IEC 60068-2-66:1994
Current
Current
The latest, up-to-date edition.
Environmental testing - Part 2: Test methods - Test Cx: Damp heat, steady state (unsaturated pressurized vapour)
Available format(s)
Hardcopy , PDF , PDF 3 Users , PDF 5 Users , PDF 9 Users
Language(s)
English - French, Spanish, Castilian
Published date
22-06-1994
Publisher
Important note : Users cannot be edited or removed once added to your Multi user PDF.
Committees responsible
National foreword
Foreword
1. Scope
2. General description
3. Description of test apparatus
4. Severities
5. Initial measurements
6. Testing
7. Intermediate measurements
8. Recovery
9. Final measurements
10. Information to be given in the relevant specification
Annexes
A. Steam table
B. Physical significance of the test
C. Determination of humidity
D. Test apparatus and handling
IEC 60068-2-66:1994 Provides a standard test procedure for the prupose of evaluating, in an accelerated manner, the resistance of small electrotechnical products, primarily non-hermetically sealed components, to the deteriorative effect of damp heat. The test is not intended to evaluate external effects, such as corrosion and deformation.
| DevelopmentNote |
Also numbered as BS EN 60068-2.66. (09/2005) Stability Date: 2019. (10/2012)
|
| DocumentType |
Standard
|
| Pages |
33
|
| PublisherName |
International Electrotechnical Committee
|
| Status |
Current
|
| Standards | Relationship |
| JIS C 0096:2001 | Identical |
| SAC GB/T 2423.40 : 1997 | Identical |
| I.S. EN 60068-2-66:1995 | Identical |
| PN EN 60068-2-66 : 1999 | Identical |
| AS 60068.2.66-2003 | Identical |
| NF EN 60068 2-66 : 1995 | Identical |
| NEN 10068-2-66 : 1994 | Identical |
| UNE-EN 60068-2-66:1997 | Identical |
| SN EN 60068-2-66 : 1994 | Identical |
| DIN EN 60068-2-66:1995-06 | Identical |
| EN 60068-2-66:1994 | Identical |
| CEI EN 60068-2-66 : 1997 | Identical |
| JIS C 60068-2-66:2001 | Identical |
| BS EN 60674-3-8 : 2011 | PLASTIC FILMS FOR ELECTRICAL PURPOSES - PART 3: SPECIFICATIONS FOR INDIVIDUAL MATERIALS - SHEET 8: BALANCED BIAXIALLY ORIENTED POLYETHYLENE NAPHTHALATE (PEN) FILMS USED FOR ELECTRICAL INSULATION (IEC 60674-3-8:2011) |
| 17/30352083 DC : DRAFT JUL 2017 | BS EN 62244 - RADIATION PROTECTION INSTRUMENTATION - INSTALLED RADIATION PORTAL MONITORS (RPMS) FOR THE DETECTION OF ILLICIT TRAFFICKING OF RADIOACTIVE AND NUCLEAR MATERIALS |
| 15/30331587 DC : 0 | BS EN 61189-5-503 - TEST METHODS FOR ELECTRICAL MATERIALS, PRINTED BOARDS AND OTHER INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 5-503: GENERAL TEST METHODS FOR MATERIALS AND ASSEMBLIES - CONDUCTIVE ANODIC FILAMENTS (CAF) TESTING OF CIRCUIT BOARDS |
| I.S. EN 60068-2-69:2017 | ENVIRONMENTAL TESTING - PART 2-69: TESTS - TEST TE/TC: SOLDERABILITY TESTING OF ELECTRONIC COMPONENTS AND PRINTED BOARDS BY THE WETTING BALANCE (FORCE MEASUREMENT) METHOD |
| IEC 61189-5-503:2017 | Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 5-503: General test method for materials and assemblies - Conductive anodic filaments (CAF) testing of circuit boards |
| IEC 60674-3-8:2011+AMD1:2016 CSV | Plastic films for electrical purposes - Part 3: Specifications for individual materials - Sheet 8: Balanced biaxially oriented polyethylene naphthalate (PEN) films used for electrical insulation |
| EN 61010-2-012:2016 | Safety requirements for electrical equipment for measurement, control and laboratory use - Part 2-012: Particular requirements for climatic and environmental testing and other temperature conditioning equipment |
| EN 60068-3-4:2002 | Environmental testing - Part 3-4: Supporting documentation and guidance - Damp heat tests |
