EN 60749-37:2008
Current
The latest, up-to-date edition.
Semiconductor devices - Mechanical and climatic test methods - Part 37: Board level drop test method using an accelerometer
11-04-2008
FOREWORD
INTRODUCTION
1 Scope and object
2 Normative references
3 Terms and definitions
4 Test apparatus and components
4.1 Test apparatus
4.2 Test components
4.3 Test board
4.4 Test board assembly
4.5 Number of components and sample size
5 Test procedure
5.1 Test equipment and parameters
5.2 Pre-test characterization
5.3 Drop testing
6 Failure criteria and failure analysis
7 Summary
Annex A (informative) - Preferred board construction,
material, design and layout
Annex ZA (normative) - Normative references to international
publications with their corresponding
European publications
Bibliography
Provides a test method that is intended to evaluate and compare drop performance of surface mount electronic components for handheld electronic product applications in an accelerated test environment, where excessive flexure of a circuit board causes product failure. The purpose is to standardize the test board and test methodology to provide a reproducible assessment of the drop test performance of surface-mounted components while producing the same failure modes normally observed during product level test.
Committee |
CLC/TC 47X
|
DocumentType |
Standard
|
PublisherName |
European Committee for Standards - Electrical
|
Status |
Current
|
Standards | Relationship |
DS EN 60749-37 : 2008 | Identical |
NF EN 60749-37 : 2008 | Identical |
IEC 60749-37:2008 | Identical |
NBN EN 60749-37 : 2008 | Identical |
NEN EN IEC 60749-37 : 2008 | Identical |
I.S. EN 60749-37:2008 | Identical |
PN EN 60749-37 : 2008 | Identical |
BS EN 60749-37:2008 | Identical |
CEI EN 60749-37 : 2008 | Identical |
DIN EN 60749-37:2008-08 | Identical |
OVE/ONORM EN 60749-37 : 2008 | Identical |
UNE-EN 60749-37:2008 | Identical |
PNE-prEN 60749-37 | Identical |
I.S. EN 60749-40:2011 | SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 40: BOARD LEVEL DROP TEST METHOD USING A STRAIN GAUGE |
EN 60749-20-1 : 2009 | SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 20-1: HANDLING, PACKING, LABELLING AND SHIPPING OF SURFACE-MOUNT DEVICES SENSITIVE TO THE COMBINED EFFECT OF MOISTURE AND SOLDERING HEAT |
EN 60749-40 : 2011 | SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 40: BOARD LEVEL DROP TEST METHOD USING A STRAIN GAUGE |
BS EN 60749-40:2011 | Semiconductor devices. Mechanical and climatic test methods Board level drop test method using a strain gauge |
CEI EN 60749-40 : 2012 | SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 40: BOARD LEVEL DROP TEST METHOD USING A STRAIN GAUGE |
BS EN 60749-20-1:2009 | Semiconductor devices. Mechanical and climatic test methods Handling, packing, labelling and shipping of surface-mount devices sensitive to the combined effect of moisture and soldering heat |
I.S. EN 60749-20-1:2009 | SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 20-1: HANDLING, PACKING, LABELLING AND SHIPPING OF SURFACE-MOUNT DEVICES SENSITIVE TO THE COMBINED EFFECT OF MOISTURE AND SOLDERING HEAT |
IEC 60749-20:2008 | Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat |
EN 60749-10:2002 | Semiconductor devices - Mechanical and climatic test methods - Part 10: Mechanical shock |
EN 60749-20:2009 | Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat |
IEC 60749-10:2002 | Semiconductor devices - Mechanical and climatic test methods - Part 10: Mechanical shock |
IEC 60749-40:2011 | Semiconductor devices - Mechanical and climatic test methods - Part 40: Board level drop test method using a strain gauge |
IEC 60749-20-1:2009 | Semiconductor devices - Mechanical and climatic test methods - Part 20-1: Handling, packing, labelling and shipping of surface-mount devices sensitive to the combined effect of moisture and soldering heat |
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