IEC 60115-1:2008
Superseded
A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.
View Superseded by
Fixed resistors for use in electronic equipment - Part 1: Generic specification
Hardcopy , PDF , PDF 3 Users , PDF 5 Users , PDF 9 Users
31-12-2021
English, English - French
21-07-2008
FOREWORD
1 General
1.1 Scope
1.2 Normative references
2 Technical data
2.1 Units and symbols
2.2 Terms and definitions
2.3 Preferred values
2.4 Marking
2.5 Coding
2.6 Packaging
2.7 Storage
2.8 Transportation
3 Quality assessment procedures
4 Test and measurement procedures
4.1 General
4.2 Standard atmospheric conditions
4.3 Drying
4.4 Visual examination and checking of dimensions
4.5 Resistance
4.6 Insulation resistance
4.7 Voltage proof
4.8 Variation of resistance with temperature
4.9 Reactance
4.10 Non-linear properties
4.11 Voltage coefficient
4.12 Noise
4.13 Short time overload
4.14 Temperature rise
4.15 Robustness of the resistor body
4.16 Robustness of terminations
4.17 Solderability
4.18 Resistance to soldering heat
4.19 Rapid change of temperature
4.20 Bump
4.21 Shock
4.22 Vibration
4.23 Climatic sequence
4.24 Damp heat, steady state
4.25 Endurance
4.26 Accidental overload test
4.27 Single-pulse high-voltage overload test
4.28 Periodic-pulse high-voltage overload test
4.29 Component solvent resistance
4.30 Solvent resistance of marking
4.31 Mounting of surface mount resistors
4.32 Shear test
4.33 Substrate bending test
4.34 Corrosion
4.35 Flammability
4.36 Operation at low temperature
4.37 Damp heat, steady state, accelerated
4.38 Electrostatic discharge
4.39 Periodic-pulse overload test
4.40 Whisker growth test
4.41 Hydrogen sulphide test
Annex A (normative) Interpretation of sampling plans
and procedures as described in IEC 60410 for
use within the IECQ system
Annex B (normative) Rules for the preparation of detail
specifications for resistors and capacitors for
electronic equipment for use within the
IECQ system
Annex C (informative) Example of test equipment for the
periodic-pulse high-voltage overload test
Annex D (normative) Layout of the first page of a PCP/CQC
specification
Annex E (normative) Requirements for capability approval
test report
Annex F (informative) Letter symbols and abbreviations
Annex G (informative) Index table for test and measurement
procedures
Annex Q (normative) Quality assessment procedures
IEC 60115-1:2008 is a generic specification and is applicable to fixed resistors for use in electronic equipment. It establishes standard terms, inspection procedures and methods of test for use in sectional and detail specifications of electronic components for quality assessment or any other purpose.This standard cancels and replaces IEC 61045-1 (1991), IEC 61045-2 (1991) and IEC 61045-2-1 (1991). This edition contains the following significant technical changes with respect to the previous edition:a) implementation of Annex Q which replaces Clause 3;b) addition of new tests procedures in 4.34 through 4.38; c) removal of the property "temperature characteristics" from 4.8; d) introduction of a new system of test severities for the shear test in 4.32; e) introduction of new bias voltages for the damp heat steady-state test in 4.24;f) furthermore, this fourth edition cancels and replaces the third edition published in 1999 and constitutes minor revisions related to tables, figures and references.
