IEC 61192-4:2002
Withdrawn
A Withdrawn Standard is one, which is removed from sale, and its unique number can no longer be used. The Standard can be withdrawn and not replaced, or it can be withdrawn and replaced by a Standard with a different number.
Workmanship requirements for soldered electronic assemblies - Part 4: Terminal assemblies
Hardcopy , PDF , PDF 3 Users , PDF 5 Users , PDF 9 Users
31-12-2021
English - French
29-11-2002
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FOREWORD
INTRODUCTION
1 Scope
2 Normative references
3 Terms and definitions
4 General requirements
4.1 Classification
4.2 Conflict
4.3 Inspection technique
4.4 Interpretation of requirements
5 Process characterization
5.1 Wire preparation processes
5.2 Terminal mounting processes
5.3 Soldering terminal
5.4 Solderability
5.5 Preconditioning
5.6 Mechanical securing
6 Wire preparation attributes
6.1 Insulation stripping
6.2 Twisted strands
7 Connector pins and terminals
7.1 Soldered connector pins
8 Discrete wiring (jumper wires)
8.1 Wire selection
8.2 Wire routing
8.3 Staking
8.4 Termination
9 Discrete wiring (jumper wires) attributes
10 Solder joint acceptance
10.1 Post terminations
Figures
Table
Specifies general requirements for workmanship in terminal soldered assemblies on organic substrates, on printed boards, and on similar laminates attached to the surface(s) of inorganic substrates. It applies to assemblies that are totally terminals or mixed assemblies that include surface-mounting or other related assembly technologies, for example through-hole, wires.
| DevelopmentNote |
Stability Date: 2017. (09/2017)
|
| DocumentType |
Standard
|
| Pages |
59
|
| PublisherName |
International Electrotechnical Committee
|
| Status |
Withdrawn
|
| Standards | Relationship |
| GOST R IEC 61192-4 : 2010 | Identical |
| NF EN 61192-4 : 2003 | Identical |
| NEN EN IEC 61192-4 : 2003 | Identical |
| I.S. EN 61192-4:2003 | Identical |
| PN EN 61192-4 : 2007 | Identical |
| BS EN 61192-4:2003 | Identical |
| CEI EN 61192-4 : 2003 | Identical |
| EN 61192-4:2003 | Identical |
| DIN EN 61192-4:2003-11 | Identical |
| UNE-EN 61192-4:2003 | Identical |
| BS EN 61192-1:2003 | Workmanship requirements for soldered electronic assemblies General |
| I.S. EN 61193-1:2002 | QUALITY ASSESSMENT SYSTEMS - PART 1: REGISTRATION AND ANALYSIS OF DEFECTS ON PRINTED BOARD ASSEMBLIES |
| I.S. EN 61192-1:2003 | WORKMANSHIP REQUIREMENTS FOR SOLDERED ELECTRONIC ASSEMBLIES - GENERAL |
| IEC 61193-1:2001 | Quality assessment systems - Part 1: Registration and analysis of defects on printed board assemblies |
| EN 61192-3:2003 | Workmanship requirements for soldered electronic assemblies - Part 3: Through-hole mount assemblies |
| I.S. EN 61192-3:2003 | WORKMANSHIP REQUIREMENTS FOR SOLDERED ELECTRONIC ASSEMBLIES - PART 3: THROUGH-HOLE MOUNT ASSEMBLIES |
| 97/206324 DC : DRAFT MAY 1997 | |
| BS EN 61192-3:2003 | Workmanship requirements for soldered electronic assemblies Through-hole mount assemblies |
| I.S. EN 61192-2:2003 | WORKMANSHIP REQUIREMENTS FOR SOLDERED ELECTRONIC ASSEMBLIES - SURFACE-MOUNT ASSEMBLIES |
| IEC 61192-1:2003 | Workmanship requirements for soldered electronic assemblies - Part 1: General |
| IEC 61192-5:2007 | Workmanship requirements for soldered electronic assemblies - Part 5: Rework, modification and repair of soldered electronic assemblies |
| IEC 61192-2:2003 | Workmanship requirements for soldered electronic assemblies - Part 2: Surface-mount assemblies |
| 97/230541 DC : DRAFT AUG 1997 | |
| IEC 61192-3:2002 | Workmanship requirements for soldered electronic assemblies - Part 3: Through-hole mount assemblies |
| BS EN 61193-1:2002 | Quality assessment systems Registration and analysis of defects on printed board assemblies |
| BS EN 61192-5:2007 | Workmanship requirements for soldered electric assemblies Rework, modification and repair of soldered electronic assemblies |
| BS EN 61192-2:2003 | Workmanship requirements for soldered electronic assemblies Surface-mount assemblies |
| I.S. EN 61192-5:2007 | WORKMANSHIP REQUIREMENTS FOR SOLDERED ELECTRONIC ASSEMBLIES - PART 5: REWORK, MODIFICATION AND REPAIR OF SOLDERED ELECTRONIC ASSEMBLIES |
| EN 61193-1:2002 | Quality assessment systems - Part 1: Registration and analysis of defects on printed board assemblies |
| EN 61192-5 : 2007 | WORKMANSHIP REQUIREMENTS FOR SOLDERED ELECTRONIC ASSEMBLIES - PART 5: REWORK, MODIFICATION AND REPAIR OF SOLDERED ELECTRONIC ASSEMBLIES |
| EN 61192-2:2003 | Workmanship requirements for soldered electronic assemblies - Part 2: Surface-mount assemblies |
| EN 61192-1:2003 | Workmanship requirements for soldered electronic assemblies - Part 1: General |
| IEC 61192-3:2002 | Workmanship requirements for soldered electronic assemblies - Part 3: Through-hole mount assemblies |
| IEC 61189-3:2007 | Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3: Test methods for interconnection structures (printed boards) |
| IEC 61191-1:2013 | Printed board assemblies - Part 1: Generic specification - Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies |
| IEC 61192-1:2003 | Workmanship requirements for soldered electronic assemblies - Part 1: General |
| IEC 60194:2015 | Printed board design, manufacture and assembly - Terms and definitions |
| IEC 60749:1996+AMD1:2000+AMD2:2001 CSV | Semiconductor devices - Mechanical and climatic test methods |
| IEC 61191-4:2017 | Printed board assemblies - Part 4: Sectional specification - Requirements for terminal soldered assemblies |
| IEC 61192-2:2003 | Workmanship requirements for soldered electronic assemblies - Part 2: Surface-mount assemblies |
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