IEC 60749-10:2002
Superseded
A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.
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Semiconductor devices - Mechanical and climatic test methods - Part 10: Mechanical shock
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27-04-2022
09-04-2002
FOREWORD
1 Scope
2 Normative references
3 Test apparatus
4 Procedure
5 Summary
Describes a shock test intended to determine the suitability of component parts for use in electronic equipment which may be subjected to moderately severe shocks as a result of suddenly applied forces or abrupt changes in motion produced by rough handling, transportation, or field operation. Shock of this type may disturb operating characteristics, particularly if the shock pulses are repetitive. This is a destructive test. It is normally applicable to cavity-type packages.The contents of the corrigendum of August 2003 have been included in this copy.
Committee |
TC 47
|
DevelopmentNote |
Supersedes IEC PAS 62186 (08/2002) Supersedes IEC 60749. (03/2008) Stability Date: 2019. (11/2017)
|
DocumentType |
Standard
|
Pages |
7
|
PublisherName |
International Electrotechnical Committee
|
Status |
Superseded
|
SupersededBy | |
Supersedes |
Standards | Relationship |
NF EN 60749-10 : 2002 | Identical |
NEN EN IEC 60749-10 : 2002 | Identical |
I.S. EN 60749-10:2002 | Identical |
PN EN 60749-10 : 2004 | Identical |
BS EN 60749-10:2002 | Identical |
CEI EN 60749-10 : 2004 | Identical |
EN 60749-10:2002 | Identical |
OVE/ONORM EN 60749-10 : 2003 | Identical |
UNE-EN 60749-10:2003 | Identical |
DIN EN 60749-10:2003-04 | Identical |
14/30296894 DC : 0 | BS EN 62830-1 - SEMICONDUCTOR DEVICES - SEMICONDUCTOR DEVICES FOR ENERGY HARVESTING AND GENERATION - PART 1: VIBRATION BASED PIEZOELECTRIC ENERGY HARVESTING |
17/30355772 DC : 0 | BS EN 62047-33 ED.1.0 - SEMICONDUCTOR DEVICES - MICRO-ELECTROMECHANICAL DEVICES - PART 33: MEMS PIEZORESISTIVE PRESSURE-SENSITIVE DEVICE |
BS EN 62149-2:2014 | Fibre optic active components and devices. Performance standards 850 nm discrete vertical cavity surface emitting laser devices |
13/30277888 DC : 0 | BS EN 62149-2 ED 2.0 - FIBRE OPTIC ACTIVE COMPONENTS AND DEVICES - PERFORMANCE STANDARDS - PART 2: 850 NM DISCRETE VERTICAL CAVITY SURFACE EMITTING LASER DEVICES |
CEI EN 60747-15 : 2012 | SEMICONDUCTOR DEVICES - DISCRETE DEVICES - PART 15: ISOLATED POWER SEMICONDUCTOR DEVICES |
I.S. EN 60749-37:2008 | SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 37: BOARD LEVEL DROP TEST METHOD USING AN ACCELEROMETER |
EN 60747-15:2012 | Semiconductor devices - Discrete devices - Part 15: Isolated power semiconductor devices |
EN 62149-8:2014 | Fibre optic active components and devices - Performance standards - Part 8: Seeded reflective semiconductor optical amplifier devices |
BS EN 62149-8:2014 | Fibre optic active components and devices. Performance standards Seeded reflective semiconductor optical amplifier devices |
IEC 62830-3:2017 | Semiconductor devices - Semiconductor devices for energy harvesting and generation - Part 3: Vibration based electromagnetic energy harvesting |