Committee |
TC 40
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DevelopmentNote |
Supersedes IEC 61045-1, IEC 61045-2 and IEC 61045-2-1. (10/2009) A Bilingual edition has been published on 30/07/2013. (07/2013) Stability Date: 2018. (09/2017)
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DocumentType |
Standard
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Pages |
76
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PublisherName |
International Electrotechnical Committee
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Status |
Superseded
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SupersededBy | |
Supersedes |
Standards | Relationship |
DS EN 60115-1 : 2011 AMD 11 2015 | Identical |
DIN EN 60115-1:2016-03 | Identical |
IS 5786 : Part 1 : 2018 | Identical |
NF EN 60115-1 : 2015 AMD 11 2015 | Identical |
SN EN 60115-1 : 2011 | Identical |
NEN 10115-1 : 1987 | Identical |
I.S. EN 60115-1:2011 | Identical |
UNE 20545-1:1985 | Identical |
UNE-EN 60115-1:2011 | Identical |
DIN IEC 60115-1:1987-04 | Identical |
BS 9940-0:1983 | Identical |
NBN C 83 200 : 1984 | Identical |
SAC GB/T 5729 : 1994 | Identical |
13/30283837 DC : 0 | BS EN 62812 - METHOD OF MEASUREMENT OF LOW RESISTANCE |
14/30311384 DC : 0 | BS EN 60115-2:2014+A1 - FIXED RESISTORS FOR USE IN ELECTRONIC EQUIPMENT - PART 2: SECTIONAL SPECIFICATION: LEADED FIXED LOW POWER FILM RESISTORS |
I.S. EN 61188-5-2:2003 | PRINTED BOARDS AND PRINTED BOARD ASSEMBLIES - DESIGN AND USE - PART 5-2: ATTACHMENT (LAND/JOINT) CONSIDERATIONS - DISCRETE COMPONENTS |
06/30155911 DC : DRAFT SEP 2006 | BS EN 140401-801 - DETAIL SPECIFICATION - FIXED LOW POWER FILM SMD RESISTORS - RECTANGULAR - STABILITY CLASSES 0,1; 0,25; 0,5; 1 |
BS EN 140101:2008 | Blank Detail Specification. Fixed low power film resistors |
IEC 60115-5-1:1983 | Fixed resistors for use in electronic equipment. Part 5: Blank detail specification: Fixed precision resistors. Assessment level E |
I.S. EN 140402:2015 | BLANK DETAIL SPECIFICATION: FIXED LOW POWER WIREWOUND SURFACE MOUNT (SMD) RESISTORS |
I.S. EN 140402-801:2015 | DETAIL SPECIFICATION: FIXED LOW POWER WIREWOUND SURFACE MOUNT (SMD) RESISTORS - RECTANGULAR - STABILITY CLASSES 0,5; 1; 2 |
NF EN 60115-2 : 2015 | FIXED RESISTORS FOR USE IN ELECTRONIC EQUIPMENT - PART 2: SECTIONAL SPECIFICATION: LEADED FIXED LOW POWER FILM RESISTORS |
EN 140402-801:2015 | Detail specification: Fixed low power wirewound surface mount (SMD) resistors - Rectangular - Stability classes 0,5; 1; 2 |
EN 60127-4:2005/A2:2013 | Miniature fuses - Part 4: Universal modular fuse-links (UMF) - Through-hole and surface mount types |
EN 140101:2008 | Blank Detail Specification: Fixed low power film resistors |
EN 60115-2:2015 | Fixed resistors for use in electronic equipment - Part 2: Sectional specification: Leaded fixed low power film resistors |
EN 60115-9-1:2004 | Fixed resistors for use in electronic equipment - Part 9-1: Blank detail specification - Fixed surface mount resistor networks with individually measurable resistors - Assessment level EZ |
EN 61188-5-2:2003 | Printed boards and printed board assemblies - Design and use - Part 5-2: Attachment (land/joint) considerations - Discrete components |
EN 140401:2009 | Blank Detail Specification: Fixed low power film surface mount (SMD) resistors |
