IEC 61967-1:2002
Superseded
A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.
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Integrated circuits - Measurement of electromagnetic emissions, 150 kHz to 1 GHz - Part 1: General conditions and definitions
Hardcopy , PDF , PDF 3 Users , PDF 5 Users , PDF 9 Users
12-09-2022
English - French
12-03-2002
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FOREWORD
1 Scope
2 Normative references
3 Definitions
4 Test conditions
4.1 General
4.2 Ambient conditions
4.2.1 Ambient temperature
4.2.2 Ambient RF field strength
4.2.3 Other ambient conditions
4.2.4 IC stability over time
5 Test equipment
5.1 General
5.2 Shielding
5.3 RF measuring instrument
5.3.1 Measuring receiver
5.3.2 Spectrum analyzer
5.3.3 Other RBW for narrowband disturbances
5.3.4 Disturbance type, detector type and sweep
speed
5.3.5 Video bandwidth
5.3.6 Verification of calibration for the RF
measuring instrument
5.4 Frequency range
5.5 Pre-amplifier or attenuator
5.6 System gain
5.7 Other components
6 Test set-up
6.1 General
6.2 Test circuit board
6.3 IC pin loading
6.4 Power supply requirements - Test board power supply
6.5 IC specific considerations
6.5.1 IC supply voltage
6.5.2 IC decoupling
6.5.3 Activity of IC
6.5.4 Guidelines regarding IC operation
7 Test procedure
7.1 Ambient check
7.2 Operational check
7.3 Specific procedures
8 Test report
8.1 General
8.2 Ambient
8.3 Description of device
8.4 Description of set-up
8.5 Description of software
8.6 Data presentation
8.6.1 Graphical presentation
8.6.2 Software for data capture
8.6.3 Data processing
8.7 RF emission limits
8.8 Interpretation of results
8.8.1 Comparison between IC(s) using the same
test method
8.8.2 Comparison between different test methods
8.8.3 Correlation to module test methods
9 General basic test board specification
9.1 Board description - mechanical
9.2 Board description - electrical characteristics
9.3 Ground planes
9.4 Pins
9.4.1 DIL packages
9.4.2 SOP, PLCC, QFP packages
9.4.3 PGA, BGA packages
9.5 Via type
9.6 Via distance
9.7 Additional components
9.7.1 Supply decoupling
9.7.2 I/O load
Annex A (informative) Test method comparison
Annex B (informative) Flow chart of an example counter
test code
Annex C (informative) Prescription of a worst-case
application software description
Bibliography
Figures
Provides general information and definitions on measurement of conducted and radiated electromagnetic disturbances from integrated circuits. Also provides a description of measurement conditions, test equipment and set-up as well as the test procedures and content of the test reports. A test method comparison table is included to assist in selecting the appropriate measurement method(s). Measurement of the voltage and current of conducted RF emissions or radiated RF disturbances, coming from an integrated circuit under controlled conditions, yields information about the potential for RF disturbances in an application of the integrated circuit.
| Committee |
TC 47/SC 47A
|
| DevelopmentNote |
Also numbered as BS EN 61967-1 (07/2002) Stability Date: 2017. (10/2012)
|
| DocumentType |
Standard
|
| Pages |
47
|
| PublisherName |
International Electrotechnical Committee
|
| Status |
Superseded
|
| SupersededBy |
| Standards | Relationship |
