IPC 9201 : A
Current
The latest, up-to-date edition.
SURFACE INSULATION RESISTANCE HANDBOOK
Hardcopy
English, Japanese
19-09-2007
1 SCOPE AND DESIGNATION
1.1 Scope
1.2 Purpose
1.3 How is SIR Testing Used?
2 APPLICABLE DOCUMENTS
2.1 IPC
2.2 Joint Industry Standards
2.3 International Electrotechnical Commission (IEC)
2.4 American Society for Testing and Materials (ASTM)
3 SURFACE INSULATION RESISTANCE
3.1 Terms and Definitions
3.1.1 Metal Migration/Filament Formation
3.1.2 Electrochemical Corrosion
3.2 Basic Concepts
3.2.1 Sheet Resistance
3.2.2 A 'Square'
3.2.3 Series/Parallel Resistance
3.2.4 Ohms Per Square
3.2.5 Conduction Mechanisms
3.3 Test Factors Affecting Results
3.3.1 Wiring
3.3.3 Sample Orientation in the Chamber
3.3.4 Voltage
3.3.5 Test Temperature
3.3.6 Test Humidity
3.3.7 Rate of Change, Ambient to Elevated
3.3.8 Test board Design
3.3.9 Frequency of Measurement
3.3.10 Conformal Coating
3.4 Known Process Effects on SIR Levels
3.4.1 Precleaning
3.4.2 Developing Process Effects
3.4.3 Curing Effects
3.4.4 Hot Air Solder Leveling (HASL)
4 ASSESSMENT OF SIR TEST METHODS
4.1 Test Methods - General
4.1.1 Cyclical Test Environments
4.1.2 Harsh Static Environments
4.1.3 Measurement Frequency
4.2 Description of Test Methods
4.3 Use of Salt Solutions
4.4 Acceleration Factors
4.4.1 Arrhenius Model
4.4.2 Eyring Model
5 SETTING UP FOR SIR TESTING
5.1 Data Acquisition and Associated Hardware
5.2 Fixturing
5.2.1 Fixturing Internal to Chamber
5.2.2 Fixturing External to Chamber
5.3 Chamber Design and Configuration
5.4 System Verification and Calibration
5.4.1 SIR Test Chamber
5.4.2 The Data Acquisition System
5.4.3 Test Supplies
5.4.4 Power Supplies
6 RUNNING A TEST AND TEST CONSISTENCY
6.1 Substrate Preparation Important Notes
6.1.1 Test Specimen Marking
6.2 Test Specimen Controls
6.3 Pretest Checks
6.3.1 Chamber
6.3.2 Test Specimens
6.3.3 Sample Randomization and Placement
6.4 Starting the Test
6.5 Test Chamber Monitoring
6.6 Post-Test Operations
6.7 Data Analysis Example
6.8 Treatment of 'Anomalous' Data
7 QUALIFICATION PHASES
7.1 Materials vs. Process Qualification
7.2 Determining Acceptance Criteria
7.2.1 Readings Vs. Visual Examination
7.2.2 Temperature and Humidity Variations
7.2.3 Discussion of Test Specimen Design
7.2.4 Available SIR Test Vehicles
8 RECOMMENDATIONS FOR PREVENTION OF SIR FAILURES
8.1 Typical SIR Failures
8.2 Contingencies
8.3 Other Recommendations
9 SIR TESTING ON NONPRINTED BOARD MATERIALS
9.1 Alternative Substrates
9.2 Testing Other Printed Board Materials
9.3 High Resistance Measurements
9.4 Integrated Circuits (Wafers)
10 REFERENCES
10.1 Published Papers
10.2 Industry Contacts and SIR Equipment Vendors
APPENDIX A - LITERATURE REVIEW
APPENDIX B - LISTING OF TEST METHODS AND CRITERIA
APPENDIX C - SIR TEST VEHICLES
Covers the terminology, theories, test procedures and test vehicles of SIR testing, including temperature-humidity (TH) and temperature-humidity-bias (THB).