EN 140402:2015/A1:2016 | BLANK DETAIL SPECIFICATION: FIXED LOW POWER WIREWOUND SURFACE MOUNT (SMD) RESISTORS |
BS EN 60115-9-1:2004 | Fixed resistors for use in electronic equipment Blank detail specification. Fixed surface mount resistor networks with individually measurable resistors - Assessment level EZ |
07/30161526 DC : 0 | BS EN 60115-8 - FIXED RESISTORS FOR USE IN ELECTRONIC EQUIPMENT - PART 8: SECTIONAL SPECIFICATION - FIXED SURFACE MOUNT RESISTORS |
09/30207307 DC : 0 | BS EN 60115-2 - FIXED RESISTORS FOR USE IN ELECTRONIC EQUIPMENT - PART 2: SECTIONAL SPECIFICATION: FIXED LOW-POWER NON-WIREWOUND RESISTORS |
IEC 60115-7-1:1984 | Fixed resistors for use in electronic equipment. Part 7: Blank detail specifications: Fixed resistors networks in which not all resistors are individually measurable. Assessment level E |
I.S. EN 60115-8:2012 | FIXED RESISTORS FOR USE IN ELECTRONIC EQUIPMENT - PART 8: SECTIONAL SPECIFICATION - FIXED SURFACE MOUNT RESISTORS (IEC 60115-8:2009 (MOD)) |
I.S. EN 60115-8-1:2015 | FIXED RESISTORS FOR USE IN ELECTRONIC EQUIPMENT - PART 8-1: BLANK DETAIL SPECIFICATION: FIXED SURFACE MOUNT (SMD) LOW POWER FILM RESISTORS FOR GENERAL ELECTRONIC EQUIPMENT, CLASSIFICATION LEVEL G |
BS EN 60127-4 : 2005 | MINIATURE FUSES - PART 4: UNIVERSAL MODULAR FUSE-LINKS (UMF) - THROUGH-HOLE AND SURFACE MOUNT TYPES |
I.S. EN 140401:2009 | BLANK DETAIL SPECIFICATION: FIXED LOW POWER FILM SURFACE MOUNT (SMD) RESISTORS |
IEC 61045-2:1991 | Fixed film resistor networks for use in electronic equipment - Part 2: Sectional specification for film resistor networks of assessed quality on the basis of the capability approval procedure |
IEC 60115-8-1:2014 | Fixed resistors for use in electronic equipment - Part 8-1: Blank detail specification: Fixed surface mount (SMD) low power film resistors for general electronic equipment, classification level G |
I.S. EN 140100:2008 | SECTIONAL SPECIFICATION: FIXED LOW POWER FILM RESISTORS |
I.S. EN 60115-9:2004 | FIXED RESISTORS FOR USE IN ELECTRONIC EQUIPMENT - PART 9: SECTIONAL SPECIFICATION - FIXED SURFACE MOUNT RESISTOR NETWORKS WITH INDIVIDUALLY MEASURABLE RESISTORS |
BS CECC 41000:1977 | Harmonized system of quality assessment for electronic components: generic specification for potentiometers |
BS EN 60115-2:2015 | Fixed resistors for use in electronic equipment Sectional specification: Leaded fixed low power film resistors |
CEI EN 60115-8-1 : 2016 | FIXED RESISTORS FOR USE IN ELECTRONIC EQUIPMENT - PART 8-1: BLANK DETAIL SPECIFICATION: FIXED SURFACE MOUNT (SMD) LOW POWER FILM RESISTORS FOR GENERAL ELECTRONIC EQUIPMENT, CLASSIFICATION LEVEL G |
14/30312344 DC : 0 | PD IEC/PAS 60127-8 - MINIATURE FUSES - PART 8: FUSE RESISTORS WITH PARTICULAR OVERCURRENT PROTECTION |
NF EN 60115-8-1 : 2016 | FIXED RESISTORS FOR USE IN ELECTRONIC EQUIPMENT - PART 8-1: BLANK DETAIL SPECIFICATION: FIXED SURFACE MOUNT (SMD) LOW POWER FILM RESISTORS FOR GENERAL ELECTRONIC EQUIPMENT, CLASSIFICATION LEVEL G |
BS EN 140401-801 : 2007 | DETAIL SPECIFICATION: FIXED LOW POWER FILM SMD RESISTORS - RECTANGULAR - STABILITY CLASSES 0,1; 0,25; 0,5; 1 |
BS EN 140401-803 : 2007 | DETAIL SPECIFICATION: FIXED LOW POWER FILM SMD RESISTORS - CYLINDRICAL - STABILITY CLASSES 0,05; 0,1; 0,25; 0,5; 1; 2 |
PD IEC/TR 63091:2017 | Study for the derating curve of surface mount fixed resistors. Derating curves based on terminal part temperature |
