FED-STD-209 Revision E:1992
Superseded
A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.
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AIRBORNE PARTICULATE CLEANLINESS CLASSES IN CLEANROOMS AND CLEAN ZONES
29-11-2001
1 Scope and limitations
1.1 Scope
1.2 Limitations
2 Referenced documents
3 Definitions
3.1 Airborne particulate cleanliness class
3.2 Anisokinetic sampling
3.3 Calibration
3.4 Clean zone
3.5 Cleanroom
3.5.1 As-built cleanroom (facility)
3.5.2 At-rest cleanroom (facility)
3.5.3 Operational cleanroom (facility)
3.6 Condensation nucleus counter (CNC)
3.7 Discrete-particle counter (DPC)
3.8 Entrance plane
3.9 Isoaxial
3.10 Isokinetic sampling
3.11 Monitoring
3.12 Nonunidirectional airflow
3.13 Particle
3.14 Particle concentration
3.15 Particle size
3.16 Student's t statistic
3.17 U descriptor
3.18 Ultrafine particles
3.19 Unidirectional airflow
3.20 Upper confidence limit (UCL)
3.21 Verification
4 Airborne particulate cleanliness classes and
U descriptors
4.1 Class listed in Table I
4.1.1 Measurement at particle sizes listed in Table
I
4.1.2 Measurement at alternative particle sizes
4.2 Provision for defining alternative airborne
particulate cleanliness classes
Table I. Airborne particulate cleanliness
classes
4.3 Provision for describing ultrafine particle
concentrations (U descriptors)
4.4 Nomenclature for airborne particle
concentrations
4.4.1 Format for airborne particulate cleanliness
classes
4.4.2 Format for U descriptors
5 Verification and monitoring of airborne
particulate cleanliness
5.1 Verification of airborne particulate
cleanliness
5.1.1 Frequency
5.1.2 Environmental test conditions
5.1.2.1 State of cleanroom or clean zone during
verification
5.1.2.2 Environmental factors
5.1.3 Particle counting
5.1.3.1 Sample locations and number: unidirectional
airflow
5.1.3.2 Sample locations and number:
nonunidirectional airflow
5.1.3.3 Restrictions on sample locations
5.1.3.4 Sample volume and sampling time
5.1.3.4.1 Single sampling plan for classes in Table I
5.1.3.4.2 Single sampling plan for alternative classes
or particle sizes
5.1.3.4.3 Single sampling plan for U descriptors
5.1.3.4.4 Sequential sampling plan
5.1.4 Interpretation of the data
5.2 Monitoring of airborne particulate
cleanliness
5.2.1 Monitoring plan
5.2.2 Particle counting for monitoring
5.3 Methods and equipment for measuring airborne
particle concentrations
5.3.1 Counting particles 5 micrometers and larger
5.3.2 Counting particles smaller than 5 micrometers
5.3.3 Counting ultrafine particles
5.3.4 Limitations of particle counting methods
5.3.5 Calibration of particle counting
instrumentation
5.4 Statistical analysis
5.4.1 Acceptance criteria for verification
5.4.2 Calculations to determine acceptance
5.4.2.1 Average particle concentration at a location
5.4.2.2 Mean of the averages
5.4.2.3 Standard deviation of the averages
5.4.2.4 Standard error of the mean of the averages
5.4.2.5 Upper confidence limit (UCL)
Table II. UCL factor for 95% upper confidence
limit
5.4.2.6 Sample calculation
6 Recommendation for changes
7 Conflict with referenced documents
8 Federal agency interests
Appendix A - Counting and sizing airborne particles
using optical microscopy
A10 Scope
A20 Summary of the method
A30 Equipment
A40 Preparation of equipment
A50 Sampling the air
A60 Calibration of the microscope
A70 Counting and sizing particles by optical
microscopy
A80 Reporting
A90 Factors affecting precision and accuracy
Appendix B - Operation of a discrete-particle counter
B10 Scope and limitations
B20 References
B30 Summary of method
B40 Apparatus and related documentation
B50 Preparation for sampling
B60 Sampling
B70 Reporting
Appendix C - Isokinetic and anisokinetic sampling
C10 Scope
C20 Reference
C30 Background
C40 Methods
Figure C.1. Probe inlet diameters (metric
units) for isokinetic sampling, v = vo
Figure C.2. probe inlet diameters (English
units) for isokinetic sampling, v = vo
Figure C.3. Contours of sampling bias,
c/co = 0.95, 1.05
C50 Example
Appendix D - Method for measuring the concentration of
ultrafine particles
D10 Scope
D20 References
D30 Apparatus
Figure D.1. Envelope of acceptability for the
counting efficiency of a DPC used to verify
the U descriptor
D40 Determining the concentration of ultrafine
particles
Appendix E - Rationale for the statistical rules used in
FED-STD-209E
E10 Scope
E20 The statistical rules
E30 Sequential sampling
E40 Sample calculation to determine statistical
validity of a verification
Appendix F - Sequential sampling: an optional method for
verifying the compliance of air to the
limits of airborne particulate cleanliness
classes M 2.5 and cleaner
F10 Scope
F20 References
F30 Background
F40 Method
Figure F.1. Observed count, C, vs. expected
count, E, for sequential sampling
Table F.1. Upper and lower limits for time at
which C counts should arrive
F50 Examples
F60 Reporting
Appendix G - Sources of supplemental information
G10 Scope
G20 Sources of supplemental information
Gives classes of air cleanliness for airborne particulate levels in cleanrooms and zones. Gives methods for class verification and monitoring of air cleanliness. Coverage includes: airborne particulate cleanliness classes and U descriptions; verification and monitoring of airborne particulate cleanliness. Also contains detailed definitions and appendices.
