ISO 9454-2:1998
Withdrawn
Withdrawn
A Withdrawn Standard is one, which is removed from sale, and its unique number can no longer be used. The Standard can be withdrawn and not replaced, or it can be withdrawn and replaced by a Standard with a different number.
View Superseded by
Soft soldering fluxes Classification and requirements Part 2: Performance requirements
Available format(s)
Hardcopy , PDF , PDF 3 Users , PDF 5 Users , PDF 9 Users
Withdrawn date
16-11-2020
Superseded by
Language(s)
English, French
Published date
20-08-1998
Important note : Users cannot be edited or removed once added to your Multi user PDF.| DocumentType |
Standard
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| Pages |
7
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| PublisherName |
International Organization for Standardization
|
| Status |
Withdrawn
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| SupersededBy |
| Standards | Relationship |
| ONORM EN ISO 9454-2 : 2000 | Identical |
| NBN EN ISO 9454-2 : 2000 | Identical |
| NEN EN ISO 9454-2 : 2000 | Identical |
| NEN ISO 9454-2 : 1998 | Identical |
| NS EN ISO 9454-2 : 1ED 2000 | Identical |
| I.S. EN ISO 9454-2:2000 | Identical |
| PN EN ISO 9454-2 : 2004 | Identical |
| SN EN ISO 9454-2 : 2000 | Identical |
| UNI EN ISO 9454-2 : 2001 | Identical |
| BS EN ISO 9454-2:2001 | Identical |
| EN ISO 9454-2:2000 | Identical |
| NF EN ISO 9454-2 : 2000 | Identical |
| DIN EN ISO 9454-2:2000-09 | Identical |
| UNE-EN ISO 9454-2:2000 | Identical |
| DIN EN 16125:2016-03 | LPG EQUIPMENT AND ACCESSORIES - PIPEWORK SYSTEMS AND SUPPORTS - LPG LIQUID PHASE AND VAPOUR PRESSURE PHASE |
| BS EN 60068-2-58 : 2015 | ENVIRONMENTAL TESTING - PART 2-58: TESTS - TEST TD: TEST METHODS FOR SOLDERABILITY, RESISTANCE TO DISSOLUTION OF METALLIZATION AND TO SOLDERING HEAT OF SURFACE MOUNTING DEVICES (SMD) |
| BS EN 61190-1-1:2002 | Attachment materials for electronic assembly Requirements for soldering fluxes for high-quality interconnections in electronics assembly |
| I.S. 820:2010 | NON-DOMESTIC GAS INSTALLATIONS |
| EN 61190-1-2:2014 | Attachment materials for electronic assembly - Part 1-2: Requirements for soldering pastes for high-quality interconnects in electronics assembly |
| CEI EN 60068-2-58 : 2016 | ENVIRONMENTAL TESTING - PART 2-58: TESTS - TEST TD: TEST METHODS FOR SOLDERABILITY, RESISTANCE TO DISSOLUTION OF METALLIZATION AND TO SOLDERING HEAT OF SURFACE MOUNTING DEVICES (SMD) |
| EN IEC 61190-1-3:2018 | Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solder for electronic soldering applications |
| I.S. EN IEC 61190-1-3:2018 | ATTACHMENT MATERIALS FOR ELECTRONIC ASSEMBLY - PART 1-3: REQUIREMENTS FOR ELECTRONIC GRADE SOLDER ALLOYS AND FLUXED AND NON-FLUXED SOLID SOLDER FOR ELECTRONIC SOLDERING APPLICATIONS |
| I.S. EN 61190-1-3:2007 | ATTACHMENT MATERIALS FOR ELECTRONIC ASSEMBLY - PART 1-3: REQUIREMENTS FOR ELECTRONIC GRADE SOLDER ALLOYS AND FLUXED AND NON-FLUXED SOLID SOLDERS FOR ELECTRONIC SOLDERING APPLICATIONS |
| DIN EN 1775:2007-10 | Gas supply - Gas pipework for buildings - Maximum operating pressure less than or equal to 5 bar - Functional recommendations |