IEC TR 63091:2017 | Study for the derating curve of surface mount fixed resistors - Derating curves based on terminal part temperature |
06/30155922 DC : 0 | BS EN 140100 - SECTIONAL SPECIFICATION - FIXED LOW POWER FILM RESISTORS |
16/30338234 DC : 0 | BS EN 60127-8 - MINIATURE FUSES - PART 8: FUSE RESISTORS WITH PARTICULAR OVERCURRENT PROTECTION |
06/30155905 DC : DRAFT SEP 2006 | BS EN 140401-803 - DETAIL SPECIFICATION - FIXED LOW POWER FILM SMD RESISTORS - CYLINDRICAL - STABILITY CLASSES 0,05; 0,1; 0,25; 0,5; 1; 2 |
14/30317306 DC : 0 | BS EN 60115-8-1:2014+A1 - FIXED RESISTORS FOR USE IN ELECTRONIC EQUIPMENT - PART 8-1: BLANK DETAIL SPECIFICATION: FIXED SURFACE MOUNT (SMD) LOW POWER FILM RESISTORS FOR GENERAL ELECTRONIC EQUIPMENT, CLASSIFICATION LEVEL G |
BS EN 140402 : 2015 | BLANK DETAIL SPECIFICATION: FIXED LOW POWER WIREWOUND SURFACE MOUNT (SMD) RESISTORS |
I.S. EN 140401-804:2011 | DETAIL SPECIFICATION: FIXED LOW POWER FILM HIGH STABILITY SMD RESISTORS - RECTANGULAR - STABILITY CLASSES 0,1; 0,25 |
I.S. EN 140101-806:2009 | DETAIL SPECIFICATION: FIXED LOW POWER FILM RESISTORS - METAL FILM RESISTORS ON HIGH GRADE CERAMIC, CONFORMAL COATED OR MOLDED, AXIAL OR PREFORMED LEADS |
BS EN 140401:2009 | Blank Detail Specification. Fixed low power film surface mount (SMD) resistors |
BS EN 140401-804 : 2011 | DETAIL SPECIFICATION: FIXED LOW POWER FILM HIGH STABILITY SMD RESISTORS - RECTANGULAR - STABILITY CLASSES 0,1; 0,25 |
NF EN 140402-801 : 2005 | DETAIL SPECIFICATION: FIXED LOW POWER WIRE-WOUND SURFACE MOUNT (SMD) RESISTORS - RECTANGULAR - STABILITY CLASSES 0,5, 1, 2 |
IEC 60115-8:2009 | Fixed resistors for use in electronic equipment - Part 8: Sectional specification - Fixed surface mount resistors |
IEC 60115-6-2:1983 | Fixed resistors for use in electronic equipment. Part 6: Blank detail specification: Fixed resistor networks with individually measurable resistors, of either resistance values or rated dissipations. Assessment level E |
IEC 60115-6-101:1992 | Fixed resistors for use in electronic equipment - Part 6: Detail specification: Fixed thick film resistor networks with individually measurable resistors, all of equal value and equal dissipation, class 1 (dual-in-line network) |
IEC 60127-4:2005+AMD1:2008+AMD2:2012 CSV | Miniature fuses - Part 4: Universal modular fuse-links (UMF) -Through-hole and surface mount types |
EN 140401-804:2011/A1:2013 | DETAIL SPECIFICATION: FIXED LOW POWER FILM HIGH STABILITY SMD RESISTORS - RECTANGULAR - STABILITY CLASSES 0,1; 0,25 |
BS EN 140100:2008 | Sectional specification. Fixed low power film resistors |
NF EN 60115-8 : 2013 | FIXED RESISTORS FOR USE IN ELECTRONIC EQUIPMENT - PART 8: SECTIONAL SPECIFICATION - FIXED SURFACE MOUNT RESISTORS |
10/30237986 DC : 0 | BS EN 140401-804 - DETAIL SPECIFICATION: FIXED LOW POWER FILM HIGH STABILITY SMD RESISTORS - RECTANGULAR - STABILITY CLASSES 0,1; 0,25 |
08/30186808 DC : DRAFT JULY 2008 | BS EN 140401 - BLANK DETAIL SPECIFICATION - FIXED LOW POWER NON-WIRE-WOUND SURFACE MOUNT (SMD) RESISTORS |
BS EN 140401-802 : 2007 | DETAIL SPECIFICATION: FIXED LOW POWER FILM SMD RESISTORS - RECTANGULAR - STABILITY CLASSES 1; 2 |
BS PD ISO/IEC PAS 60127-8 : 2014 | MINIATURE FUSES - PART 8: FUSE RESISTORS WITH PARTICULAR OVERCURRENT PROTECTION |