Committee |
FSC 3694
|
DevelopmentNote |
E Notice 1 - Notice of Cancellation/Superseded by ISO 14644-1 and ISO 14644-2 (03/2002)
|
DocumentType |
Standard
|
Pages |
56
|
PublisherName |
US Military Specs/Standards/Handbooks
|
Status |
Superseded
|
SupersededBy |
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MIL-STD-1246 Revision C:1994 | PRODUCT CLEANLINESS LEVELS AND CONTAMINATION CONTROL PROGRAM |
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01/206130 DC : DRAFT AUG 2001 | IEC 62258 - SEMICONDUCTOR DIE PRODUCTS - MINIMUM REQUIREMENTS FOR PROCUREMENT AND USE - PART 1: GENERAL REQUIREMENTS - MECHANICAL, MATERIAL AND CONNECTIVITY |
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ANSI INCITS 213 : 1994 | INFORMATION TECHNOLOGY - 90-MM (3.54-IN) OPTICAL DISK CARTRIDGE REWRITABLE AND READ ONLY USING DISCRETE BLOCK FORMAT (DBF) METHOD FOR DIGITAL INFORMATION INTERCHANGE |
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ASTM F 1394 : 1992 : R2005 | Standard Test Method for Determination of Particle Contribution from Gas Distribution System Valves |
ASTM E 2088 : 2006 | Standard Practice for Selecting, Preparing, Exposing, and Analyzing Witness Surfaces for Measuring Particle Deposition in Cleanrooms and Associated Controlled Environments |
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ASTM F 612 : 1988 | Practice for Cleaning Surfaces of Polished Silicon Slices (Withdrawn 1993) |
ASTM F 584 : 2006 : EDT 1 | Standard Practice for Visual Inspection of Semiconductor Lead-Bonding Wire (Withdrawn 2015) |
ASTM E 2088 : 2006 : R2011 | Standard Practice for Selecting, Preparing, Exposing, and Analyzing Witness Surfaces for Measuring Particle Deposition in Cleanrooms and Associated Controlled Environments |
ASTM F 584 : 2006 | Standard Practice for Visual Inspection of Semiconductor Lead-Bonding Wire |
ASTM F 816 : 1983 : R2003 | Standard Test Method for Combined Fine and Gross Leaks for Large Hybrid Microcircuit Packages (Withdrawn 2009) |
BS EN 13091:2000 | Biotechnology. Performance criteria for filter elements and filtration assemblies |
DIN EN 14736:2004-09 | SPACE PRODUCT ASSURANCE - QUALITY ASSURANCE FOR TEST CENTRES |
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ASTM F 1708 : 2002 | Standard Practice for Evaluation of Granular Polysilicon by Meter-Zoner Spectroscopies (Withdrawn 2003) |
MIL-STD-976 Revision B:1988 | CERTIFICATION REQUIREMENTS FOR JAN MICROCIRCUITS |
ASTM E 2311 : 2004 | Standard Practice for QCM Measurement of Spacecraft Molecular Contamination in Space |
MIL-STD-1695 Base Document:1977 | ENVIRONMENTS, WORKING, MINIMUM STANDARDS FOR |
DOD-STD-347 Base Document:1985 | PRODUCT ASSURANCE PROGRAM REQUIREMENTS FOR FIBER OPTIC COMPONENTS |
MIL-F-48382 Revision A:1985 | FUZE, M934E6, IMPACT SWITCH FOR |
BS PD ES 59008-5.1 : 2001 | DATA REQUIREMENTS FOR SEMICONDUCTOR DIE - PART 5-1: PARTICULAR REQUIREMENTS AND RECOMMENDATIONS FOR DIE TYPES - BARE DIE |
ASTM E 2090 : 2012 : REDLINE | Standard Test Method for Size-Differentiated Counting of Particles and Fibers Released from Cleanroom Wipers Using Optical and Scanning Electron Microscopy |