DevelopmentNote |
Included in IPC C 108. (06/2008) Included in IPC C 1000. (07/2008)
|
DocumentType |
Standard
|
ISBN |
978-1-63816-161-5
|
Pages |
86
|
PublisherName |
Institute of Printed Circuits
|
Status |
Current
|
BS IEC 61189-5-4 : 2015 | TEST METHODS FOR ELECTRICAL MATERIALS, PRINTED BOARDS AND OTHER INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 5-4: GENERAL TEST METHODS FOR MATERIALS AND ASSEMBLIES - SOLDER ALLOYS AND FLUXED AND NON-FLUXED SOLID WIRE FOR PRINTED BOARD ASSEMBLIES |
12/30274796 DC : 0 | BS IEC 61189-5-2 ED.1 - TEST METHODS FOR ELECTRICAL MATERIALS, INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 5-2: TEST METHODS FOR PRINTED BOARD ASSEMBLIES: SOLDERING FLUX |
12/30274804 DC : 0 | BS IEC 61189-5-4 ED.1 - TEST METHODS FOR ELECTRICAL MATERIALS, INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 5-4: TEST METHODS FOR PRINTED BOARD ASSEMBLIES: SOLDER ALLOYS AND FLUXED AND NON-FLUXED SOLID WIRE |
BS IEC 61189-5-2 : 2015 | TEST METHODS FOR ELECTRICAL MATERIALS, PRINTED BOARDS AND OTHER INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 5-2: GENERAL TEST METHODS FOR MATERIALS AND ASSEMBLIES - SOLDERING FLUX FOR PRINTED BOARD ASSEMBLIES |
IEC 61189-5-2:2015 | Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-2: General test methods for materials and assemblies - Soldering flux for printed board assemblies |
EN 61189-5-1:2016 | Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-1: General test methods for materials and assemblies - Guidance for printed board assemblies |
EN 61189-5-4:2015 | Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-4: General test methods for materials and assemblies - Solder alloys and fluxed and non-fluxed solid wire for printed board assemblies |
EN 61189-5-3:2015 | Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-3: General test methods for materials and assemblies - Soldering paste for printed board assemblies |
IPC 7093 CHINESE : - | DESIGN AND ASSEMBLY PROCESS IMPLEMENTATION FOR BOTTOM TERMINATION COMPONENTS |
IPC 5702 : 0 | GUIDELINES FOR OEMS IN DETERMINING ACCEPTABLE LEVELS OF CLEANLINESS OF UNPOPULATED PRINTED BOARDS |
IPC TR 583 : 0 | AN IN-DEPTH LOOK AT IONIC CLEANLINESS TESTING |
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IPC 9203 : 0 | USERS GUIDE TO IPC-9202 AND THE IPC-B-52 STANDARD TEST VEHICLE |
IPC MI 660 : 1984 | INCOMING INSPECTION OF RAW MATERIALS MANUAL |
IPC J STD 001 ROMANIAN : F | REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES |
12/30274800 DC : 0 | BS IEC 61189-5-3 ED.1 - TEST METHODS FOR ELECTRICAL MATERIALS, INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 5-3: TEST METHODS FOR PRINTED BOARD ASSEMBLIES: SOLDERING PASTE |
IPC SA 61 : A | POST SOLDER SEMI-AQUEOUS CLEANING HANDBOOK |
BS EN 61189-5-1:2016 | Test methods for electrical materials, printed boards and other interconnection structures and assemblies General test methods for materials and assemblies. Guidance for printed board assemblies |
IEC 61189-5-4:2015 | Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-4: General test methods for materials and assemblies - Solder alloys and fluxed and non-fluxed solid wire for printed board assemblies |
IPC J STD 001 CHINESE : F | REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES |
IPC J STD 001 SPANISH : F | REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES |
IPC J STD 001 FRENCH : F | REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES |
IPC 7093 : 0 | DESIGN AND ASSEMBLY PROCESS IMPLEMENTATION FOR BOTTOM TERMINATION COMPONENTS |
IPC 9202 : 0 | MATERIAL AND PROCESS CHARACTERIZATION/QUALIFICATION TEST PROTOCOL FOR ASSESSING ELECTROCHEMICAL PERFORMANCE |
BS EN 61189-5-4:2015 | Test methods for electrical materials, printed boards and other interconnection structures and assemblies General test methods for materials and assemblies. Solder alloys and fluxed and non-fluxed solid wire for printed board assemblies |
BS IEC 61189-5-3 : 2015 | TEST METHODS FOR ELECTRICAL MATERIALS, PRINTED BOARDS AND OTHER INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 5-3: GENERAL TEST METHODS FOR MATERIALS AND ASSEMBLIES - SOLDERING PASTE FOR PRINTED BOARD ASSEMBLIES |