BS EN 60115-8-1:2015 | Fixed resistors for use in electronic equipment Blank detail specification: Fixed surface mount (SMD) low power film resistors for general electronic equipment, classification level G |
09/30209389 DC : 0 | BS EN 60115-8-1 - FIXED RESISTORS FOR USE IN ELECTRONIC EQUIPMENT - PART 8-1: BLANK DETAIL SPECIFICATION - FIXED CHIP RESISTORS - ASSESSMENT LEVEL E |
IEC 60115-7:1984 | Fixed resistors for use in electronic equipment. Part 7: Sectional specification: Fixed resistor networks in which not all resistors are individually measurable |
CEI EN 60115-9 : 2005 | FIXED RESISTORS FOR USE IN ELECTRONIC EQUIPMENT - PART 9: SECTIONAL SPECIFICATION - FIXED SURFACE MOUNT RESISTOR NETWORKS WITH INDIVIDUALLY MEASURABLE RESISTORS |
EN 140401-802:2007/A3:2017 | DETAIL SPECIFICATION: FIXED LOW POWER FILM SMD RESISTORS - RECTANGULAR - STABILITY CLASSES 1; 2 |
I.S. EN 140101:2008 | BLANK DETAIL SPECIFICATION: FIXED LOW POWER FILM RESISTORS |
I.S. EN 140401-802:2007 | DETAIL SPECIFICATION: FIXED LOW POWER FILM SMD RESISTORS - RECTANGULAR - STABILITY CLASSES 1; 2 |
I.S. EN 140401-803:2007 | DETAIL SPECIFICATION: FIXED LOW POWER FILM SMD RESISTORS - CYLINDRICAL - STABILITY CLASSES 0,05; 0,1; 0,25; 0,5; 1; 2 |
IEC 60115-6-1:1983 | Fixed resistors for use in electronic equipment. Part 6: Blank detail specification: Fixed resistor networks with individually measurable resistors, all of equal value and equal dissipation. Assessment level E |
IEC 60115-5-2:1992 | Fixed resistors for use in electronic equipment - Part 5: Blank detail specification: Fixed precision resistors - Assessment level F |
IEC 60115-2:2014 | Fixed resistors for use in electronic equipment - Part 2: Sectional specification: Leaded fixed low power film resistors |
IEC 60115-9-1:2003 | Fixed resistors for use in electronic equipment - Part 9-1: Blank detail specification: Fixed surface mount resistor networks with individually measurable resistors - Assessment level EZ |
BS EN 140402-801:2015 | Detail specification: Fixed low power wirewound surface mount (SMD) resistors. Rectangular. Stability classes 0,5; 1; 2 |
IEC 61188-5-2:2003 | Printed boards and printed board assemblies - Design and use - Part 5-2: Attachment (land/joint) considerations - Discrete components |
CEI EN 60115-2 : 2016 | FIXED RESISTORS FOR USE IN ELECTRONIC EQUIPMENT - PART 2: SECTIONAL SPECIFICATION: LEADED FIXED LOW POWER FILM RESISTORS |
CEI EN 140401 : 2009 | BLANK DETAIL SPECIFICATION: FIXED LOW POWER FILM SURFACE MOUNT (SMD) RESISTORS |
BS EN 60115-8:2012 | Fixed resistors for use in electronic equipment Sectional specification. Fixed surface mount resistors |
CEI EN 60115-8 : 2013 | FIXED RESISTORS FOR USE IN ELECTRONIC EQUIPMENT - PART 8: SECTIONAL SPECIFICATION - FIXED SURFACE MOUNT RESISTORS |
BS EN 60115-9:2004 | Fixed resistors for use in electronic equipment Sectional specification. Fixed surface mount resistor networks with individually measurable resistors |
I.S. EN 60115-2:2015 | FIXED RESISTORS FOR USE IN ELECTRONIC EQUIPMENT - PART 2: SECTIONAL SPECIFICATION: LEADED FIXED LOW POWER FILM RESISTORS |
IEC 60115-5:1982 | Fixed resistors for use in electronic equipment - Part 5: Sectional specification: Fixed precision resistors |
05/30129971 DC : DRAFT FEB 2005 | EN 140402-801 - DETAIL SPECIFICATION - FIXED LOW POWER WIRE-WOUND SURFACE MOUNT (SMD) RESISTORS - RECTANGULAR - STABILITY CLASSES 0,5; 1; 2 |