| DIN EN 61967-1:2003-01 | Identical |
| NEN EN IEC 61967-1 : 2002 | Identical |
| I.S. EN 61967-1:2002 | Identical |
| CEI EN IEC 61967-1:2019 | Identical |
| UNE-EN 61967-1:2002 | Identical |
| CEI EN 61967-1 : 2002 | Identical |
| EN 61967-1:2002 | Identical |
| NF EN 61967-1 : 2002 | Identical |
| BS EN 61967-8:2011 | Integrated circuits. Measurement of electromagnetic emissions Measurement of radiated emissions. IC stripline method |
| PD IEC/TR 61967-4-1:2005 | Integrated circuits. Measurement of electromagnetic emissions, 150 kHz to 1 GHz Measurement of conducted emissions. 1 Ohm/150 Ohm direct coupling method. Application guidance to IEC 61967-4 |
| 03/112147 DC : DRAFT JULY 2003 | IEC 61967-3 ED.1 - INTEGRATED CIRCUITS - MEASUREMENT OF ELECTROMAGNETIC EMISSIONS, 150 KHZ TO 1 GHZ - PART 3: MEASUREMENT OF RADIATED EMISSIONS - SURFACE SCAN METHOD |
| BS EN 61000-4-7 : 2002 | ELECTROMAGNETIC COMPATIBILITY (EMC) - PART 4-7: TESTING AND MEASUREMENT TECHNIQUES - GENERAL GUIDE ON HARMONICS AND INTERHARMONICS MEASUREMENTS AND INSTRUMENTATION, FOR POWER SUPPLY SYSTEMS AND EQUIPMENT CONNECTED THERETO |
| PD IEC/TS 61967-3:2014 | Integrated circuits. Measurement of electromagnetic emissions Measurement of radiated emissions. Surface scan method |
| BS EN 62228-2:2017 | Integrated circuits. EMC evaluation of transceivers LIN transceivers |
| I.S. EN 62132-1:2016 | INTEGRATED CIRCUITS - MEASUREMENT OF ELECTROMAGNETIC IMMUNITY - PART 1: GENERAL CONDITIONS AND DEFINITIONS |
| ISO/IEC/IEEE 8802-3:2017 | Information technology — Telecommunications and information exchange between systems — Local and metropolitan area networks — Specific requirements — Part 3: Standard for Ethernet |
| EN 61967-5:2003 | Integrated circuits - Measurement of electromagnetic emissions, 150 kHz to 1 GHz - Part 5: Measurement of conducted emissions - Workbench Faraday Cage method |
| EN 61967-2:2005 | Integrated circuits - Measurement of electromagnetic emissions, 150 kHz to 1 GHz - Part 2: Measurement of radiated emissions - TEM cell and wideband TEM cell method |
| EN 62433-3:2017 | EMC IC modelling - Part 3: Models of Integrated Circuits for EMI behavioural simulation - Radiated emissions modelling (ICEM-RE) |
| I.S. EN 61967-4:2002 | INTEGRATED CIRCUITS - MEASUREMENT OF ELECTROMAGNETIC EMISSIONS, 150 KHZ TO 1 GHZ - PART 4: MEASUREMENT OF CONDUCTED EMISSIONS - 1 OHM/150 OHM DIRECT COUPLING METHOD |
| CEI EN 61967-2 : 2006 | INTEGRATED CIRCUITS - MEASUREMENT OF ELECTROMAGNETIC EMISSIONS, 150 KHZ TO 1 GHZ - PART 2: MEASUREMENT OF RADIATED EMISSIONS - TEM CELL AND WIDEBAND TEM CELL METHOD |
| 06/30152634 DC : DRAFT JULY 2006 | |
| NF EN 61000-4-7 : 2003 AMD 1 2009 | ELECTROMAGNETIC COMPATIBILITY (EMC) - PART 4-7: TESTING AND MEASUREMENT TECHNIQUES - GENERAL GUIDE ON HARMONICS AND INTERHARMONICS MEASUREMENTS AND INSTRUMENTATION, FOR POWER SUPPLY SYSTEMS AND EQUIPMENT CONNECTED THERETO |
| 09/30191130 DC : DRAFT FEB 2009 | BS EN 61967-8 - INTEGRATED CIRCUITS - MEASUREMENT OF ELECTROMAGNETIC EMISSIONS - PART 8: MEASUREMENT OF RADIATED EMISSIONS - IC STRIPLINE METHOD |
| CEI EN 62228-2 : 1ED 2017 | INTEGRATED CIRCUITS - EMC EVALUATION OF TRANSCEIVERS - PART 2: LIN TRANSCEIVERS |
| DD IEC TS 61967-3 : DRAFT JAN 2006 | INTEGRATED CIRCUITS - MEASUREMENT OF ELECTROMAGNETIC EMISSIONS, 150 KHZ TO 1 GHZ - MEASUREMENT OF RADIATED EMISSIONS - SURFACE SCAN METHOD |