17/30336994 DC : 0 | BS IEC 62969-3 ED.1.0 - SEMICONDUCTOR DEVICES - SEMICONDUCTOR INTERFACE FOR AUTOMOTIVE VEHICLES - PART 3: SHOCK DRIVEN PIEZOELECTRIC ENERGY HARVESTING FOR AUTOMOTIVE VEHICLE SENSORS |
14/30301992 DC : 0 | BS EN 62830-3 - SEMICONDUCTOR DEVICES - SEMICONDUCTOR DEVICES FOR ENERGY HARVESTING AND GENERATION - PART 3: VIBRATION BASED ELECTROMAGNETIC ENERGY HARVESTING |
BS IEC 62830-3 : 2017 | SEMICONDUCTOR DEVICES - SEMICONDUCTOR DEVICES FOR ENERGY HARVESTING AND GENERATION - PART 3: VIBRATION BASED ELECTROMAGNETIC ENERGY HARVESTING |
I.S. EN 60747-15:2012 | SEMICONDUCTOR DEVICES - DISCRETE DEVICES - PART 15: ISOLATED POWER SEMICONDUCTOR DEVICES (IEC 60747-15:2010 (EQV)) |
I.S. EN 62572-3:2016 | FIBRE OPTIC ACTIVE COMPONENTS AND DEVICES - RELIABILITY STANDARDS - PART 3: LASER MODULES USED FOR TELECOMMUNICATION |
IEC TS 62686-1:2015 | Process management for avionics - Electronic components for aerospace, defence and high performance (ADHP) applications - Part 1: General requirements for high reliability integrated circuits and discrete semiconductors |
IEC 62830-1:2017 | Semiconductor devices - Semiconductor devices for energy harvesting and generation - Part 1: Vibration based piezoelectric energy harvesting |
IEC 62047-5:2011 | Semiconductor devices - Micro-electromechanical devices - Part 5: RF MEMS switches |
09/30190356 DC : 0 | BS EN 60749-40 - SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 40: BOARD LEVEL DROP TEST METHOD USING A STRAIN GAUGE |
EN IEC 62969-1:2018 | Semiconductor devices - Semiconductor interface for automotive vehicles - Part 1: General requirements of power interface for automotive vehicle sensors |
07/30162213 DC : 0 | BS EN 60747-15 - SEMICONDUCTOR DEVICES - DISCRETE DEVICES - PART 15: ISOLATED POWER SEMICONDUCTOR DEVICES |
13/30264591 DC : 0 | BS EN 60747-14-6 ED 1.0 - SEMICONDUCTOR DEVICES - PART 14-6: SEMICONDUCTOR SENSORS - HUMIDITY SENSOR |
BS IEC 60747-14-4:2011 | Semiconductor devices. Discrete devices Semiconductor accelerometers |
NF EN 60749-37 : 2008 | SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 37: BOARD LEVEL DROP TEST METHOD USING AN ACCELEROMETER |
15/30323391 DC : 0 | BS EN 62572-3 - FIBRE OPTIC ACTIVE COMPONENTS AND DEVICES - RELIABILITY STANDARDS PART 3: LASER MODULES USED FOR TELECOMMUNICATION |
13/30277892 DC : 0 | BS EN 62572-3 ED 2.0 - FIBRE OPTIC ACTIVE COMPONENTS AND DEVICES - RELIABILITY STANDARDS - PART 3: LASER MODULES USED FOR TELECOMMUNICATION |
05/30135664 DC : DRAFT JUN 2005 | IEC 60749-37 ED. 1 - SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 37: BOARD LEVEL DROP TEST METHOD FOR HANDHELD ELECTRONIC PRODUCTS |
BS EN 60747-15:2012 | Semiconductor devices. Discrete devices Isolated power semiconductor devices |
CEI EN 60749-37 : 2008 | SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 37: BOARD LEVEL DROP TEST METHOD USING AN ACCELEROMETER |
IEC 60747-14-4:2011 | Semiconductor devices - Discrete devices - Part 14-4: Semiconductor accelerometers |
IEC 62969-1:2017 | Semiconductor devices - Semiconductor interface for automotive vehicles - Part 1: General requirements of power interface for automotive vehicle sensors |
13/30277845 DC : 0 | BS EN 62149-8 ED 1.0 - FIBRE OPTIC ACTIVE COMPONENTS AND DEVICES - PERFORMANCE STANDARD - PART 8: SEEDED REFLECTIVE SEMICONDUCTOR OPTICAL AMPLIFIER DEVICES |