| I.S. EN 1775:2007 | GAS SUPPLY - GAS PIPEWORK FOR BUILDINGS - MAXIMUM OPERATING PRESSURE LESS THAN OR EQUAL TO 5 BAR - FUNCTIONAL RECOMMENDATIONS |
| 15/30318681 DC : 0 | BS EN 61190-1-3 ED 3.0 - ATTACHMENT MATERIALS FOR ELECTRONIC ASSEMBLY - PART 1-3: REQUIREMENTS FOR ELECTRONIC GRADE SOLDER ALLOYS AND FLUXED AND NON-FLUXED SOLID SOLDER FOR ELECTRONIC SOLDERING APPLICATIONS |
| NF ISO 26842-1 : 2009 | ADHESIVES - TEST METHODS FOR THE EVALUATION AND SELECTION OF ADHESIVES FOR INDOOR WOOD PRODUCTS - PART 1: RESISTANCE TO DELAMINATION IN NON-SEVERE ENVIRONMENTS |
| BS EN 61190-1-2:2014 | Attachment materials for electronic assembly Requirements for soldering pastes for high-quality interconnects in electronics assembly |
| 05/30133283 DC : DRAFT MAY 2005 | IEC 61190-1-2 ED 2 - ATTACHMENT MATERIALS FOR ELECTRONIC ASSEMBLY - PART 1-2: REQUIREMENTS FOR SOLDERING PASTE FOR HIGH-QUALITY INTERCONNECTS IN ELECTRONICS ASSEMBLY |
| BS EN 61190-1-3 : 2007 | ATTACHMENT MATERIALS FOR ELECTRONIC ASSEMBLY - PART 1-3: REQUIREMENTS FOR ELECTRONIC GRADE SOLDER ALLOYS AND FLUXED AND NON-FLUXED SOLID SOLDERS FOR ELECTRONIC SOLDERING APPLICATIONS |
| I.S. EN 61190-1-2:2014 | ATTACHMENT MATERIALS FOR ELECTRONIC ASSEMBLY - PART 1-2: REQUIREMENTS FOR SOLDERING PASTES FOR HIGH-QUALITY INTERCONNECTS IN ELECTRONICS ASSEMBLY |
| BS EN 16125:2015 | LPG Equipment and Accessories. Pipework systems and supports. LPG in liquid phase and vapour pressure phase |
| NF EN 61190-1-3 : 2008 AMD 1 2010 | Fastening materials for electronic assemblies - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non fluxed solid solders for electronic soldering applications |
| UNE-EN 16125:2016 | LPG Equipment and Accessories - Pipework systems and supports - LPG in liquid phase and vapour pressure phase |
| UNI EN 1775 : 2007 | GAS SUPPLY - GAS PIPEWORK FOR BUILDINGS - MAXIMUM OPERATING PRESSURE LESS THAN OR EQUAL TO 5 BAR - FUNCTIONAL RECOMMENDATIONS |
| 05/30133287 DC : DRAFT MAY 2005 | IEC 61190-1-3 ED 2 - ATTACHMENT MATERIALS FOR ELECTRONIC ASSEMBLY - PART 1-3: REQUIREMENTS FOR ELECTRONIC GRADE SOLDER ALLOYS AND FLUXED AND NON-FLUXED SOLID SOLDER FOR ELECTRONIC SOLDERING APPLICATIONS |
| I.S. EN 16125:2015 | LPG EQUIPMENT AND ACCESSORIES - PIPEWORK SYSTEMS AND SUPPORTS - LPG IN LIQUID PHASE AND VAPOUR PRESSURE PHASE |
| IEC 60068-2-58:2015+AMD1:2017 CSV | Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD) |
| IEC 61190-1-3:2017 | Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solder for electronic soldering applications |
| IEC 61190-1-1:2002 | Attachment materials for electronic assembly - Part 1-1: Requirements for soldering fluxes for high-quality interconnections in electronics assembly |
| EN 1775:2007 | Gas supply - Gas pipework for buildings - Maximum operating pressure less than or equal to 5 bar - Functional recommendations |
| EN 16125:2015 | LPG Equipment and Accessories - Pipework systems and supports - LPG in liquid phase and vapour pressure phase |
| 10/30227098 DC : 0 | BS EN 16125 - LPG EQUIPMENT AND ACCESSORIES - PIPEWORK SYSTEMS AND SUPPORTS - LPG LIQUID PHASE AND VAPOUR PRESSURE PHASE |