BS PD ES 59008-4.2 : 2001 | DATA REQUIREMENTS FOR SEMICONDUCTOR DIE - PART 4-2: SPECIFIC REQUIREMENTS AND RECOMMENDATIONS - HANDLING AND STORAGE |
ASTM E 874 : 2011 : REDLINE | PRACTICE FOR ADHESIVE BONDING OF ALUMINUM FACINGS TO NONMETALLIC HONEYCOMB CORE FOR SHELTER PANELS |
ASTM F 816 : 1983 : R1998 : EDT 1 | Standard Test Method for Combined Fine and Gross Leaks for Large Hybrid Microcircuit Packages |
ANSI INCITS 191 : 1991 | INFORMATION SYSTEMS - RECORDED OPTICAL MEDIA UNIT FOR DIGITAL INFORMATION INTERCHANGE - 130 MM WRITE-ONCE SAMPLED-SERVO RZ SELECTABLE-PITCH OPTICAL DISK CARTRIDGE |
ANSI INCITS 246 : 1994 | INFORMATION PROCESSING SYSTEMS - TEST METHODS FOR MEDIA CHARACTERISTICS OF 90 MM READ ONLY AND REWRITABLE M.O. OPTICAL DISK DATA STORAGE CARTRIDGE WITH DISCRETE BLOCK FORMAT (DBF) |
ASTM F 1394 : 1992 : R2012 | Standard Test Method for Determination of Particle Contribution from Gas Distribution System Valves |
ASTM F 1394 : 1992 : R1999 | Standard Test Method for Determination of Particle Contribution from Gas Distribution System Valves |
ASTM E 2352 : 2019 | Standard Practice for Aerospace Cleanrooms and Associated Controlled Environments—Cleanroom Operations |
ASTM E 2042 : 2004 | Standard Practice for Cleaning and Maintaining Controlled Areas and Clean Rooms |
ASTM E 2352 : 2004 | Standard Practice for Aerospace Cleanrooms and Associated Controlled Environments-Cleanroom Operations |
ASTM E 1548 : 2009 : R2017 | Standard Practice for Preparation of Aerospace Contamination Control Plans |
ASTM E 1548 : 2009 | Standard Practice for Preparation of Aerospace Contamination Control Plans |
ASTM E 2042/E2042M : 2009 | Standard Practice for Cleaning and Maintaining Controlled Areas and Clean Rooms |
ASTM A 380 : 2006 | Standard Practice for Cleaning, Descaling, and Passivation of Stainless Steel Parts, Equipment, and Systems |
ASTM F 50 : 2012 : R2015 | Standard Practice for Continuous Sizing and Counting of Airborne Particles in Dust-Controlled Areas and Clean Rooms Using Instruments Capable of Detecting Single Sub-Micrometre and Larger Particles |
ASME B89.6.2 : 1973 : R2017 | TEMPERATURE AND HUMIDITY ENVIRONMENT FOR DIMENSIONAL MEASUREMENT |
ASME B89.6.2 : 1973 : R2003 | TEMPERATURE AND HUMIDITY ENVIRONMENT FOR DIMENSIONAL MEASUREMENT |
ASME B89.6.2 : 1973 : R2012 | TEMPERATURE AND HUMIDITY ENVIRONMENT FOR DIMENSIONAL MEASUREMENT |
MIL-STD-1774 Base Document:1982 | PROCESS FOR CLEANING HYDRAZINE SYSTEMS AND COMPONENTS |
ES 59008-5-2 : 2001 | DATA REQUIREMENTS FOR SEMI-CONDUCTOR DIE - PART 5-2: PARTICULAR REQUIREMENTS AND RECOMMENDATIONS FOR DIE TYPES - BARE DIE WITH ADDED CONNECTION STRUCTURES |
MIL-F-48863 Revision C:1985 | FUZE, GUIDED MISSILE, M934E6 PARTS ASSEMBLY, LOADING & PACKING FOR |
I.S. EN 14736:2004 | SPACE PRODUCT ASSURANCE - QUALITY ASSURANCE FOR TEST CENTRES |
ASTM F 804 : 1983 : R1990 : EDT 1 | Practice for Producing Spin Coating Resist Thickness Curves (Withdrawn 1997) |
MIL V 87223 : 0 | VALVE, PRESSURE, ANTI-G SUIT, MXU-804/A AND MXU-805/A |
MIL-I-81454 Base Document:1967 | INDICATOR, GYROSCOPE, VERTICAL REFERENCE ID-1481 (*)/A |