BS EN 62047-5:2011 | Semiconductor devices. Micro-electromechanical devices RF MEMS switches |
BS EN 62572-3:2016 | Fibre optic active components and devices. Reliability standards Laser modules used for telecommunication |
I.S. EN 62047-5:2011 | SEMICONDUCTOR DEVICES - MICRO-ELECTROMECHANICAL DEVICES - PART 5: RF MEMS SWITCHES |
IEC 62572-3:2016 | Fibre optic active components and devices - Reliability standards - Part 3: Laser modules used for telecommunication |
IEC 62149-2:2014 | Fibre optic active components and devices - Performance standards - Part 2: 850 nm discrete vertical cavity surface emitting laser devices |
IEC 60749-37:2008 | Semiconductor devices - Mechanical and climatic test methods - Part 37: Board level drop test method using an accelerometer |
PD IEC/TS 62686-1:2015 | Process management for avionics. Electronic components for aerospace, defence and high performance (ADHP) applications General requirements for high reliability integrated circuits and discrete semiconductors |
13/30264596 DC : 0 | BS EN 60747-14-7 ED 1.0 - SEMICONDUCTOR DEVICES - PART 14-7: SEMICONDUCTOR SENSORS - FLOW METER |
I.S. EN 62149-2:2014 | FIBRE OPTIC ACTIVE COMPONENTS AND DEVICES - PERFORMANCE STANDARDS - PART 2: 850 NM DISCRETE VERTICAL CAVITY SURFACE EMITTING LASER DEVICES |
BS EN 60749-37:2008 | Semiconductor devices. Mechanical and climatic test methods Board level drop test method using an accelerometer |
13/30264600 DC : 0 | BS EN 60747-14-8 ED 1.0 - SEMICONDUCTOR DEVICES - PART 14-8: SEMICONDUCTOR SENSORS - CAPACITIVE DEGRADATION SENSOR OF LIQUID |
16/30336986 DC : 0 | BS EN 62969-1 - SEMICONDUCTOR DEVICES - SEMICONDUCTOR INTERFACE FOR AUTOMOTIVE VEHICLES - PART 1: GENERAL REQUIREMENTS OF POWER INTERFACE FOR AUTOMOTIVE VEHICLE SENSORS |
I.S. EN 62149-8:2014 | FIBRE OPTIC ACTIVE COMPONENTS AND DEVICES - PERFORMANCE STANDARDS - PART 8: SEEDED REFLECTIVE SEMICONDUCTOR OPTICAL AMPLIFIER DEVICES |
IEC 60747-5-6:2016 | Semiconductor devices - Part 5-6: Optoelectronic devices - Light emitting diodes |
IEC 62149-8:2014 | Fibre optic active components and devices - Performance standards - Part 8: Seeded reflective semiconductor optical amplifier devices |
IEC 60747-15:2010 | Semiconductor devices - Discrete devices - Part 15: Isolated power semiconductor devices |
EN 60749-37:2008 | Semiconductor devices - Mechanical and climatic test methods - Part 37: Board level drop test method using an accelerometer |
EN 62572-3:2016 | Fibre optic active components and devices - Reliability standards - Part 3: Laser modules used for telecommunication |
EN 62047-5:2011 | Semiconductor devices - Micro-electromechanical devices - Part 5: RF MEMS switches |
EN 62149-2:2014 | Fibre optic active components and devices - Performance standards - Part 2: 850 nm discrete vertical cavity surface emitting laser devices |
OVE/ONORM EN 60749-37 : 2008 | SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 37: BOARD LEVEL DROP TEST METHOD USING AN ACCELEROMETER |
IEC 60068-2-27:2008 | Environmental testing - Part 2-27: Tests - Test Ea and guidance: Shock |
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