| EN 61189-5-503:2017 | Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 5-503: General test method for materials and assemblies - Conductive anodic filaments (CAF) testing of circuit boards |
| EN 62878-1-1:2015 | Device embedded substrate - Part 1-1: Generic specification - Test methods |
| 16/30309512 DC : 0 | BS EN 62327 ED 2.0 - RADIATION PROTECTION INSTRUMENTATION - HAND-HELD INSTRUMENTS FOR THE DETECTION AND IDENTIFICATION OF RADIONUCLIDES AND FOR THE ESTIMATION OF AMBIENT DOSE EQUIVALENT RATE FROM PHOTON RADIATION |
| BS EN 62326-20:2016 | Printed boards Printed circuit boards for high-brightness LEDs |
| BS EN 62878-1-1:2015 | Device embedded substrate Generic specification. Test methods |
| BS EN 60068-3-4:2002 | Environmental testing Supporting documentation and guidance - Damp heat tests |
| BS EN IEC 61189-5-503:2017 | Test methods for electrical materials, printed board and other interconnection structures and assemblies General test method for materials and assemblies. Conductive anodic filaments (CAF) testing of circuit boards |
| CEI EN 60068-3-4 : 2002 | ENVIRONMENTAL TESTING - PART 3-4: SUPPORTING DOCUMENTATION AND GUIDANCE DAMP HEAT TESTS |
| VDE 0468-2-69 : 2018 | ENVIRONMENTAL TESTING - PART 2-69: TESTS - TEST TE/TC: SOLDERABILITY TESTING OF ELECTRONIC COMPONENTS AND PRINTED BOARDS BY THE WETTING BALANCE (FORCE MEASUREMENT) METHOD (IEC 60068-2-69:2017) |
| CEI EN 60674-3-8 : 2012 | PLASTIC FILMS FOR ELECTRICAL PURPOSES - PART 3: SPECIFICATIONS FOR INDIVIDUAL MATERIALS - SHEET 8: BALANCED BIAXIALLY ORIENTED POLYETHYLENE NAPHTHALATE (PEN) FILMS USED FOR ELECTRICAL INSULATION |
| NF EN 60674-3-8 : 2012 AMD 1 2017 | PLASTIC FILMS FOR ELECTRICAL PURPOSES - PART 3: SPECIFICATIONS FOR INDIVIDUAL MATERIALS - SHEET 8: BALANCED BIAXIALLY ORIENTED POLYETHYLENE NAPHTHALATE (PEN) FILMS USED FOR ELECTRICAL INSULATION |
| 13/30279156 DC : 0 | BS EN 6101-2-012 ED.1 - SAFETY REQUIREMENTS FOR ELECTRICAL EQUIPMENT FOR MEASUREMENT, CONTROL, AND LABORATORY USE - PART 2-012: PARTICULAR REQUIREMENTS FOR CLIMATIC AND ENVIRONMENTAL TESTING AND OTHER TEMPERATURE CONDITIONING EQUIPMENT |
| CSA C22.2 No. 61010-2-012 : 2017 | SAFETY REQUIREMENTS FOR ELECTRICAL EQUIPMENT FOR MEASUREMENT, CONTROL AND LABORATORY USE - PART 2-012: PARTICULAR REQUIREMENTS FOR CLIMATIC AND ENVIRONMENTAL TESTING AND OTHER TEMPERATURE CONDITIONING EQUIPMENT |
| IEC 62327:2017 | Radiation protection instrumentation - Hand-held instruments for the detection and identification of radionuclides and for the estimation of ambient dose equivalent rate from photon radiation |
| EN 60068-2-69:2017/AC:2018-03 | ENVIRONMENTAL TESTING - PART 2-69: TESTS - TEST TE/TC: SOLDERABILITY TESTING OF ELECTRONIC COMPONENTS AND PRINTED BOARDS BY THE WETTING BALANCE (FORCE MEASUREMENT) METHOD (IEC 60068-2-69:2017/COR1:2018) |
| IEC TR 62866:2014 | Electrochemical migration in printed wiring boards and assemblies - Mechanisms and testing |
| OVE/ONORM EN 60068-2-20 : 2009 | ENVIRONMENTAL TESTING - PART 2-20: TESTS - TEST T: TEST METHODS FOR SOLDERABILITY AND RESISTANCE TO SOLDERING HEAT OF DEVICES WITH LEADS |
| EN 60068-2-20:2008 | Environmental testing - Part 2-20: Tests - Test T: Test methods for solderability and resistance to soldering heat of devices with leads |
| CEI EN 61189-5-503 : 1ED 2017 | TEST METHODS FOR ELECTRICAL MATERIALS, PRINTED BOARD AND OTHER INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 5-503: GENERAL TEST METHOD FOR MATERIALS AND ASSEMBLIES - CONDUCTIVE ANODIC FILAMENTS (CAF) TESTING OF CIRCUIT BOARDS |
| BS EN 60068-2-20:2008 | Environmental testing Tests. Test T. Test methods for solderability and resistance to soldering heat of devices with leads |
| BS EN 61010-2-012:2016 | Safety requirements for electrical equipment for measurement, control and laboratory use Particular requirements for climatic and environmental testing and other temperature conditioning equipment |