CEI EN 60115-9-1 : 2005 | FIXED RESISTORS FOR USE IN ELECTRONIC EQUIPMENT - PART 9-1: BLANK DETAIL SPECIFICATION - FIXED SURFACE MOUNT RESISTOR NETWORKS WITH INDIVIDUALLY MEASURABLE RESISTORS - ASSESSMENT LEVEL EZ |
IEC 60115-5-101:1995 | Fixed resistors for use in electronic equipment - Part 5: Detail specification: Fixed precision wirewound resistors with solderable axial wire leads - Stability class 0,1% - Assessment level E |
NF EN 140401-802 : 2008 AMD 3 2017 | DETAIL SPECIFICATION: FIXED LOW POWER FILM SMD RESISTORS - RECTANGULAR - STABILITY CLASSES 1, 2 |
I.S. EN 60127-4:2005 | MINIATURE FUSES - PART 4: UNIVERSAL MODULAR FUSE-LINKS (UMF) - THROUGH-HOLE AND SURFACE MOUNT TYPES (IEC 60127-4:2005 (EQV)) |
BS EN 140101-806 : 2008 | DETAIL SPECIFICATION: FIXED LOW POWER FILM RESISTORS - METAL FILM RESISTORS ON HIGH GRADE CERAMIC, CONFORMAL COATED OR MOLDED, AXIAL OR PREFORMED LEADS |
I.S. EN 60115-9-1:2004 | FIXED RESISTORS FOR USE IN ELECTRONIC EQUIPMENT - PART 9-1: BLANK DETAIL SPECIFICATION - FIXED SURFACE MOUNT RESISTOR NETWORKS WITH INDIVIDUALLY MEASURABLE RESISTORS - ASSESSMENT LEVEL EZ |
I.S. EN 140401-801:2007 | DETAIL SPECIFICATION: FIXED LOW POWER FILM SMD RESISTORS - RECTANGULAR - STABILITY CLASSES 0,1; 0,25; 0,5; 1 |
IEC 60115-6-102:1992 | Fixed resistors for use in electronic equipment - Part 6: Detail specification: Fixed thick film resistor networks with individually measurable resistors, all of equal value and equal dissipation, class 1 (single-in-line network) |
EN 140401-803 : 2007 AMD 3 2017 | DETAIL SPECIFICATION: FIXED LOW POWER FILM SMD RESISTORS - CYLINDRICAL - STABILITY CLASSES 0,05; 0,1; 0,25; 0,5; 1; 2 |
EN 140101-806 : 2008 COR 2014 | DETAIL SPECIFICATION: FIXED LOW POWER FILM RESISTORS - METAL FILM RESISTORS ON HIGH GRADE CERAMIC, CONFORMAL COATED OR MOLDED, AXIAL OR PREFORMED LEADS |
EN 140401-801:2007/A1:2013 | DETAIL SPECIFICATION: FIXED LOW POWER FILM SMD RESISTORS - RECTANGULAR - STABILITY CLASSES 0,1; 0,25; 0,5; 1 |
IEC 60115-9:2003 | Fixed resistors for use in electronic equipment - Part 9: Sectional specification: Fixed surface mount resistor networks with individually measurable resistors |
BS EN 61188-5-2:2003 | Printed boards and assemblies. Design and use. Attachment (land/joint) considerations Discrete components |
EN 60115-9:2004 | Fixed resistors for use in electronic equipment - Part 9: Sectional specification - Fixed surface mount resistor networks with individually measurable resistors |
EN 60115-8:2012 | Fixed resistors for use in electronic equipment - Part 8: Sectional specification - Fixed surface mount resistors |
EN 60115-8-1:2015 | Fixed resistors for use in electronic equipment - Part 8-1: Blank detail specification: Fixed surface mount (SMD) low power film resistors for general electronic equipment, classification level G |
EN 140100:2008 | Sectional Specification: Fixed low power film resistors |
BS CECC 40000:1980 | Harmonized system of quality assessment for electronic components. Generic specification: fixed resistors |
IEC 61193-2:2007 | Quality assessment systems - Part 2: Selection and use of sampling plans for inspection of electronic components and packages |
IEC 60068-1:2013 | Environmental testing - Part 1: General and guidance |
IEC 60068-2-58:2015+AMD1:2017 CSV | Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD) |