MIL-STD-1547 Revision B:1992 | ELECTRONIC PARTS, MATERIALS, AND PROCESSES FOR SPACE VEHICLES |
MIL-G-81937 Revision A:1984 | GREASE, INSTRUMENT, ULTRA CLEAN, METRIC |
MIL-HDBK-349 Base Document:1994 | MANUFACTURE AND INSPECTION OF ADHESIVE BONDED, ALUMINUM HONEYCOMB SANDWICH ASSEMBLIES FOR AIRCRAFT |
MIL-STD-1359 Revision B:1987 | CLEANING METHODS AND PROCEDURES FOR BREATHING OXYGEN EQUIPMENT |
MIL-C-85300 Base Document:1982 | COOLER, CRYOGENIC DETECTOR |
MIL R 28750 : C SUPP 1 | RELAYS, SOLID STATE, SEALED, OPTICALLY ISOLATED, ZERO VOLTAGE TURN ON, 25 AMPERES, 250 VOLTS MAXIMUM, 45-440 HZ, POWER SWITCHING |
ASTM F 979 : 1986 : R2003 | Standard Test Method for Hermeticity of Hybrid Microcircuit Packages Prior to Lidding (Withdrawn 2009) |
ES 59008-4-2 : 2000 | DATA REQUIREMENTS FOR SEMICONDUCTOR DIE : SPECIFIC REQUIREMENTS AND RECOMMENDATIONS HANDLING AND STORAGE |
MIL-B-913 Base Document:1993 | BEARINGS, BALL, ANNULAR, FOR INSTRUMENTS AND PRECISION ROTATING COMPONENTS (METRIC) GENERAL SPECIFICATION FOR |
SAE AS 13591 : 2001 | CLEANING METHODS &PROCEDURES FOR BREATHING OXYGEN EQUIPMENT |
PD ES 59008-2:1999 | Data requirements for semiconductor die Vocabulary |
ASTM E 2088 : 2006 : R2015 | Standard Practice for Selecting, Preparing, Exposing, and Analyzing Witness Surfaces for Measuring Particle Deposition in Cleanrooms and Associated Controlled Environments |
ASTM E 1549/E1549M : 2013 : R2016 | Standard Specification for ESD Controlled Garments Required in Cleanrooms and Controlled Environments for Spacecraft for Non-Hazardous and Hazardous Operations |
SAE ARP 599 : 2013 | AEROSPACE - DYNAMIC TEST METHOD FOR DETERMINING THE RELATIVE DEGREE OF CLEANLINESS OF THE DOWNSTREAM SIDE OF FILTER ELEMENTS |
NASA KSC STD Z 0010 : 1983 | DESIGN OF ENVIRONMENTAL CONTROL SYSTEMS, GROUND COOLANT SYSTEMS, COOLANT SERVICING SYSTEMS, AND GROUND SUPPORT EQUIPMENT, STANDARD FOR |
MIL-S-85333 Base Document:1979 | SAFETY ARMING DEVICE MARK 33 MOD 1 |
ASTM F 691 : 1980 : R1991 : EDT 1 | Practice for Preparing Photoplates for Measuring Flatness Deviation (Withdrawn 1996) |
CEI EN 62258-1 : 2011 | SEMICONDUCTOR DIE PRODUCTS - PART 1: PROCUREMENT AND USE |
ASTM F 863 : 1984 : R1992 : EDT 1 | Practice for Detection of Defects in Spin-Coated Resist (Withdrawn 1996) |
ASTM F 864 : 1984 : R1992 | Practice for Inspection of Hardsurface Glass Photoplates (Withdrawn 1996) |
ASTM F 890 : 1984 : R1992 | Practice for Determining Pinhole Density in Photoresist Films Used in Microelectronic Device Processing (Withdrawn 1996) |
MIL B 197 : F INT AMD 2 | BEARINGS, ANTIFRICTION, ASSOCIATED PARTS AND SUBASSEMBLIES, PREPARATION FOR DELIVERY OF |
BS PD ES 59008-5.2 : 2001 | DATA REQUIREMENTS FOR SEMICONDUCTOR DIE - PART 5-2: PARTICULAR REQUIREMENTS AND RECOMMENDATIONS FOR DIE TYPES - BARE DIE WITH ADDED CONNECTION STRUCTURES |
MIL-F-48388 Revision A:1985 | FUZE, M934E6, LAUNCH SENSING SWITCH FOR |
MIL-B-81793 Revision D:1993 | BEARING, BALL, PRECISION, FOR INSTRUMENTS AND ROTATING COMPONENTS |
ASTM F 849 : 1983 : R1988 | Method for Identification and Test of Structures and Contaminants Seen on Polished Gadolinium Gallium Surfaces (Withdrawn 1992) |