| I.S. EN 61010-2-012:2016 | SAFETY REQUIREMENTS FOR ELECTRICAL EQUIPMENT FOR MEASUREMENT, CONTROL AND LABORATORY USE - PART 2-012: PARTICULAR REQUIREMENTS FOR CLIMATIC AND ENVIRONMENTAL TESTING AND OTHER TEMPERATURE CONDITIONING EQUIPMENT |
| I.S. EN 61189-5-503:2017 | TEST METHODS FOR ELECTRICAL MATERIALS, PRINTED BOARD AND OTHER INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 5-503: GENERAL TEST METHOD FOR MATERIALS AND ASSEMBLIES - CONDUCTIVE ANODIC FILAMENTS (CAF) TESTING OF CIRCUIT BOARDS |
| I.S. EN 60068-2-20:2008 | ENVIRONMENTAL TESTING - PART 2-20: TESTS - TEST T: TEST METHODS FOR SOLDERABILITY AND RESISTANCE TO SOLDERING HEAT OF DEVICES WITH LEADS |
| DIN EN 60068-2-69 : 2007 | ENVIRONMENTAL TESTING - PART 2-69: TESTS - TEST TE/TC: SOLDERABILITY TESTING OF ELECTRONIC COMPONENTS AND PRINTED BOARDS BY THE WETTING BALANCE (FORCE MEASUREMENT) METHOD (IEC 60068-2-69:2017) |
| IEC 60068-2-69:2017 | Environmental testing - Part 2-69: Tests - Test Te/Tc: Solderability testing of electronic components and printed boards by the wetting balance (force measurement) method |
| I.S. EN 62878-1-1:2015 | DEVICE EMBEDDED SUBSTRATE - PART 1-1: GENERIC SPECIFICATION - TEST METHODS |
| PD IEC/TR 62866:2014 | Electrochemical migration in printed wiring boards and assemblies. Mechanisms and testing |
| IEC 61747-1:1998+AMD1:2003 CSV | Liquid crystal and solid-state display devices - Part 1: Generic specification |
| IEC 60068-2-20:2008 | Environmental testing - Part 2-20: Tests - Test T: Test methods for solderability and resistance to soldering heat of devices with leads |
| IEC 60068-3-4:2001 | Environmental testing - Part 3-4: Supporting documentation and guidance - Damp heat tests |
| 13/30264596 DC : 0 | BS EN 60747-14-7 ED 1.0 - SEMICONDUCTOR DEVICES - PART 14-7: SEMICONDUCTOR SENSORS - FLOW METER |
| 13/30264600 DC : 0 | BS EN 60747-14-8 ED 1.0 - SEMICONDUCTOR DEVICES - PART 14-8: SEMICONDUCTOR SENSORS - CAPACITIVE DEGRADATION SENSOR OF LIQUID |
| BS EN 60068-2-69:2017 | Environmental testing Tests. Test Te/Tc. Solderability testing of electronic components and printed boards by the wetting balance (force measurement) method |
| CEI EN 60068-2-69 : 2008 | ENVIRONMENTAL TESTING - PART 2-69: TESTS - TEST TE/TC: SOLDERABILITY TESTING OF ELECTRONIC COMPONENTS AND PRINTED BOARDS BY THE WETTING BALANCE (FORCE MEASUREMENT) METHOD |
| I.S. EN 60068-3-4:2002 | ENVIRONMENTAL TESTING - PART 3-4: SUPPORTING DOCUMENTATION AND GUIDANCE - DAMP HEAT TESTS |
| I.S. EN 62326-20:2016 | PRINTED BOARDS - PART 20: PRINTED CIRCUIT BOARDS FOR HIGHBRIGHTNESS LEDS |
| I.S. EN 60674-3-8:2011 | PLASTIC FILMS FOR ELECTRICAL PURPOSES - PART 3: SPECIFICATIONS FOR INDIVIDUAL MATERIALS - SHEET 8: BALANCED BIAXIALLY ORIENTED POLYETHYLENE NAPHTHALATE (PEN) FILMS USED FOR ELECTRICAL INSULATION |
| CEI EN 60068-2-20 : 2009 | ENVIRONMENTAL TESTING - PART 2-20: TESTS - TEST T: TEST METHODS FOR SOLDERABILITY AND RESISTANCE TO SOLDERING HEAT OF DEVICES WITH LEADS |
| IEC 60300-3-5:2001 | Dependability management - Part 3-5: Application guide - Reliability test conditions and statistical test principles |
| EN 60674-3-8:2011/A1:2017 | PLASTIC FILMS FOR ELECTRICAL PURPOSES - PART 3: SPECIFICATIONS FOR INDIVIDUAL MATERIALS - SHEET 8: BALANCED BIAXIALLY ORIENTED POLYETHYLENE NAPHTHALATE (PEN) FILMS USED FOR ELECTRICAL INSULATION (IEC 60674-3-8:2011/A1:2016) |
| IEC 62326-20:2016 | Printed boards - Part 20: Printed circuit boards for high-brightness LEDs |
| EN 62326-20:2016 | Printed boards - Part 20: Printed circuit boards for high-brightness LEDs |
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