BS EN 61189-5-3:2015 | Test methods for electrical materials, printed boards and other interconnection structures and assemblies General test methods for materials and assemblies. Soldering paste for printed board assemblies |
IPC TR 582 : 0 | CLEANING AND CLEANLINESS TESTING PROGRAM FOR PHASE 3 - LOW SOLIDS, FLUXES AND PASTES PROCESSED IN AMBIENT AIR |
I.S. EN 61189-5:2006 | TEST METHODS FOR ELECTRICAL MATERIALS, INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 5: TEST METHODS FOR PRINTED BOARD ASSEMBLIES |
IEC 61189-5:2006 | Test methods for electrical materials, interconnection structures and assemblies - Part 5: Test methods for printed board assemblies |
IEC TR 62866:2014 | Electrochemical migration in printed wiring boards and assemblies - Mechanisms and testing |
BS EN ISO 9455-17:2006 | Soft soldering fluxes. Test methods Surface insulation resistance comb test and electrochemical migration test of flux residues |
IPC J STD 030 : A | SELECTION AND APPLICATION OF BOARD LEVEL UNDERFILL MATERIALS |
BS EN 61189-5:2006 | Test methods for electrical materials, interconnection structures and assemblies Test methods for printed board assemblies |
BS EN 61189-5-2:2015 | Test methods for electrical materials, printed boards and other interconnection structures and assemblies General test methods for materials and assemblies. Soldering flux for printed board assemblies |
IPC M 108 : LATEST | CLEANING GUIDES AND HANDBOOKS MANUAL |
I.S. EN 61189-5-4:2015 | TEST METHODS FOR ELECTRICAL MATERIALS, PRINTED BOARDS AND OTHER INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 5-4: GENERAL TEST METHODS FOR MATERIALS AND ASSEMBLIES - SOLDER ALLOYS AND FLUXED AND NON-FLUXED SOLID WIRE FOR PRINTED BOARD ASSEMBLIES |
IEC 61189-5-1:2016 | Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-1: General test methods for materials and assemblies - Guidance for printed board assemblies |
PD IEC/TR 62866:2014 | Electrochemical migration in printed wiring boards and assemblies. Mechanisms and testing |
IEC 61189-5-3:2015 | Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-3: General test methods for materials and assemblies - Soldering paste for printed board assemblies |
IEC TS 62647-22:2013 | Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 22: Technical guidelines |
ISO 9455-17:2002 | Soft soldering fluxes — Test methods — Part 17: Surface insulation resistance comb test and electrochemical migration test of flux residues |
EN ISO 9455-17:2006 | Soft soldering fluxes - Test methods - Part 17: Surface insulation resistance comb test and electrochemical migration test of flux residues (ISO 9455-17:2002) |
IPC TR 476 : A1997 | ELECTROCHEMICAL MIGRATION: ELECTRICALLY INDUCED FAILURES IN PRINTED WIRING ASSEMBLIES |
BS ISO 9455-17 : 2002 AMD 16425 | SOFT SOLDERING FLUXES - TEST METHODS - PART 17: SURFACE INSULATION RESISTANCE COMB TEST AND ELECTROCHEMICAL MIGRATION TEST OF FLUX RESIDUES |
IPC A 52-G : 2006 | CLEANLINESS AND RESIDUE EVALUATION TEST BOARD |
IPC TR 580 : 1989 | CLEANING AND CLEANLINESS TEST PROGRAM, PHASE 1 TEST RESULTS |
I.S. EN 61189-5-3:2015 | TEST METHODS FOR ELECTRICAL MATERIALS, PRINTED BOARDS AND OTHER INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 5-3: GENERAL TEST METHODS FOR MATERIALS AND ASSEMBLIES - SOLDERING PASTE FOR PRINTED BOARD ASSEMBLIES |
I.S. EN 61189-5-2:2015 | TEST METHODS FOR ELECTRICAL MATERIALS, PRINTED BOARDS AND OTHER INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 5-2: GENERAL TEST METHODS FOR MATERIALS AND ASSEMBLIES - SOLDERING FLUX FOR PRINTED BOARD ASSEMBLIES |
IPC TR 581 : 1994 | IPC PHASE 3 CONTROLLED ATMOSPHERE SOLDERING STUDY |
PD IEC/TS 62647-22:2013 | Process management for avionics. Aerospace and defence electronic systems containing lead-free solder Technical guidelines |
EN 61189-5-2:2015 | Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-2: General test methods for materials and assemblies - Soldering flux for printed board assemblies |
EN 61189-5 : 2006 | TEST METHODS FOR ELECTRICAL MATERIALS, INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 5: TEST METHODS FOR PRINTED BOARD ASSEMBLIES |
I.S. EN ISO 9455-17:2006 | SOFT SOLDERING FLUXES - TEST METHODS - PART 17: SURFACE INSULATION RESISTANCE COMB TEST AND ELECTROCHEMICAL MIGRATION TEST OF FLUX RESIDUES |
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