IEC 60068-2-27:2008 | Environmental testing - Part 2-27: Tests - Test Ea and guidance: Shock |
IEC 60068-2-20:2008 | Environmental testing - Part 2-20: Tests - Test T: Test methods for solderability and resistance to soldering heat of devices with leads |
IECQ 001002-3:2005 | IEC QUALITY ASSESSMENT SYSTEM FOR ELECTRONIC COMPONENTS (IECQ) - RULES OF PROCEDURE - PART 3: APPROVAL PROCEDURES |
IEC 61249-2-7:2002 | Materials for printed boards and other interconnecting structures - Part 2-7: Reinforced base materials clad and unclad - Epoxide woven E-glass laminated sheet of defined flammability (vertical burning test), copper-clad |
IEC 60068-2-21:2006 | Environmental testing - Part 2-21: Tests - Test U: Robustness of terminations and integral mounting devices |
IEC 60068-2-13:1983 | Basic environmental testing procedures - Part 2-13: Tests - Test M: Low air pressure |
IEC 60068-2-11:1981 | Basic environmental testing procedures - Part 2-11: Tests - Test Ka: Salt mist |
IEC 61760-1:2006 | Surface mounting technology - Part 1: Standard method for the specification of surface mounting components (SMDs) |
IEC 60068-2-67:1995 | Environmental testing - Part 2-67: Tests - Test Cy: Damp heat, steady state, accelerated test primarily intended for components |
IEC 60410:1973 | Sampling plans and procedures for inspection by attributes |
IEC 60294:2012 | Measurement of the dimensions of a cylindrical component with axial terminations |
IEC 60068-2-54:2006 | Environmental testing - Part 2-54: Tests - Test Ta: Solderability testing of electronic components by the wetting balance method |
IEC 60068-2-2:2007 | Environmental testing - Part 2-2: Tests - Test B: Dry heat |
IEC TR 60440:1973 | Method of measurement of non-linearity in resistors |
IEC 60062:2016 | Marking codes for resistors and capacitors |
IEC 61249-2-35:2008 | Materials for printed boards and other interconnecting structures - Part 2-35: Reinforced base materials, clad and unclad - Modified epoxide woven E-glass laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly |
IEC 61340-3-1:2006 | Electrostatics - Part 3-1: Methods for simulation of electrostatic effects - Human body model (HBM) electrostatic discharge test waveforms |
IEC 60063:2015 | Preferred number series for resistors and capacitors |
IEC 60068-2-29:1987 | Environmental testing. Part 2: Tests. Test Eb and guidance: Bump |
IEC 60068-2-1:2007 | Environmental testing - Part 2-1: Tests - Test A: Cold |
IEC 61249-2-22:2005 | Materials for printed boards and other interconnecting structures - Part 2-22: Reinforced base materials clad and unclad - Modified non-halogenated epoxide woven E-glass laminated sheets of defined flammability (vertical burning test), copper-clad |
IEC 60060-1:2010 | High-voltage test techniques - Part 1: General definitions and test requirements |
IEC 60695-11-5:2016 | Fire hazard testing - Part 11-5: Test flames - Needle-flame test method - Apparatus, confirmatory test arrangement and guidance |
IEC 60068-2-14:2009 | Environmental testing - Part 2-14: Tests - Test N: Change of temperature |
IEC 60195:2016 | Method of measurement of current noise generated in fixed resistors |
IEC 60068-2-30:2005 | Environmental testing - Part 2-30: Tests - Test Db: Damp heat, cyclic (12 h + 12 h cycle) |
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