BS EN 62326-20:2016
Current
Current
The latest, up-to-date edition.
Printed boards Printed circuit boards for high-brightness LEDs
Available format(s)
Hardcopy , PDF
Language(s)
English
Published date
31-05-2016
Publisher
Important note : Users cannot be edited or removed once added to your Multi user PDF.| Committee |
EPL/501
|
| DevelopmentNote |
Supersedes 11/30253280 DC. (08/2016)
|
| DocumentType |
Standard
|
| Pages |
56
|
| PublisherName |
British Standards Institution
|
| Status |
Current
|
| Supersedes |
IEC 62326-20:2016 specifies the properties of the printed circuit board (hereafter described as PCB) for high-brightness LEDs. Many aspects of the PCB for high-brightness LEDs are identical with those of ordinary PCBs, therefore, some aspects of this standard also describe general aspects. This edition includes the following significant technical changes with respect to the previous edition:
a) this edition focuses on the technical content of the printed circuit board for high-brightness LEDs;
b) the figures related to the printed circuit board for high-brightness LEDs have been refined.
| Standards | Relationship |
| EN 62326-20:2016 | Identical |
| IEC 62326-20:2016 | Identical |
| IEC 61189-11:2013 | Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 11: Measurement of melting temperature or melting temperature ranges of solder alloys |
| IEC 60068-1:2013 | Environmental testing - Part 1: General and guidance |
| IEC TR 62866:2014 | Electrochemical migration in printed wiring boards and assemblies - Mechanisms and testing |
| IEC 60068-2-58:2015+AMD1:2017 CSV | Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD) |
| IEC 60068-2-20:2008 | Environmental testing - Part 2-20: Tests - Test T: Test methods for solderability and resistance to soldering heat of devices with leads |
| EN 61249-2-6:2003/corrigendum:2005 | MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 2-6: REINFORCED BASE MATERIALS, CLAD AND UNCLAD - BROMINATED EPOXIDE NON-WOVEN/WOVEN E-GLASS REINFORCED LAMINATED SHEETS OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST), COPPER-CLAD |
| IEC 61190-1-2:2014 | Attachment materials for electronic assembly - Part 1-2: Requirements for soldering pastes for high-quality interconnects in electronics assembly |
| IEC 61249-2-7:2002 | Materials for printed boards and other interconnecting structures - Part 2-7: Reinforced base materials clad and unclad - Epoxide woven E-glass laminated sheet of defined flammability (vertical burning test), copper-clad |
| IEC 60068-2-21:2006 | Environmental testing - Part 2-21: Tests - Test U: Robustness of terminations and integral mounting devices |
| IEC 61189-3-913:2016 | Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3-913: Test method for thermal conductivity of electronic circuit boards for high-brightness LEDs |
| ISO 3366:1999 | Coated abrasives Abrasive rolls |
| IEC 62137-1-3:2008 | Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-3: Cyclic drop test |
| IEC 60068-2-66:1994 | Environmental testing - Part 2: Test methods - Test Cx: Damp heat, steady state (unsaturated pressurized vapour) |
| ISO 4957:1999 | Tool steels |
| IEC 62326-1:2002 | Printed boards - Part 1: Generic specification |
| IEC 61189-1:1997+AMD1:2001 CSV | Test methods for electrical materials, interconnection structures and assemblies - Part 1: General test methods and methodology |
| ISO 9454-1:2016 | Soft soldering fluxes Classification and requirements Part 1: Classification, labelling and packaging |
| IEC 60068-2-64:2008 | Environmental testing - Part 2-64: Tests - Test Fh: Vibration, broadband random and guidance |
| IEC 60068-2-53:2010 | Environmental testing - Part 2-53: Tests and guidance - Combined climatic (temperature/humidity) and dynamic (vibration/shock) tests |
| EN 61249-2-7:2002/corrigendum:2005 | MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 2-7: REINFORCED BASE MATERIALS CLAD AND UNCLAD - EPOXIDE WOVEN E-GLASS LAMINATED SHEET OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST), COPPER-CLAD |