| CEI EN 62433-3 : 1ED 2017 | EMC IC MODELLING - PART 3: MODELS OF INTEGRATED CIRCUITS FOR EMI BEHAVIOURAL SIMULATION - RADIATED EMISSIONS MODELLING (ICEMRE) |
| ECMA/TR 93 : 1ED 2007 | MEASURING EMISSIONS FROM MODULES |
| BS EN 61967-6 : 2002 | INTEGRATED CIRCUITS - MEASUREMENT OF ELECTROMAGNETIC EMISSIONS, 150 KHZ TO 1 GHZ - PART 6: MEASUREMENT OF CONDUCTED EMISSIONS - MAGNETIC PROBE METHOD |
| I.S. EN 61967-8:2011 | INTEGRATED CIRCUITS - MEASUREMENT OF ELECTROMAGNETIC EMISSIONS - PART 8: MEASUREMENT OF RADIATED EMISSIONS - IC STRIPLINE METHOD (IEC 61967-8:2011 (EQV)) |
| I.S. EN 62228-2:2017 | INTEGRATED CIRCUITS - EMC EVALUATION OF TRANSCEIVERS - PART 2: LIN TRANSCEIVERS |
| CEI EN 61967-4 : 2009 | INTEGRATED CIRCUITS - MEASUREMENT OF ELECTROMAGNETIC EMISSIONS, 150 KHZ TO 1 GHZ - PART 4: MEASUREMENT OF CONDUCTED EMISSIONS - 1 OHM/150 OHM DIRECT COUPLING METHOD |
| IEC TS 62239:2008 | Process management for avionics - Preparation of an electronic components management plan |
| BS EN 61967-4 : 2002 | INTEGRATED CIRCUITS - MEASUREMENT OF ELECTROMAGNETIC EMISSIONS, 150 KHZ TO 1 GHZ - PART 4: MEASUREMENT OF CONDUCTED EMISSIONS - 1 OHM/150 OHM DIRECT COUPLING METHOD |
| EN IEC 62969-1:2018 | Semiconductor devices - Semiconductor interface for automotive vehicles - Part 1: General requirements of power interface for automotive vehicle sensors |
| 17/30350017 DC : 0 | BS EN 62228-1 - INTEGRATED CIRCUITS - EMC EVALUATION OF TRANSCEIVERS - PART 1: GENERAL CONDITIONS AND DEFINITIONS |
| CSA CEI/IEC 61000.4.7 : 2003(R2007) | ELECTROMAGNETIC COMPATIBILITY (EMC) - PART 4-7: TESTING AND MEASUREMENT TECHNIQUES - GENERAL GUIDE ON HARMONICS AND INTERHARMONICS MEASUREMENTS AND INSTRUMENTATION, FOR POWER SUPPLY SYSTEMS AND EQUIPMENT CONNECTED THERETO |
| 14/30310470 DC : 0 | BS EN 62228-2 - INTEGRATED CIRCUITS - EMC EVALUATION OF LIN TRANSCEIVERS |
| CEI EN 61967-8 : 2012 | INTEGRATED CIRCUITS - MEASUREMENT OF ELECTROMAGNETIC EMISSIONS - PART 8: MEASUREMENT OF RADIATED EMISSIONS - IC STRIPLINE METHOD |
| BS EN 61967-2:2005 | Integrated circuits. Measurement of electromagnetic emissions, 150 kHz to 1 GHz Measurement of radiated emissions. TEM cell and wideband TEM cell method |
| BS EN 62132-1:2016 | Integrated circuits. Measurement of electromagnetic immunity General conditions and definitions |
| IEC TS 62228:2007 | Integrated circuits - EMC evaluation of CAN transceivers |
| I.S. EN 61967-5:2003 | INTEGRATED CIRCUITS - MEASUREMENT OF ELECTROMAGNETIC EMISSIONS, 150 KHZ TO 1 GHZ - PART 5: MEASUREMENT OF CONDUCTED EMISSIONS - WORKBENCH FARADAY CAGE METHOD |
| I.S. EN 62433-3:2017 | EMC IC MODELLING - PART 3: MODELS OF INTEGRATED CIRCUITS FOR EMI BEHAVIOURAL SIMULATION - RADIATED EMISSIONS MODELLING (ICEM-RE) |
| IEC TS 62239-1:2015 | Process management for avionics - Management plan - Part 1: Preparation and maintenance of an electronic components management plan |
| IEC 61967-5:2003 | Integrated circuits - Measurement of electromagnetic emissions, 150 kHz to 1 GHz - Part 5: Measurement of conducted emissions - Workbench Faraday Cage method |
| IEC 62969-1:2017 | Semiconductor devices - Semiconductor interface for automotive vehicles - Part 1: General requirements of power interface for automotive vehicle sensors |
