EN 60749-37:2008
Withdrawn
A Withdrawn Standard is one, which is removed from sale, and its unique number can no longer be used. The Standard can be withdrawn and not replaced, or it can be withdrawn and replaced by a Standard with a different number.
Semiconductor devices - Mechanical and climatic test methods - Part 37: Board level drop test method using an accelerometer
11-04-2008
01-03-2011
FOREWORD
INTRODUCTION
1 Scope and object
2 Normative references
3 Terms and definitions
4 Test apparatus and components
4.1 Test apparatus
4.2 Test components
4.3 Test board
4.4 Test board assembly
4.5 Number of components and sample size
5 Test procedure
5.1 Test equipment and parameters
5.2 Pre-test characterization
5.3 Drop testing
6 Failure criteria and failure analysis
7 Summary
Annex A (informative) - Preferred board construction,
material, design and layout
Annex ZA (normative) - Normative references to international
publications with their corresponding
European publications
Bibliography
Provides a test method that is intended to evaluate and compare drop performance of surface mount electronic components for handheld electronic product applications in an accelerated test environment, where excessive flexure of a circuit board causes product failure. The purpose is to standardize the test board and test methodology to provide a reproducible assessment of the drop test performance of surface-mounted components while producing the same failure modes normally observed during product level test.
| Committee |
CLC/TC 47X
|
| DocumentType |
Standard
|
| PublisherName |
European Committee for Standards - Electrical
|
| Status |
Withdrawn
|
| Standards | Relationship |
| DS EN 60749-37 : 2008 | Identical |
| NF EN 60749-37 : 2008 | Identical |
| IEC 60749-37:2008 | Identical |
| NBN EN 60749-37 : 2008 | Identical |
| NEN EN IEC 60749-37 : 2008 | Identical |
| I.S. EN 60749-37:2008 | Identical |
| PN EN 60749-37 : 2008 | Identical |
| BS EN 60749-37:2008 | Identical |
| CEI EN 60749-37 : 2008 | Identical |
| DIN EN 60749-37:2008-08 | Identical |
| OVE/ONORM EN 60749-37 : 2008 | Identical |
| UNE-EN 60749-37:2008 | Identical |
| I.S. EN 60749-40:2011 | SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 40: BOARD LEVEL DROP TEST METHOD USING A STRAIN GAUGE |
| EN 60749-20-1:2009 | Semiconductor devices - Mechanical and climatic test methods - Part 20-1: Handling, packing, labelling and shipping of surface-mount devices sensitive to the combined effect of moisture and soldering heat |
| EN 60749-40:2011 | Semiconductor devices - Mechanical and climatic test methods - Part 40: Board level drop test method using a strain gauge |
| BS EN 60749-40:2011 | Semiconductor devices. Mechanical and climatic test methods Board level drop test method using a strain gauge |
| CEI EN 60749-40 : 2012 | SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 40: BOARD LEVEL DROP TEST METHOD USING A STRAIN GAUGE |
| BS EN 60749-20-1:2009 | Semiconductor devices. Mechanical and climatic test methods Handling, packing, labelling and shipping of surface-mount devices sensitive to the combined effect of moisture and soldering heat |
| I.S. EN 60749-20-1:2009 | SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 20-1: HANDLING, PACKING, LABELLING AND SHIPPING OF SURFACE-MOUNT DEVICES SENSITIVE TO THE COMBINED EFFECT OF MOISTURE AND SOLDERING HEAT |
| IEC 60749-20:2008 | Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat |
| EN 60749-10:2002 | Semiconductor devices - Mechanical and climatic test methods - Part 10: Mechanical shock |
| EN 60749-20:2009 | Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat |
| IEC 60749-10:2002 | Semiconductor devices - Mechanical and climatic test methods - Part 10: Mechanical shock |
| IEC 60749-40:2011 | Semiconductor devices - Mechanical and climatic test methods - Part 40: Board level drop test method using a strain gauge |
| IEC 60749-20-1:2009 | Semiconductor devices - Mechanical and climatic test methods - Part 20-1: Handling, packing, labelling and shipping of surface-mount devices sensitive to the combined effect of moisture and soldering heat |
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