| ISO 15184:2012 | Paints and varnishes Determination of film hardness by pencil test |
| IEC 62326-4:1996 | Printed boards - Part 4: Rigid multilayer printed boards with interlayer connections - Sectional specification |
| IEC 60068-2-38:2009 | Environmental testing - Part 2-38: Tests - Test Z/AD: Composite temperature/humidity cyclic test |
| IEC 62137-1-4:2009 | Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-4: Cyclic bending test |
| EN 61189-3:2008 | Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3: Test methods for interconnection structures (printed boards) |
| ISO 6906:1984 | Vernier callipers reading to 0,02 mm |
| ISO 29864:2007 | Self adhesive tapes Measurement of breaking strength and elongation at break |
| ISO 13385-1:2011 | Geometrical product specifications (GPS) Dimensional measuring equipment Part 1: Callipers; Design and metrological characteristics |
| ISO 9180:1988 | Black leads for wood-cased pencils Classification and diameters |
| ISO 6353-3:1987 | Reagents for chemical analysis — Part 3: Specifications — Second series |
| IEC 61190-1-1:2002 | Attachment materials for electronic assembly - Part 1-1: Requirements for soldering fluxes for high-quality interconnections in electronics assembly |
| IEC 61189-3:2007 | Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3: Test methods for interconnection structures (printed boards) |
| ISO 29863:2007 | Self adhesive tapes Measurement of static shear adhesion |
| ISO 29862:2007 | Self adhesive tapes Determination of peel adhesion properties |
| ISO 3599:1976 | Vernier callipers reading to 0,1 and 0,05 mm |
| IEC 60068-2-2:2007 | Environmental testing - Part 2-2: Tests - Test B: Dry heat |
| IEC 60194:2015 | Printed board design, manufacture and assembly - Terms and definitions |
| ISO 8512-1:1990 | Surface plates — Part 1: Cast iron |
| ISO 291:2008 | Plastics Standard atmospheres for conditioning and testing |
| IEC 60068-2-80:2005 | Environmental testing - Part 2-80: Tests - Test Fi: Vibration - Mixed mode |
| ISO 3611:2010 | Geometrical product specifications (GPS) — Dimensional measuring equipment: Micrometers for external measurements — Design and metrological characteristics |
| ISO 9453:2014 | Soft solder alloys Chemical compositions and forms |
| ISO 8512-2:1990 | Surface plates — Part 2: Granite |
| ISO 21948:2001 | Coated abrasives Plain sheets |
| IEC 60068-2-1:2007 | Environmental testing - Part 2-1: Tests - Test A: Cold |
| IEC 61249-2-6:2003 | Materials for printed boards and other interconnecting structures - Part 2-6: Reinforced base materials, clad and unclad - Brominated epoxide non-woven/woven E-glass reinforced laminated sheets of defined flammability (vertical burning test), copper-clad |
| EN 62878-1-1:2015 | Device embedded substrate - Part 1-1: Generic specification - Test methods |
| ISO 2409:2013 | Paints and varnishes Cross-cut test |
| ISO 9445-1:2009 | Continuously cold-rolled stainless steel Tolerances on dimensions and form Part 1: Narrow strip and cut lengths |
| IEC 61189-2:2006 | Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2: Test methods for materials for interconnection structures |
| IEC 61249-2-8:2003 | Materials for printed boards and other interconnecting structures - Part 2-8: Reinforced base materials clad and unclad - Modified brominated epoxide woven fibreglass reinforced laminated sheets of defined flammability (vertical burning test), copper-clad |
| EN 60194:2006 | Printed board design, manufacture and assembly - Terms and definitions |
| IEC 61190-1-3:2007+AMD1:2010 CSV | Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications |
| IEC 60068-2-30:2005 | Environmental testing - Part 2-30: Tests - Test Db: Damp heat, cyclic (12 h + 12 h cycle) |
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