MIL V 87255 : 0 | VALVE, PRESSURE, ANTI-G SUIT, HIGH FLOW |
ASTM E 1731M : 1995 | Standard Test Method for Gravimetric Determination of Nonvolatile Residue from Cleanroom Gloves [Metric] (Withdrawn 2000) |
ANSI INCITS 199 : 1991 : R2002 | INFORMATION SYSTEMS - 356 MM OPTICAL DISK CARTRIDGE (WRITE-ONCE) - TEST METHODS FOR MEDIA CHARACTERISTICS |
ANSI INCITS 234 : 1993 | INFORMATION SYSTEMS - TEST METHODS FOR MEDIA CHARACTERISTICS - 130 MM REWRITABLE OPTICAL DISK DATA STORAGE CARTRIDGES WITH CONTINUOUS COMPOSITE SERVO (CCS) |
ASTM E 2042/E2042M : 2009 : R2016 | Standard Practice for Cleaning and Maintaining Controlled Areas and Clean Rooms |
ASTM E 2900 : 2012 | Standard Practice for Spacecraft Hardware Thermal Vacuum Bakeout |
ASTM E 1235 : 2012 : REDLINE | Standard Test Method for Gravimetric Determination of Nonvolatile Residue (NVR) in Environmentally Controlled Areas for Spacecraft |
ASTM E 1235M : 1995 | Test Method for Gravimetric Determination of Nonvolatile Residue (NVR) in Environmentally Controlled Areas for Spacecraft [Metric] (Withdrawn 2000) |
EN 14736:2004 | Space product assurance - Quality assurance for test centres |
MIL-G-23083 Revision C:1972 | Gyroscope, Rate Switching MS 17399 |
ASTM F 416 : 1994 | Test Method for Detection of Oxidation Induced Defects in Polished Silicon Wafers (Withdrawn 1998) |
NASA KSC SO S 9 : 1993 | RETEST AND REFURBISHMENT OF COMPRESSED GAS TRAILERS AND MOVABLE STORAGE UNITS, STANDARD FOR |
DEFSTAN 18-1/2(1990) : 1990 | GUIDELINES AND STANDARDS FOR THE PROCUREMENT OF MILITARY SPACECRAFT SYSTEMS |
MIL R 39023 : A | RESISTOR, VARIABLE, NON WIRE WOUND, PRECISION GENERAL SPECIFICATION FOR |
MIL-STD-977 Base Document:1982 | TEST METHODS AND PROCEDURES FOR MICROCIRCUIT LINE CERTIFICATION |
SAE AIR4728 | References, Spacecraft and Spacecraft Servicing, Fluid System Components (Abbreviations, Acronyms, Definitions, Applicable Documents and Environmental Conditions) |
ES 59008-5-1 : 2001 | DATA REQUIREMENTS FOR SEMI-CONDUCTOR DIE - PARTICULAR REQUIREMENTS AND RECOMMENDATIONS FOR DIE TYPES - BARE DIE |
MIL-STD-2111 Base Document:1979 | TECHNICAL REPAIR STANDARDS, ELECTRONIC (2Z/4G/7Z/7G REPAIRABLES), PREPARATION OF |
ASTM E 1234 : 2012 : REDLINE | Standard Practice for Handling, Transporting, and Installing Nonvolatile Residue (NVR) Sample Plates Used in Environmentally Controlled Areas for Spacecraft |
ASTM F 50 : 2012 | Standard Practice for Continuous Sizing and Counting of Airborne Particles in Dust-Controlled Areas and Clean Rooms Using Instruments Capable of Detecting Single Sub-Micrometre and Larger Particles |
ASTM E 2352 : 2004 : R2010 | Standard Practice for Aerospace Cleanrooms and Associated Controlled Environments-Cleanroom Operations |
IEC 62258-1:2009 | Semiconductor die products - Part 1: Procurement and use |
BS EN 14736:2004 | Space product assurance. Quality assurance for test centres |
FED-STD-376 Revision B:1993 | PREFERRED METRIC UNITS FOR GENERAL USE BY THE FEDERAL GOVERNMENT |
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