| PD IEC/TR 61967-1-1:2015 | Integrated circuits. Measurement of electromagnetic emissions General conditions and definitions. Near-field scan data exchange format |
| DD IEC/TS 62239:2003 | Process management for avionics. Preparation of an electronic components management plan |
| BS EN 61967-5:2003 | Integrated circuits. Measurement of electromagnetic emissions, 150 kHz to 1 GHz Measurement of conducted emissions. Workbench Faraday Cage method |
| BS EN 62433-3:2017 | EMC IC modelling Models of integrated Circuits for EMI behavioural simulation. Radiated emissions modelling (ICEM-RE) |
| 07/30163156 DC : 0 | BS EN 62433-2 - MODELS OF INTEGRATED CIRCUITS FOR EMI BEHAVIOURAL SIMULATION - ICEM-CE, ICEM CONDUCTED EMISSION MODEL |
| 12/30268333 DC : 0 | BS EN 62132-1 - INTEGRATED CIRCUITS - MEASUREMENT OF ELECTROMAGNETIC IMMUNITY - PART 1: GENERAL CONDITIONS AND DEFINITIONS |
| IEC TR 61967-1-1:2015 | Integrated circuits - Measurement of electromagnetic emissions - Part 1-1: General conditions and definitions - Near-field scan data exchange format |
| IEC TS 61967-3:2014 | Integrated circuits - Measurement of electromagnetic emissions - Part 3: Measurement of radiated emissions - Surface scan method |
| IEEE 802.3-2012 | IEEE Standard for Ethernet |
| NF EN 61967-4 : 2002 AMD 1 2006 | INTEGRATED CIRCUITS - MEASUREMENT OF ELECTROMAGNETIC EMISSIONS, 150 KHZ - 1 GHZ - PART 4: MEASUREMENT OF CONDUCTED EMISSION - 1 OHM/150 OHM DIRECT COUPLING METHOD |
| IEC 62228-1:2018 | Integrated circuits - EMC evaluation of transceivers - Part 1: General conditions and definitions |
| EN 61967-6:2002/A1:2008 | INTEGRATED CIRCUITS - MEASUREMENT OF ELECTROMAGNETIC EMISSIONS, 150 KHZ TO 1 GHZ - PART 6: MEASUREMENT OF CONDUCTED EMISSIONS - MAGNETIC PROBE METHOD |
| 17/30365636 DC : 0 | BS EN 62239-1 ED.1.0 - PROCESS MANAGEMENT FOR AVIONICS - MANAGEMENT PLAN - PART 1: PREPARATION AND MAINTENANCE OF AN ELECTRONIC COMPONENTS MANAGEMENT PLAN |
| PD IEC/TS 62239-1:2015 | Process management for avionics. Management plan Preparation and maintenance of an electronic components management plan |
| IEC 61967-2:2005 | Integrated circuits - Measurement of electromagnetic emissions, 150 kHz to 1 GHz - Part 2: Measurement of radiated emissions - TEM cell and wideband TEM cell method |
| IEC 62433-3:2017 | EMC IC modelling - Part 3: Models of integrated circuits for EMI behavioural simulation - Radiated emissions modelling (ICEM-RE) |
| IEC 62132-1:2015 | Integrated circuits - Measurement of electromagnetic immunity - Part 1: General conditions and definitions |
| IEC 61967-4:2002+AMD1:2006 CSV | Integrated circuits - Measurement of electromagnetic emissions, 150 kHz to 1 GHz - Part 4: Measurement of conducted emissions - 1 Ω/150 Ω direct coupling method |
| IEC 61967-6:2002+AMD1:2008 CSV | Integrated circuits - Measurement of electromagnetic emissions, 150 kHz to 1 GHz - Part 6: Measurement of conducted emissions - Magnetic probe method |
| EN 61967-8 : 2011 | INTEGRATED CIRCUITS - MEASUREMENT OF ELECTROMAGNETIC EMISSIONS - PART 8: MEASUREMENT OF RADIATED EMISSIONS - IC STRIPLINE METHOD |
| I.S. EN 61967-6:2003 | INTEGRATED CIRCUITS - MEASUREMENT OF ELECTROMAGNETIC EMISSIONS, 150 KHZ TO 1 GHZ - PART 6: MEASUREMENT OF CONDUCTED EMISSIONS - MAGNETIC PROBE METHOD |