| 12/30258438 DC : 0 | BS EN 61190-1-2 AMD 1ED.2 - ATTACHMENT MATERIALS FOR ELECTRONIC ASSEMBLY - PART 1-2: REQUIREMENTS FOR SOLDERING PASTES FOR HIGH-QUALITY INTERCONNECTS IN ELECTRONICS ASSEMBLY |
| I.S. EN 60068-2-58:2015 | ENVIRONMENTAL TESTING - PART 2-58: TESTS - TEST TD: TEST METHODS FOR SOLDERABILITY, RESISTANCE TO DISSOLUTION OF METALLIZATION AND TO SOLDERING HEAT OF SURFACE MOUNTING DEVICES (SMD) |
| I.S. EN 61190-1-1:2002 | ATTACHMENT MATERIALS FOR ELECTRONIC ASSEMBLY - PART 1-1: REQUIREMENTS FOR SOLDERING FLUXES FOR HIGH-QUALITY INTERCONNECTIONS IN ELECTRONICS ASSEMBLY |
| BS EN 1775:2007 | Gas supply. Gas pipework for buildings. Maximum operating pressure less than or equal to 5 bar. Functional recommendations |
| IEC 61190-1-2:2014 | Attachment materials for electronic assembly - Part 1-2: Requirements for soldering pastes for high-quality interconnects in electronics assembly |
| EN 60068-2-58:2015/A1:2018 | ENVIRONMENTAL TESTING - PART 2-58: TESTS - TEST TD: TEST METHODS FOR SOLDERABILITY, RESISTANCE TO DISSOLUTION OF METALLIZATION AND TO SOLDERING HEAT OF SURFACE MOUNTING DEVICES (SMD) (IEC 60068-2-58:2015/A1:2017) |
| EN 61190-1-1:2002 | Attachment materials for electronic assembly - Part 1-1: Requirements for soldering fluxes for high-quality interconnections in electronics assembly |
| UNE-EN 16125:2020 | LPG Equipment and Accessories - Pipework systems and supports - LPG in liquid phase and vapour pressure phase |
| ISO 9455-10:2012 | Soft soldering fluxes — Test methods — Part 10: Flux efficacy test, solder spread method |
| ISO 9455-11:2017 | Soft soldering fluxes — Test methods — Part 11: Solubility of flux residues |
| ISO 9455-15:2017 | Soft soldering fluxes — Test methods — Part 15: Copper corrosion test |
| ISO 9455-2:1993 | Soft soldering fluxes — Test methods — Part 2: Determination of non-volatile matter, ebulliometric method |
| ISO 9454-1:2016 | Soft soldering fluxes Classification and requirements Part 1: Classification, labelling and packaging |
| ISO 9455-12:1992 | Soft soldering fluxes Test methods Part 12: Steel tube corrosion test |
| ISO 9455-9:1993 | Soft soldering fluxes Test methods Part 9: Determination of ammonia content |
| ISO 9455-1:1990 | Soft soldering fluxes — Test methods — Part 1: Determination of non-volatile matter, gravimetric method |
| ISO 9455-3:1992 | Soft soldering fluxes — Test methods — Part 3: Determination of acid value, potentiometric and visual titration methods |
| ISO 9455-8:1991 | Soft soldering fluxes — Test methods — Part 8: Determination of zinc content |
| ISO 9455-14:2017 | Soft soldering fluxes — Test methods — Part 14: Assessment of tackiness of flux residues |
| ISO 9455-13:2017 | Soft soldering fluxes — Test methods — Part 13: Determination of flux spattering |
| ISO 9455-5:2014 | Soft soldering fluxes Test methods Part 5: Copper mirror test |
| ISO 9455-6:1995 | Soft soldering fluxes — Test methods — Part 6: Determination and detection of halide (excluding fluoride) content |
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