIBRE OPTIC ACTIVE COMPONENTS AND DEVICES - PERFORMANCE STANDARDS - PART 4: 1300 NM FIBRE OPTIC TRANSCEIVERS FOR GIGABIT ETHERNET APPLICATION |
EN 60749-30 : 2005 AMD 1 2011 | SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 30: PRECONDITIONING OF NON-HERMETIC SURFACE MOUNT DEVICES PRIOR TO RELIABILITY TESTING |
BS EN 62572-3:2016 | Fibre optic active components and devices. Reliability standards Laser modules used for telecommunication |
CEI EN 60749-43 : 1ED 2018 | SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 43: GUIDELINES FOR IC RELIABILITY QUALIFICATION PLANS |
I.S. EN 60749-30:2005 | SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 30: PRECONDITIONING OF NON-HERMETIC SURFACE MOUNT DEVICES PRIOR TO RELIABILITY TESTING |
I.S. EN 62149-2:2014 | FIBRE OPTIC ACTIVE COMPONENTS AND DEVICES - PERFORMANCE STANDARDS - PART 2: 850 NM DISCRETE VERTICAL CAVITY SURFACE EMITTING LASER DEVICES |
I.S. EN 62149-8:2014 | FIBRE OPTIC ACTIVE COMPONENTS AND DEVICES - PERFORMANCE STANDARDS - PART 8: SEEDED REFLECTIVE SEMICONDUCTOR OPTICAL AMPLIFIER DEVICES |
I.S. EN 60749-43:2017 | SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 43: GUIDELINES FOR IC RELIABILITY QUALIFICATION PLANS |
I.S. EN 62149-9:2014 | FIBRE OPTIC ACTIVE COMPONENTS AND DEVICES - PERFORMANCE STANDARDS - PART 9: SEEDED REFLECTIVE SEMICONDUCTOR OPTICAL AMPLIFIER TRANSCEIVERS |
EN 62572-3:2016 | Fibre optic active components and devices - Reliability standards - Part 3: Laser modules used for telecommunication |
EN 62149-4:2010 | Fibre optic active components and devices - Performance standards - Part 4: 1 300 nm fibre optic transceivers for Gigabit Ethernet application |
EN 62149-2:2014 | Fibre optic active components and devices - Performance standards - Part 2: 850 nm discrete vertical cavity surface emitting laser devices |
EN 62149-9:2014 | Fibre optic active components and devices - Performance standards - Part 9: Seeded reflective semiconductor optical amplifier transceivers |
IEC 60068-2-14:2009 | Environmental testing - Part 2-14: Tests - Test N: Change of temperature |
EN 60068-2-14:2009 | Environmental testing - Part 2-14: Tests - Test N: Change of temperature |
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