| 16/30336986 DC : 0 | BS EN 62969-1 - SEMICONDUCTOR DEVICES - SEMICONDUCTOR INTERFACE FOR AUTOMOTIVE VEHICLES - PART 1: GENERAL REQUIREMENTS OF POWER INTERFACE FOR AUTOMOTIVE VEHICLE SENSORS |
| DD IEC/TS 62228:2007 | Integrated circuits. EMC evaluation of CAN transceivers |
| I.S. EN 61967-2:2005 | INTEGRATED CIRCUITS - MEASUREMENT OF ELECTROMAGNETIC EMISSIONS, 150 KHZ TO 1 GHZ - PART 2: MEASUREMENT OF RADIATED EMISSIONS - TEM CELL AND WIDEBAND TEM CELL METHOD |
| IEC TR 61967-4-1:2005 | Integrated circuits - Measurement of electromagnetic emissions, 150 kHz to 1 GHz - Part 4-1: Measurement of conducted emissions - 1 Ω/150 Ω direct coupling method - Application guidance to IEC 61967-4 |
| IEC TR 62014-3:2002 | Electronic design automation libraries - Part 3: Models of integrated circuits for EMI behavioural simulation |
| EN 61967-4 : 2002 COR 2017 | INTEGRATED CIRCUITS - MEASUREMENT OF ELECTROMAGNETIC EMISSIONS, 150 KHZ TO 1 GHZ - PART 4: MEASUREMENT OF CONDUCTED EMISSIONS - 1 OHM/150 OHM DIRECT COUPLING METHOD (IEC 61967-4:2002/COR1:2017) |
| IEC 62228-2:2016 | Integrated circuits - EMC evaluation of transceivers - Part 2: LIN transceivers |
| IEC 61967-8:2011 | Integrated circuits - Measurement of electromagnetic emissions - Part 8: Measurement of radiated emissions - IC stripline method |
| EN 62132-1:2016 | Integrated circuits - Measurement of electromagnetic immunity - Part 1: General conditions and definitions |
| EN 62228-2:2017 | Integrated circuits - EMC evaluation of transceivers - Part 2: LIN transceivers |
| IEC 61967-2:2005 | Integrated circuits - Measurement of electromagnetic emissions, 150 kHz to 1 GHz - Part 2: Measurement of radiated emissions - TEM cell and wideband TEM cell method |
| IEC 61967-5:2003 | Integrated circuits - Measurement of electromagnetic emissions, 150 kHz to 1 GHz - Part 5: Measurement of conducted emissions - Workbench Faraday Cage method |
| IEC 61000-4-6:2013 | Electromagnetic compatibility (EMC) - Part 4-6: Testing and measurement techniques - Immunity to conducted disturbances, induced by radio-frequency fields |
| CISPR 25:2016 | Vehicles, boats and internal combustion engines - Radio disturbance characteristics - Limits and methods of measurement for the protection of on-board receivers |
| IEC 61967-4:2002+AMD1:2006 CSV | Integrated circuits - Measurement of electromagnetic emissions, 150 kHz to 1 GHz - Part 4: Measurement of conducted emissions - 1 Ω/150 Ω direct coupling method |
| IEEE C63.2-2009 | American National Standard for Electromagnetic Noise and Field Strength Instrumentation, 10 Hz to 40 GHz Specifications |
| IEC 61000-4-3:2006+AMD1:2007+AMD2:2010 CSV | Electromagnetic compatibility (EMC) - Part 4-3: Testing and measurement techniques - Radiated, radio-frequency, electromagnetic field immunity test |
| IEC 61967-6:2002+AMD1:2008 CSV | Integrated circuits - Measurement of electromagnetic emissions, 150 kHz to 1 GHz - Part 6: Measurement of conducted emissions - Magnetic probe method |
| CISPR 16-1:1999+AMD1:2002 CSV | Specification for radio disturbance and immunity measuring apparatus and methods - Part 1: Radio disturbance and immunity measuring apparatus |
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