IEC 60747-10:1991

Foreword
      Preface
1 Scope
2 General
      2.1 Order of precedence
      2.2 Related documents
      2.3 Units, symbols and terminology
      2.4 Preferred values of voltages, currents and
             temperatures
      2.5 Marking
             2.5.1 Terminal identification
             2.5.2 Type designation
             2.5.3 Manufacturer's name or trade mark
             2.5.4 Inspection lot identification code
      2.6 Categories of assessed quality
      2.7 Screening
      2.8 Handling
3 Quality Assessment Procedures
      3.1 Eligibility for qualification approval
             3.1.1 Primary stage of manufacture
      3.2 Commercially confidential information
      3.3 Formation of inspection lots
      3.4 Structurally similar devices
      3.5 Granting of qualification approval
      3.6 Quality conformance inspectionance testing
             3.6.1 Division into groups and sub-groups
             3.6.2 Inspection requirements
             3.6.3 Supplementary procedure for reduced
                      inspection
             3.6.4 Sampling requirements for small lots
             3.6.5 Certified Records of Released Lots
                      (CRRL)
             3.6.6 Delivery of devices subjected to
                      destructive or non-destructive tests
             3.6.7 Delayed deliveries
             3.6.8 Supplementary procedure for deliveries
      3.7 Statistical sampling procedures
             3.7.1 AQL (Acceptable Quality Level) sampling
                      plans
             3.7.2 Lot Tolerance Per Cent Defective (LTPD)
                      sampling plans
             3.7.3 Correlation between AQL and LTPD
                      sampling plans
      3.8 Endurance tests where LTPD is specified
      3.9 Endurance tests where the failure rate is
             specified
             3.9.1 General
             3.9.2 Selection of samples
             3.9.3 Failures
             3.9.4 Endurance test time and sample size
             3.9.5 Procedure to be used if the number of
                      observed failures exceeds the acceptance
                      number
      3.10 Accelerated test procedures
             3.10.1 Requirements for eligibility in periodic
                      testing
             3.10.2 Procedure for thermally-accelerated
                      electrical endurance testing
             3.10.3 Damp heat (under consideration)
             3.10.4 Voltage (under consideration)
      3.11 Capability approval
             3.11.1 General
             3.11.2 Terms and definitions
             3.11.3 Procedure for granting capability
                      approval
             3.11.4 Capability approval maintenance
                      procedure
             3.11.5 Procedure for reduction, extension or
                      change of capability approval
             3.11.6 Procedure in case of deficiency in
                      maintenance of the capability approval
             3.11.7 Capability manual
             3.11.8 Capability test programme
             3.11.9 Verification of capability approval
                      (quality audit)
             3.11.10 Quality assurance of products delivered
                      under capability approval
             3.11.11 Marking and ordering information
             3.11.12 Capability abstract for publication
                      purposes
             3.11.13 Detail specifications for custom
                      components
             3.11.14 Detail specifications for catalogue
                      products
             3.11.15 Detail specification register
4 Test and measurement procedures
      4.1 Standard atmospheric conditions for electrical
             and optical measurements
      4.2 Physical examination
             4.2.1 Visual examination
             4.2.2 Dimensions
             4.2.3 Permanence of marking
      4.3 Electrical and optical measurements
             4.3.1 General conditions and precautions
      4.4 Environmental tests
Appendix A - Lot Tolerance Per Cent Defective (LTPD)
             Table A-I - LTPD sampling plans
             Table A-II - Hypergeometric sampling plans for
                          small lot sizes of 200 or less
             Table A-III - AQL and LTPD sampling plans
Appendix B - Dimensions to be checked
Appendix C - Directions for applied forces for mechanical
             tests

It is a generic specification for semiconductor devices, discretedevices and integrated circuits, including multichip integratedcircuits, but excluding hybrid circuits.It defines general procedures for quality assessment to be used inthe IECQ System and gives general rules for measuring methods ofelectrical characteristics, climatic and mechanical tests, andendurance tests.